search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
October, 2017


www.us-tech.com


Beltsville, MD — DfR Solutions has released version 5.3 of its Sherlock Automated Design Analysis™ soft- ware. A major new feature is thermo- mechanical analysis. This advanced new capability captures system-level effects on solder joint reliability dur- ing temperature cycling. Thermal issues are at the root


of many product failures in today’s electronic designs. Products are more complex, smaller, require more power, and operate in more extreme environments than ever before. The more complex the design, the greater the thermal strain on the compo- nents. To help reduce this risk and create more reliable products, elec- tronics manufacturers conduct time consuming and costly thermome- chanical analyses on their devices. Sherlock Automated Design


Analysis software uses a physics of failure approach to indicate when thermal temperatures are too hot for integrated circuits and solder joints. The new thermomechanical capabili- ty in version 5.3 enables users to quickly and easily run thermome- chanical analyses directly in Sher- lock, eliminating time-consuming data entry. This provides more accu- rate thermal profiles of product de- signs, especially early on in product development. Sherlock’s thermome-


WEETECH Intros High Voltage Test System


Gumee, IL — WEETECH has intro- duced the latest member of its family of high-voltage test systems. The W 484 test system has been developed specifically for products in the fast growing e-mobility industry. This new tester meets the guide-


lines of LV 123, a multi-company standard for requirements and test- ing of high-voltage wire harnesses and components for electric vehicles or hybrids. The compact and scalable W


484 tester, which includes the com- pany’s new HVG 4300 generator, provides up to 4,300 VDC and 3,000 VAC with up to 4 mA. The voltages are not dangerous to touch, according to DIN EN 50191, because of current limitation. It is available with three different housings, offering 44 to 792 test points — either portable or rolling. It provides precise continuity test in the µW range and offers arc detection by voltage and slew rate recognition as well as a programma- ble dI/dt detector. The company’s product portfolio


consists of test systems that are used to ensure the electric connection and functionality in the production of cable harnesses, as well as electrical compo- nents and subassemblies. WEET- ECH’s products are used in a range of applications across the automotive,


aerospace and railway industries. Contact: WEETECH, Inc., 1300


Skokie Highway, Gumee, IL 60031 % 847-775-7240


E-mail: info@weetech-usa.com Web: www.weetech-usa.com


See at productronica, Hall A2 Booth 354


chanical analysis enables design im- provement by changing component


type, material parameters, and lay- out, to minimize loads during ther-


Page 37 DfR Solutions Releases Sherlock Version 5.3


mal expansion. Understanding the interaction of mounting points and components during thermal expan- sion ensures a more reliable PCB lay- out under thermomechanical stress. Other new Sherlock 5.3 features


include: increased parts library cus- tomizability for more efficient parts review; a revised QFN solder fatigue model; a new help feature; a new user tab; expanded part library capa- bilities; semiconductor wear-out analysis; and GUI changes to im-


prove overall user-friendliness. Contact: DfR Solutions, 9000


Sherlock Automated Design Analysis software version 5.3.


Virginia Manor Road, Suite 290, Beltsville, MD 20705 % 301-474- 0607 E-mail: sales@dfrsolutions.com Web: www.dfrsolutions.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124