This page contains a Flash digital edition of a book.
news  analysis SiC MOSFETs tipped for the top


Which SiC transistor will industry choose? Compound Semiconductor talks to Jeff Casady, ex-chief technology officer of SemiSouth and now at Cree, to find out more.


IN NOVEMBER 2012, US-based Cree unveiled a 1200 V SiC power module based on MOSFETs and Schottky diodes. Operating at up to 100 kHz frequencies and targeting high power converters, industrial motor drives, solar inverters and uninterruptible power supplies, the device is significant. It not only joins the industry’s increasing army of SiC devices targeting tomorrow’s high voltage, energy efficient power converters, but crucially, it uses MOSFETs.


Jeff Casady, one-time chief technology officer at recently shuttered SiC JFET developer, SemiSouth, and now product portfolio planning manager at Cree, says we can expect more: “As far as Cree and the rest of the market goes, we are now seeing substantial performance, availability and reliability improvements in MOSFETs, almost on a weekly basis. Costs are falling fast and there are going to be several more announcements coming early next year from Cree. I imagine our [MOSFET] competitors, primarily Rohm, will be doing the same thing.”


For more than a decade, myriad organisations have honed SiC semiconductors to tolerate higher voltages and temperatures than silicon, while ensuring the devices switch more rapidly with lower losses. Cree, Rohm, ST Microelectronics and many more have focused on the tried-and-tested MOSFET, Infineon is forging ahead with its JFET, Fairchild recently released a 1200V SiC BJT, and United SiC is working on IGBTs. But with industry consolidation setting in – as evidenced by SemiSouth’s recent demise – will this diverse range of transistors remain? As Casady now says: “When you talk to customers, they always wanted the MOSFET.”


According to Casady, this transistor was once a technical challenge for SiC, but not any more. “We’re seeing a lot of aggressive design-in activity and we think the MOSFET market in SiCs is going to be very large,” he adds. So why does he think the MOSFET could emerge as the hot favourite? Put simply, the device is a known entity for designers used to driving silicon HBTs and MOSFETs.


“These people want a device to replace silicon, and the SiC MOSFET is something they really understand,” explains Casady. “They understand how to drive it and it’s also got a body diode as most silicon sets do. We know that competitors looking at bipolar [transistors] and JFETs have a much more difficult conversation with their customers as they are not used to those parts.”


But it’s not all about silicon-based semiconductors. Manufacturers of GaN ICs have already made in-roads into higher voltage markets, with 600 V devices readily available. Many players assert that 1200 V GaN ICs will be good-to-go within a few years, and crucially, the cost of these devices will drop more rapidly than SiC


SiC transistors allow high efficiency,compact,light weight systems,cutting total system costs in applications such as solar power.Credit: USAF


versions. Could the GaN IC outpace both silicon and SiC in high power, high voltage applications, including the all-important hybrid electric vehicle market? Casady thinks not. Focusing on electric vehicles he says: “I don’t think GaN will do well here as the reliability requirements are so stringent.”


As he asserts, SiC devices have been in the market for at least a decade – compared to the few years notched up by GaN – and are already used in high reliability applications from solar and wind turbine inverters to industrial power supplies.“Manufacturers from the automotive market needs years of field data from these high reliability markets before they choose a new technology,” he says. “[SiC] is already going into markets that require twenty years of reliability [data]. It will be really challenging for GaN to come in and do that.”


But perhaps most pertinent is that Casady’s new found employer has a choice. “We could choose to use GaN or SiC in any of these applications,” he adds. “But for hybrid electric vehicles, and all these 600V and higher power electronics applications, from my vantage point, it seems SiC is the clear choice.”


© 2013 Angel Business Communications. Permission required.


January / February 2013 www.compoundsemiconductor.net 19


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136  |  Page 137  |  Page 138  |  Page 139  |  Page 140  |  Page 141  |  Page 142  |  Page 143  |  Page 144  |  Page 145  |  Page 146  |  Page 147  |  Page 148  |  Page 149  |  Page 150  |  Page 151  |  Page 152  |  Page 153  |  Page 154  |  Page 155  |  Page 156  |  Page 157  |  Page 158  |  Page 159  |  Page 160  |  Page 161  |  Page 162  |  Page 163  |  Page 164  |  Page 165  |  Page 166  |  Page 167  |  Page 168  |  Page 169  |  Page 170  |  Page 171  |  Page 172  |  Page 173  |  Page 174  |  Page 175  |  Page 176  |  Page 177  |  Page 178  |  Page 179  |  Page 180  |  Page 181  |  Page 182  |  Page 183  |  Page 184  |  Page 185  |  Page 186  |  Page 187  |  Page 188  |  Page 189  |  Page 190  |  Page 191  |  Page 192  |  Page 193  |  Page 194  |  Page 195  |  Page 196  |  Page 197  |  Page 198  |  Page 199  |  Page 200  |  Page 201  |  Page 202  |  Page 203  |  Page 204  |  Page 205  |  Page 206  |  Page 207  |  Page 208  |  Page 209  |  Page 210  |  Page 211  |  Page 212  |  Page 213  |  Page 214  |  Page 215  |  Page 216  |  Page 217  |  Page 218  |  Page 219  |  Page 220  |  Page 221  |  Page 222  |  Page 223  |  Page 224  |  Page 225  |  Page 226  |  Page 227  |  Page 228  |  Page 229  |  Page 230  |  Page 231  |  Page 232  |  Page 233