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Telecoms ♦ news digest


says, “We are delighted by the results of this field trial and this shows further increased capacity potential for Telstra Global’s leading submarine cable plant. Our continuing focus on cutting edge technologies will enable us to continue to deliver new services to our customers and meet their future capacity needs with a long term, reliable offering.”


Infinera co-founder and Chief Strategy Officer, David Welch adds, “We are pleased to see that our 3rd generation FlexCoherent Processor along with 500 Gb/s PICs, is performing exceptionally in real world environments.”


“Over the past few months we’ve shown that a PIC-based long haul super-channel implementation can deal with record-breaking levels of PMD impairments in fibre; deliver a full 8Tb/s of capacity on Dispersion Shifted Fibre that service providers might have written off as useless, and now with Telstra’s help we’ve shown that with the addition of SD-FEC, this technology is capable of being deployed on some of the longest and most challenging cable routes in the world.”


NeoPhotonics to acquire telecom division of Lapis


This will add to the firm’s capabilities for over 100G deployment and strengthen the firm for high speed telecom and datacom applications


PIC manufacturer NeoPhotonics Corporation has entered into a definitive agreement to acquire the semiconductor optical components business unit (OCU) of Lapis Semiconductor Co., Ltd.


Lapis Semiconductor is a wholly-owned subsidiary of Rohm Co. Ltd.


OCU is to be acquired by NeoPhotonics Semiconductor GK, a Japanese subsidiary of NeoPhotonics.


Today’s rapidly accelerating demand for bandwidth is driving increasing needs for capable, scalable telecommunication networks. These advanced network systems are increasingly relying upon photonic integration technologies based on advanced components and scalable device integration approaches.


This aquisition should accelerate the development of NeoPhotonics Photonic Integrated Circuit (PIC) technology by coupling complex optical devices and analogue semiconductor ICs within the same platform.


Also, the NeoPhotonics technology portfolio would expand to include high speed semiconductor devices for signal generation and amplification, which are designed to enable advanced modulation methodologies, enhanced performance, and reduced power consumption in communications networks.


“We are excited about signing this definitive acquisition agreement as Lapis Semiconductor OCU is a leading provider of high speed devices for communications,” says Tim Jenks, NeoPhotonics Chairman and CEO.


“Lapis Semiconductor OCU provides a broad range of lasers, drivers, and detectors for high speed 100G applications. We believe the company’s technologies are well-suited for data rates in optical networks beyond 100G as well. We also believe this acquisition can enhance our ability to provide customers with innovative and technologically advanced optical communication products, which can benefit our customers as they strive to accelerate the delivery of scalable high speed and high bandwidth connectivity.”


“The transaction is a natural step in the relationship between NeoPhotonics and Lapis Semiconductor OCU, as the businesses have been collaborating closely on high speed coherent technology development for the past four years. Further we plan to leverage our existing sales channels after the acquisition, as the two businesses serve many common customers. The transaction will provide NeoPhotonics with revenue from OCU’s advanced lasers and drivers used in many of today’s 100G client-side data transmission modules,” concludes Jenks.


NeoPhotonics Semiconductor GK, an indirect wholly-owned subsidiary of NeoPhotonics Corporation, has agreed to pay approximately $36.8 million in cash, which is comprised of approximately $21.2 million in cash, before adjustments for the business unit and an additional $15.6 million over three years for the associated real estate.


January/February 2013 www.compoundsemiconductor.net 119


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