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How does it solve the problem? Today’s new power devices require new and innovative techniques for accurate test and characterization. The Agilent Technologies B1505A meets all the requirements for high current high voltage and medium current measurement at high voltage bias. With its next generation curve tracer architecture and sophisticated software environment it allows detailed device characterization automated test and operator safety with its carefully considered safety interlocks. It comes with a wide variety of dedicated test accessories which coupled with its next generation architecture ensures unparalleled performance and ease of use in power device evaluation and characterisation.


Bruker Corporation


D8 FABLINE metrology for semiconductor manufacturing


The functional units of semiconductor and compound semiconductor devices shrink in size and thickness from generation to generation. In addition, the device structures become increasingly complex – and the process more and more expensive. Thus, the demand for reliable analytics for process development and at-line or in-line quality control increases permanently.


X-ray metrology offers a non-contact and non-destructive method of probing the nanometric scale, which provides various essential parameters without the need to use a reference. Secondly, the method is known and accepted for many years within scientific, research and development communities for its accuracy and reliability. In many cases just one quick measurement is required to determine sample parameters with a spatial resolution better than 50 Ìm in diameter. The D8 FABLINE is the Bruker AXS’ product line dedicated to semiconductor industries. The instrument consists of two modules. The analytical tool consists of the X-ray metrology unit combined with the EFEM (Equipment Front End Module) for easy FAB automation integration; the Spartan dual load port from Asyst technology allows automated sample change. The X-ray metrology unit is based on the D8 DISCOVER, the world’s leading diffraction instrument for R&D in semiconductor industry. The D8 FABLINE is the only X-ray metrology instrument with four combined applications:


 High-Resolution X-Ray Diffraction (HRXRD)  Single-crystal / epitaxial layer structure, e. g. SiGe  Composition, thickness, relaxation  Spot down to 50 µm in diameter


 X-ray Reflectivity (XRR)  Polycrystalline, amorphous, single-crystal film structure, e.g. HfO2


on blanket  Thickness, density  Micro X-ray Fluorescence (ÌXRF) 48 www.compoundsemiconductor.net January / February 2013


 Simplicity and Reliability: The system is so reliable and easy to use, that no expert is required to operate the system.


 Polycrystalline thin film, e. g. HfO2


 Composition and film thickness  Spot down to 50 µm in diameter


 Grazing Incidence Diffraction (GID)  Polycrystalline thin film  Identification of crystalline phases, crystallite size.


Jordan Valley Semiconductors


QC3 Fast HRXRD Metrology Tool The QC3 High-Resolution X-Ray Diffractometer (HRXRD) from Jordan Valley is a true leapfrog technology over the existing HRXRD technology within the market. The QC3 boasts more than an order-of-magnitude improvement in performance compared to other HRXRD systems, with scans taking seconds rather than minutes or even hours. This provides LED manufacturers a dramatic improvement in quality control of LED devices, with more wafers and higher sampling within wafers possible.


The development and market launch of QC3 demonstrates the success of JVS’ 2008 acquisition of Bede’s HRXRD and compound semi technology. Furthermore, it reinforces JVS management’s ability to apply its business model and expertise in providing the semiconductor market with enabling, high-throughput systems with low cost-of-ownership, achieving market dominance with a valued, customer-preferred product.


Features and benefits:  Productivity and Precision: The QC3 has a dedicated and optimised HRXRD system for LED quality control. As a result of its high intensity, the system gives higher precision and throughput compared to other HRXRD systems.


 Automation: The system operates with fully-automated alignment, measurement and analysis of wafers, conducting batch wafer measurements with optional robot or multi-sample plates. The multi-sample plates allow up to 20 wafers to be loaded into the system for measurement without requiring a robot. For the automated analysis of the data spectra, the QC3 uses tried and trusted industry-leading RADS software for automated analysis which will automatically analyse the collected data and report the results for specific wafers, batches, chambers. This reporting can be extended to host reporting if required.


 Economy: QC3 incorporates XRGProtect™, to ensure the tube lifetime is maximised. It also has an Eco-mode; ensuring system power consumption is reduced when there is no measurement being performed.


on product wafers


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