May, 2017


www.us-tech.com Standalone JTAG Test and Programming Solutions Continued from previous page


dard boundary scan ports (TAPs) along with 64 multifunctional I/O channels. Eight of the 64 channels can be used to provide both analog and digital functionality. Besides digital stimulus and response meas- urements, a number of multifunc- tional digital I/Os enable frequency and pulse width measurements, and one of them can function as a pro- grammable clock generator. Also, the FPGA technology at the core of the JT 5705/FXT module’s I/O system can be reconfigured for custom appli- cations.


JTAG offers a standard break-


out board that can be used with any fixture. For cassette-based fixtures, also referred to as interchangeable fixtures, specific carrier boards pro- vide the basis for integration. In those cases, the carrier board is mounted directly to the cassette in- terface section of the base unit. The target board connects with a board- specific cassette, or replacement kit, which can be interchanged quickly


PCi Purchases Keyence Dimensional Measurement System


Minneapolis, MN — Rigid flex circuit board manufacturer Printed Cir- cuits, Inc. (PCi) has purchased an IM-6225 instant measurement sys- tem from Keyence. The machine of- fers high-speed, accurate dimension- al measurements in a small format that is well-suited to measure flex and rigid PCBs. According to the company, the


Keyence unit brings a combination of high speed, high accuracy and ease- of-use that is difficult to find in a sin- gle machine. The Keyence system has a field of view that is not dis-


and easily. JTAG’s carrier boards may con-


tain switches to facilitate dynamic routing of 64 different test points on the target board. These may be rout- ed to different controller I/O chan- nels as well as to pull-up and pull- down resistors on the carrier board. These switches are software-con- trolled so that digital, analog and pull-up or pull-down measurements can be performed with one board on up to 64 test points as needed. The combination of a carrier


board and the JT 5705 offers more than conventional boundary scan testing. It makes the testing of both analog and digital peripherals on a


typical circuit board and checking one or more operating voltages prior to boundary scan straightforward and effortless. Overall, these solu- tions are designed to offer new possi- bilities and maximum test coverage with improved diagnostics. JTAG’s ProVision software


suite is used to develop the boundary scan test and in-system program- ming applications. Automatic test generators and analysis tools create infrastructure, interconnect, logic cluster, and memory connection tests, which make use of the system’s multifunctional I/O. The ProVision sequencer can be used to easily de- fine a test and in-system program-


ming workflow. When using TestStand or Lab-


View, these features are supported by JTAG’s production integration packages (PIPs). LabView or Test- Stand packages, along with JTAG functional test, provide cost-effective entry points for those who wish to combine functional and boundary scan testing to increase overall board test coverage, while improving diag- nostic capabilities. Contact: JTAG Technologies,


Inc., 111 N West Street, Suite A, Easton, MD 21601 % 410-770-4415 fax: 410-770-4774 E-mail: info@jtag.com Web: www.jtag.com r


Page 51


The heat-conducting SEMICOSIL®


ELECTRONICS AND ELECTRICAL DEVICES. By Mr. William Russell, WACKER Marketing Manager


Under the trade name SEMICOSIL® 961


TC, which offers thermal conductivity of 2.0 W/mK, WACKER expands its thermally conductive silicone portfolio by introducing a new gap filler material for electronics and electrical device applications. The constantly increasing demand for heat dissipation between two substrates with high tolerances requires a thermally conductive gap filler material which is easy and cost effective to process, durable and effectively protects functionality.


These applications include:


• Automotive and transport electronics • Electric and hybrid electric batteries (cell potting)


• Power electronics • Consumer electronics


SEMICOSIL® 961 TC is a highly filled,


two-part silicone rubber that cures at room temperature via a platinum- catalyzed addition reaction to form a soft silicone elastomer. The cured rubber achieves a thermal conductivity of two watts per meter kelvin (2.0 W/mK) and, at the same time, is electrically insulating.


Before it cures, SEMICOSIL® 961 TC


is a non-sag material. However, its viscosity decreases with increased shearing; for example, during mixing and metering. Its shear-thinning properties allow the silicone rubber to be easily dispensed in bead form using standard dosing equipment. The high shear-thinning characteristic also ensures very high dosing accuracy, along with increased dispensing speeds compared to similar products currently in the market.


Notable material features and benefits:


• Cures at room temperature or faster at elevated temperatures


• Faster cycle times • Low volatile content (<350 ppm) • UL 94 V-0 rating (WACKER test result)


• Constant properties between -50 °C and +180 °C after cured


• Electrically insulative • Very good vibration dampening


• High thermal and thermal-shock resistance


• Improved service life of mixing and metering equipment due to low abrasion


Keyence IM-6225 instant dimensional measurement system.


tracted by 3D surfaces, making it good for complex flex and rigid sur- face measurements. The machine can take up to 100 measurements si- multaneously in less than two sec- onds, which makes it a valuable ad- dition to the company’s quality as- surance department. Contact: Printed Circuits, Inc.,


1200 W 96th Street, Minneapolis, MN % 952-888-7900 fax: 952-888-2719 E-mail: bburns@printedcircuits.com Web: www.printedcircuits.com


A SEMICOSIL® 961 TC ensures optimum B


A: Optimized dispensability for faster cycle times B: Available packaging: pails and carts C: Processability validated with reputable equipment manufacturers


C


heat transfer from the electrical circuit to a heat sink. The gap filler material is first applied to the heat sink. The circuit board is then pressed onto the heat sink or fitted by means of a vacuum process. During compression, a continuous film forms that conforms securely to the surfaces of the two adjoining parts. In this way, surface irregularities and tolerances can be perfectly evened out. Furthermore, the film surface area maximizes the contact of the two adjoining parts and thus enhances heat transfer properties.


961 TC silicone


filler from WACKER is applied directly to the heat sink. Once the electrical circuit is pressed on, the gap filler cures to form a soft, cushioning silicone layer that optimally transfers heat to the heat sink.


Thanks to its soft consistency, SEMICOSIL®


961 TC ensures a reliable,


tight fit even if there are frequent temperature changes and vibrations. SEMICOSIL®


961 TC can be used


over a wide temperature range as its properties remain unchanged between -50 °C and +180 °C. High thermal and thermal-shock resistance and the ability to absorb vibrations are important performance factors for applications in automotive electronics and other sensitive electronic devices.


SEMICOSIL® 961 TC is a two-


component system that offers nearly identical viscosities for each of the two components to minimize waste often associated with mixing two- component materials with vastly dissimilar viscosities. Despite its high filler loading, it has a comparatively minor abrasive effect on the mixing and metering equipment used to apply it. This means there is less abrasive damage to feed pumps, for example, than is usually the case with highly filled silicone rubber. Consequently, significantly longer service lives of mixing and metering equipment and major cost advantages in processing are possible.


The new SEMICOSIL® 961 TC silicone


rubber gap filler material contains hardly any volatile components. In terms of fire-safety properties, tests show that the silicone product meets the specifications for classification V-0 as per UL 94 of Underwriters Laboratories.


For further information about SEMICOSIL®


961 TC thermally


conductive 2.0 W/mK gap filler material, contact info.usa@wacker.com or phone 888 922 5374 and speak with a WACKER Technical Service Manager. To download a product information sheet: www.wacker.com/semicosil


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