Page 90
www.us-tech.com
Tampa, FL — Europlacer has suc- cessfully installed its IINEO-II place- ment platform at PPI/Time Zero’s facility in Fairfield, New Jersey, and an IICO placement platform and EP710 screen printer at the compa- ny’s New England facility. The New Jersey installation delivers extensive capability while the New England installation is a second-line produc- tivity solution. By having two of the company’s
facilities running Euro placer’s plat- forms, it provides PPI/Time Zero with a robust continuity plan. The equip- ment enhances the company’s ability to perform rapid changeovers and to substantially increase throughput. The company selected a compre-
May, 2017 PPI/Time Zero Installs Europlacer Systems
hensive machine configuration for the New Jersey site that include integrat- ed electrical test, a suite of hardware and software tools that enable rapid changeover, and intelligent technology to deliver high first-pass yields. With additional facilities in
Virginia, PPI/Time Zero focuses on servicing the military, aerospace, medical, industrial control, and
instrumentation markets. Contact: Europlacer Americas,
519 US Highway 301 South, Tampa, FL 33619 % 813-246-9500 E-mail:
john.perrotta@
europlacer.com Web:
www.europlacer.com
Europlacer EP710 screen printer and IICO placement platform.
See at SMT Hybrid Packaging, Booth 4-251 and at
NEPCON China, Booth 1J40 The standard for the Internet of Manufacturing (IoM) has arrived!
Henkel Offers Adhesive for Automotive Electronics
Irvine, CA —Henkel’s electrically con- ductive adhesive (ECA), LOCTITE ABLESTIK ICP 3535M1, has been formulated as a robust alternative to solder for many applications, and has recently been adopted by the automo- tive industry. For use with a diverse range of components, the material lowers component assembly stress and facilitates lead-free interconnec- tion for regulatory compliance. The material’s reliability makes
it attractive for use in automotive applications. Internal and customer qualification testing have confirmed the material’s stable contact resist- ance and mechanical integrity after 3,000 hours of temperature and humidity testing, 3,000 cycles of thermal shock evaluation and 3,000 hours of heat storage. Excellent performance on smal -
The Open Manufacturing Language (OML) is a real-time communication standard for PCBA manufacturing that defines the interconnectivity of assembly production processes and enterprise IT systems.
For the first time, IT teams, solution providers, and equipment providers can easily integrate shop-floor data to create manufacturing execution solutions based on a single, normalized, vendor-neutral communication interface.
ler components also underscores LOCTITE ABLESTIK ICP 3535M1’s effectiveness for the reduction of defects. Evaluation of the material on 0402 components demonstrated zero bridging or wicking, and the material is equally effective on larger devices such MOSFETs. While the material has enjoyed
early success in the automotive sec- tor, its versatility extends to any application where low and stable contact resistance, low-stress assem- bly, regulatory compliance and cost- effectiveness are required. Where other ECAs are unable
Take part in shaping the future!
Become a member of the OML Community where PCB Assembly industry professionals have FREE full access to the OML Specification, white papers written by industry experts, and share ideas in our community forum.
Visit
http://www.omlcommunity.com and join the community!
to cope with non-noble metals on component terminations, LOCTITE ABLESTIK ICP 3535M1 succeeds in delivering performance and reliabili- ty on traditional palladium silver-, silver- gold-finished, and tin-termi- nated components. Applications within the aero-
space, wireless datacom, security and lighting sectors will also benefit from the material’s flexibility, relia-
bility and cost-reducing features. Contact: Henkel Electronic
Materials LLC, 14000 Jamboree
Road, Irvine, CA 92606 % 714-368-8000 E-mail:
doug.dixon@henkel.com Web:
www.henkel-adhesives.com
See at SMT Hybrid Packaging, Booth 4-241
See at NEPCON China, Booth 1E23, SMT Hybrid Packaging, Booth 4-451 and at EWPTE Booth 1421
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116
