May, 2017
www.us-tech.com
Acton, MA — CAMI Research is host- ing a seminar and professional devel- opment session at the Wire Proces - sing Technology Expo in Milwaukee, Wisconsin. The sessions will be held on Tuesday, May 9.
The first hour-long seminar will
begin at 10:30 AM and be presented by Christopher E. Strangio, presi- dent and founder of CAMI Research. The complimentary seminar will cover test documentation, data secu- rity, real-time screening for intermit- tent connections, automatic script- ing, barcode tracking and archival data logging, and other topics. A three-hour training session,
beginning at 1:00 PM will also be pre- sented by Strangio. Some of the vari- ety of topics to be discussed include basic tester functions, cable resistance
HTV Offers Wide Range of Component Services
Bensheim, Germany — Halbleiter Test & Vertriebs (HTV) offers a wide variety of electronic component serv- ices that include testing, program- ming, long-term conservation and storage, analytics, and processing. Services include: TAB® (thermal absorptive gas barrier) long-term conservation and storage of electron- ic components — up to 50 years; HTV-revive®, the removal of oxida-
CAMI Research professional development seminar.
limits, automating tests, production testing for test technicians, data secu-
rity, and diagnostic tools. As an exhibitor at the show, the
Page 93 CAMI Hosts Continuity and Hipot Testing Seminar
company is focusing on the ease of use and flexibility of its CableEye® cable and harness test systems. Visitors will be able to get hands-on experience with the company’s cable and harness test systems, including low- and high-voltage (hipot) testers, and to explore the CableEye inter- face and reports. These reports are multilingual, dynamic, graphic-rich,
and offer a wealth of information. Contact: CAMI Research, Inc.,
42 Nagog Park, Suite 115, Acton, MA 01720 % 978-266-2655 fax: 978-266-2658 E-mail:
info@camiresearch.com Web:
www.camiresearch.com
See at EWPTE, Booth 1909
A
An HTV technician performs a solderability test.
tion and impurities on component connections; HTV-novaTIN®, a high- ly-durable re-tinning process for elec- tronic components; and HTV-OTP- Alive, the erasing and reprogram- ming of OTP components. The company also provides com-
prehensive test and analytical servic- es through its HTV-Institute for Materials Analysis, including quality control, failure analysis and the detection of component manipula- tion. HTV’s Academy also offers cross-disciplinary and subject-specif- ic training courses, such as IPC-A- 600/610 training as a certified IPC specialist (CIS). MAF, HTV’s subsidiary, also
provides packaging for electronic components. In addition to pre-mold packages and the packaging of series production quantities, the company can separate wafers into several dice and package them for specific appli-
cations as needed. Contact: Halbleiter Test &
Vertriebs GmbH, Robert Bosch Strasse 28, D-64625 Bensheim, Germany % +49-0-6251-84-800-0 fax: +49-6251-84-800-49 E-mail:
info@htv-gmbh.de Web:
www.htv-gmbh.de
See at SMT Hybrid Packaging, Booth 4-549
COMPATIBILITY O
THE GAME CHANGERS. Temperature Stable solder pastes
LOCTITE®
free solder paste and its water-washable counterpart, LOCTITE GC 3W, deliver unprecedented transport, storage and process performance.
Building on the success of LOCTITE® LOCTITE®
benefits of its no-clean predecessor.
Learn more about what these materials have already done for leading electronics manufacturers and how they can reduce cost of ownership and raise yield.
For more information, contact 1-800-562-8483 or visit us online at
www.henkel.com/electronics
GC 10 solder paste, the Henkel team has developed GC 3W, a water soluble material with many of the same storage and performance game-changing solder pastes – LOCTITE GC 10 temperature stable, no-clean, lead- M Product
All marks used above are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S., Germany and elsewhere. © 2014 Henkel Corporation. All rights reserved. 4275 (2/16)
See at SMT Hybrid Packaging, Booth 4-241
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