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hi-TeCh evenTS
www.us-tech.com Steve Wozniak Shares Insight at MD&M East
Santa Monica, CA — UBM is hosting cofounder of Apple and chief scientist at Primary Data, Steve “Woz” Wozniak, who will take the stage on June 13 for a keynote event at UBM’s New York trade show and conference. At the advanced design and
manufacturing event, the cult icon will discuss a range of topics that span his experience at Apple, as well as today’s leading tech trends such as robotics, IoT, wearables, and big
data, among others. UBM’s advanced design and manufacturing event will be held June 13-15 at the Jacob K. Javitz convention center in New York City. The event comprises six expos presented alongside one anoth- er, including Automation Technology Expo (ATX) East, Design & Manufacturing (D&M) Atlantic, EASTPACK, Medical Design & Manufacturing (MD&M) East, PLASTEC East, and Quality Expo.
Nanotechnology in Packaging
Highlighted at ICSR Markham, Ontario, Canada — The International Conference on Soldering and Reliability (ICSR) is a highly-technical, three-day event where attendees gather to share their knowledge on topics including solder R&D, solder joint reliability, technology trends, contamination and cleanliness testing, failure modes and mitigation, and defect detection. Held from June 6-8 at Edward
Village Markham in Toronto, high- lights of the event include keynote presentations by Charles E. Bauer, PhD, senior managing director of TechLead Corp., and Jasbir Bath of Bath Consultancy LLC/Koki Solder. Dr. Bauer’s keynote talk is enti-
tled “Nanotechnology in Electronics Packaging, Interconnect and Assembly: Hype or Reality?” While often exaggerated and over-prom- ised, nanotechnology now provides vital performance enhancements to electronic systems after more than a decade of R&D. Advanced solders and adhe-
sives pioneered nanotech adoption by electronics manufacturers by minimizing technical risk and mask- ing their nanotechnological nature through drop-in alternatives. Hype gives way to breakthrough as new nanotech solutions address multiple aspects of packaging, interconnect and assembly. Leading nanotech contributions
today include surface finishes for stencils and tin whisker mitigation, adhesives, die attach and solder replacements, via structures, addi- tive circuit formation and 3D print- ing, novel conductors and dielectrics, and passive components. Jasbir Bath will focus his pres-
entation on the importance of design to improve manufacturing process yield and reliability. The importance of board pad design and stencil aper- ture design can be overlooked in the rush to assembly products in a time- ly manner. The presentation will discuss
how optimizing board pad design Continued on next page
2017 ISSUE Jan/Feb March April/May EDITORIAL
Production & Packaging Electronics West/MDM PP APEX PP APEX
Test & Measurement ATX Midwest PP
SMT & Production Nepcon China PP SMT/Hybrid/PKG PP EDS PP
June July August
Components & Distribution ATX East /MDM PP Test & Automation
Semicon West/Intersolar PP
Production & Packaging Nepcon South China PP
September PCB & Automation SMTAI PP
Nepcon South China
Autotestcon WESTEC
PCB West SMTAI IMAPS
October
Assembly & Production Productronica PP
The Assembly Show South-Tec FABTECH
MDM Minneapolis Productronica
Nov/Dec
Components & Distribution Electronics West/MDM PP
PP= Product Preview ATX/ Electronics West/ Aug. 29-31
Sept. 12-14 Sept. 12-14 Sept. 13-15 Sept. 19-20 Oct. 10-12
Oct. 24-26 Oct. 24-26 Nov. 7-9 Nov. 8-9 Nov. 14-17 Feb. 13-15
Shenzhen, China
Schaumburg, IL Los Angeles, CA Santa Clara, CA Rosemont, IL Raleigh, NC
Rosemont, IL Greenville, SC Chicago, IL
Minneapolis, MN Munich, Germany Anaheim, CA
SHOW DesignCon
ATX/ Electronics West/MDM APEX
APEC ATX Midwest
Nepcon China ESC
Wire Processing Tech SMT/Hybrid/PKG Eastec EDS
ATX East /MDM SEMICON West/Intersolar
EDITORIAl CAlENDAR DATE
LOCATION
Jan. 31-Feb. 2 Feb. 7-9 Feb. 14-16
March 28-30 March 29-30
April 25-27 May 3-4 May 11-12 May 16-18 May 16-18 May 16-19 June 13-15
July 11-13
Santa Clara, CA Anaheim, CA San Diego, CA
Tampa, FL Cleveland, OH
Shanghai, China Boston, MA Milwaukee, WI
Nuremberg, Germany Las Vegas, NV New York, NY
San Francisco, CA “I am really looking forward to
speaking at UBM’s event in New York. This seems to be the conference when it comes to innovation and design within the manufacturing field,” said Wozniak. “During my ses- sion on June 13, I look forward to offering insight into emerging trends in technology and how those may impact design and manufacturing.” Steve Wozniak has helped
shape the computing industry with his design of Apple’s first line of products, the Apple I and II. He began his career in 1976, when he and Steve Jobs famously founded
Apple Computer with Wozniak’s Apple I personal computer. The fol- lowing year, Wozniak introduced his Apple II personal computer, which was integral in launching the person- al computer industry. In 1985, Wozniak was awarded the National Medal of Technology by the President of the United States for his achievements at Apple, which is con- sidered the highest honor given to America’s leading innovators. Contact: UBM Canon, 2901
28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.ubmcanon.com
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
April 25-27, 2017, Nepcon China. * Shanghai World EXPO Exhibition and Convention Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21- 2231-7181 E-mail:
tim.wang@
reedexpo.com.cn Web:
www.nepconchina.com
May 3-4, 2017, Design & Manufacturing New England. * Boston Convention & Exhibition Center, Boston, MA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.ubmcanon.com
May 11-12, 2017, Electrical Wire Processing Tech Expo. * Wisconsin Center,
Milwaukee, WI. Contact: Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500 E-mail:
cheryl@epishows.com Web:
www.epishows.com
May 16-18, 2017, Eastec. *Eastern States Exposition, West Springfield, MA. Contact: SME, One SME Drive, Dearborn, MI 48128 % 313-425-3000 E-mail:
service@sme.org Web:
www.sme.org
May 16-18, 2017, SMT/Hybrid/Packaging.* Nuremberg Exhibition Centre, Nuremberg, Germany. Contact: Mesago Messe Frankfurt GmbH, Rotebuehlstrasse 83-85, D-70178 Stuttgart, Germany % +49-711-61946-0 fax: +49-711-61946-91 E-mail:
smt@mesago.com Web:
www.smthybridpackaging.com
May 16-19, 2017, EDS. * The Mirage Las Vegas, Las Vegas, NV. Contact: EDS, 1111 Alderman Drive, Suite 400, Alpharetta, GA 30005 % 312-648-1140 fax: 312-648-4282 E-mail:
eds@edsconnects.com Web:
www.edsconnects.com
May 24, 2017, Creative Storage Conference. * DoubleTree Hotel, Culver City, CA.
Contact: Entertainment Storage, 1665 Willomont Avenue, San Jose, CA 95124 % 408-202-5098 E-mail:
info@creativestorage.org Web:
www.creativestorage.org
June 6-8, 2017, International Conference on Soldering and Reliability (ICSR). * Edward Village Markham, Markham, Ontario, Canada. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 Web:
www.smta.org
June 13-15, 2017, MD&M East. * Jacob K. Javits Convention Center, New York, NY. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.mdmeast.mddionline.com
June 27-28, 2017, SMTA Symposium on Counterfeit Parts and Materials. * College Park Marriott Hotel and Conference Center, Hyattsville, MD. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 Web:
www.smta.org
June 27-29, 2017, IMAPS System in Package (SiP) Technology.*Doubletree Sonoma Wine Country, Sonoma, CA. Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000 E-mail:
modonoghue@imaps.org Web:
www.imaps.org
July 11-13, 2017, SEMICON West.*Moscone Center, San Francisco, CA. Contact: SEMI, 3081 Zanker Road, San Jose, CA 95134 % 408-943-6900 fax: 408-428-9600 E-mail:
semihq@semi.org Web:
www.semi.org
August 29-31, 2017, NEPCON South China.*Shenzhen Convention & Exhibition Center, Shenzhen, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231- 7181
tim.wang@
reedexpo.com.cn Web:
www.nepconsouthchina.com
September 12-14, 2017, WESTEC. * Los Angeles Convention Center, Los Angeles, CA. Contact: SME, 1 SME Drive, Dearborn, MI 48128 % 800-733-4763 E-mail:
service@sme.org Web:
www.sme.org
September 12-14, 2017, PCB West. * Santa Clara Convention Center, Santa Clara, CA. Contact: UP Media Group, Inc., P.O. Box 470, Canton, GA 30169 % 678-234-9859 Web:
www.pcbwest.com
September 19-20, 2017, SMTA International.*Donald E. Stephens Convention Center,
Rosemont, IL. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web:
www.smta.org
May, 2017
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