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www.us-tech.com
May, 2017
Speedprint Delivers Screen Printer to Micro Analog
Tampa, FL — Micro Analog, Inc., (MAI) has installed a new SP710 screen printer from Speedprint Technologies, bringing the total number of 700 series machines in the company’s La Verne, California, facility to six. The latest machine joins an
existing SP710 machine and four SP700 platforms — Speedprint’s largest installation in the U.S. All 700 series machines contain dual roving cameras for accuracy and are covered by the company’s five-year warranty. MAI offers a full spectrum of
electronics manufacturing services from fast-turn prototyping, high- mix/low-volume solutions to full-scale low-mix/high-volume production runs. To cope with frequent product
changeovers in high-mix applica- tions, contract manufacturers need agility and total reliability from their production systems, as well as dependable support expertise from equipment vendors. MAI chose to invest in Speed -
print to expand capacity based on proven production performance and
SP710 screen printer. Contact: Speedprint, 519 US
Highway 301 South, Tampa, FL 33619 % 813-664-0686 E-mail:
mark.brawley@
speedprint-tech.com Web:
www.speedprint-tech.com
See at SMT Hybrid Packaging, Booth 4-251
Indium Exhibits Versatile Halogen-Free Solder Paste
See at EWPTE, Booth 1917
Clinton, NY — Indium Corporation is now offering its Indium8.9HF solder paste, a no-clean, halogen-free paste designed to provide stability and ver- satility during the printing process. Under optimal process conditions, the paste demonstrates printing per- formance for up to 12 months when refrigerated, maintains printing and reflow performance after remaining at room temperature for one month, and delivers excellent response-to- pause even after being left on the stencil for up to 60 hours. The company has specifically
Neu Dynamics Corp is an ISO 9001:2008 certified Tool, Mold and Die man- ufacturer
specializing in tooling and equipment used in building
Semiconductors, Electronics, components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications. We further offer small to medium volume contract molding services for
microelectronic packages such as BGA, QFN, MLP, optical components etc. We also have capability to provide insert molding services for items such as connectors.
CONTRACT MOLDING OVERMOLDING TOOLING
Phone 215-355-2460 CUSTOM MACHINING
MOLD DESIGN AND FABRICATION
WWW.NEUDYNAMICS.COM SALES@NEUDYNAMICS.COM
Fax 215-355-7365
formulated the new paste to signifi- cantly reduce voiding well below the industry average for improved fin- ished goods reliability. Indium8.9HF delivers robust reflow capabilities and has a wide processing window to accommodate various board sizes and throughput requirements and to minimize defects. The paste has a
special oxidation barrier technology that suits it for a variety of applica- tions, especially in automotive elec- tronics assembly.
the company’s excellent reputation for service.
Indium8.9HF solder paste. Contact: Indium Corp., 34
Robinson Road, Clinton, NY 13323 % 315-381-7524
E-mail:
abrown@indium.com Web:
www.indium.com
See at SMT Hybrid Packaging, Booth 4-321
KEMET Intros MLCCs with Tin/Lead Terminations
NDC International offers specialized equipment built for today's high-tech semiconductor assembly processes.
HANMI SEMICONDUCTOR
MPP MANUAL WIRE BONDERS
K&S CAPILLARIES K&S DICING BLADES
MASTER MACHINERY CUSTOM AUTOMATION RGT WAFER FRAMES
RGT MANUAL WAFER MOUNTER
WWW.NDC-INT.COM
Simpsonville, SC — KEMET Corpor - ation has expanded its KEMET Power Solutions (KPS) multilayer ceramic capacitor (MLCC) product line to include a tin/lead termination option. Available in EIA 1210 and 2220 case sizes, KPS “L” termination commercial capacitors are designed for defense, avionic and industrial applications that require a robust termination system to mitigate the growth of tin whiskers. KPS uses a proprietary lead-
frame technology to stack one or two MLCCs in a parallel circuit configu- ration in a single, compact surface mount package. The attached lead- frame mechanically isolates the capacitors from the PCB, reducing mechanical and thermal stress.
Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. The two-chip stack provides up to double the capacitance when com- pared with conventional surface mount MLCC devices. Typical applications include
smoothing circuits, DC-DC convert- ers, power supplies, and noise reduc- tion circuits with a direct battery or power source connection. The capaci- tors are also useful for applications that are subjected to board flexing or
temperature cycling. Contact: KEMET Electronics,
2835 Kemet Way, Simpsonville, SC 29681 % 864-963-6300 fax: 864-228- 4242 Web:
www.kemet.com
See at EDS, Suite 15-046
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