This page contains a Flash digital edition of a book.
Page 78


New Products www.us-tech.com


PhotoMachining Partners with Light-Fab for SLE


Pelham, NH — PhotoMachining has partnered with Light-Fab GmbH in a collaborative effort to promote selec- tive laser etching (SLE) with femtosec- ond lasers in the U.S. According to PhotoMachining, the


unique nature of very short pulsed light enables such processes as SLE, which cannot be done with longer pulse lengths. Light-Fab sees poten- tial for the technology in the U.S. mar- ket, especially in the fields of medical devices and electronics. The SLE process involves


exposing hard, brittle and otherwise transparent materials, such as quartz and fused silica to USP laser light and then chemically etching the exposed area away. Etching selectiv- ity after laser exposure is enhanced over a thousand times. This method can be used to make precise 3D parts by essentially 3D printing the pat- tern inside the bulk of the material. The technology is expected to play a growing role in technology, such as microfluidics.


PhotoMachining is a high-preci-


sion laser job shop and systems inte- grator. Light-Fab is the developer of


Full-Service Optical Bonding from RAMPF


Wixom, MI — RAMPF has developed a fully-automated joining method and premium liquid optically-clear adhesives for optical display bond- ing. With every new generation of electronic devices, customers de - mand better performance, improved visibility, greater durability, thinner designs, and extended product life. The company’s joining method


Microfluidic device in fused silica.


SLE technology and provides both the processing knowledge and the hardware including the Light-Fab 3D Printer or a special, high-speed and high-accuracy laser head that enables the mass production of 3D


glass parts. Contact: PhotoMachining, Inc.,


4 Industrial Drive, Pelham, NH 03076 % 603-882-9944 fax: 603-886-8844 E-mail: raschaeffer@photomachining.com Web: www.photomachining.com


THE NEW


BENCHMARK IN WIRE STRIPPING


enables reliable, bubble-free applica- tion of bonding materials and the subsequent joining of components. The process cuts the scrap rate near- ly to zero. The bonding material is applied and the components are joined in vacuum environ- ments. The thin-film degassing technology of the single compo- nents makes it possible to process highly-degassed bond- ing material. Degassing of undercuts and the gap between the frame and display is also performed while the material is being applied. This mini- mizes the risk of air bubbles being trapped during the join- ing and curing process. Application is performed


by the RAMPF DC-VAC vacu- um dispensing system. Designed to process one- and two- component casting materials, it is fit- ted with vacuum material condition- ing as standard and equipped with a dynamic mixing system. The encap- sulating process can be easily moni- tored and adjusted through its large viewing window. A comprehensive range of mon- itoring equipment facilitates process


control, while the vacuum chamber can be configured for manual filling or for integration into automated systems. The company also offers turnkey solutions for all optical bonding processes. In addition to the display joining method in a vacuum, the fully-automated production sys- tems also include all the operations necessary to bond displays to frames. The company has developed a


range of liquid, optically-clear adhe- sives that exhibit excellent optical and mechanical characteristics. Key features include: 100 percent trans- parency, total clarity and very low


July, 2017


Turnkey solutions for optical bonding from RAMPF.


haze value, stable color values throughout the entire service life, varying hardness levels from VLRH


20 to 95, and excellent adhesion. Contact: RAMPF Group, Inc.,


49037 Wixom Tech Drive, Wixom, MI 48393 % 248-295-0223 fax: 248-295-0224 E-mail: info@rampf-group.com Web: www.rampf-group.com


Mundt Releases Seven-Axis Laser Workstation


The


Mira 230 has a new robust and


sturdy design that supports an extraor- dinary processing range from AWG 32 to AWG 8. It sets a new benchmark by its unique sequencing capabilities that can be stored in a library for quick reproduction. The Mira 230 can strip and cut inner conductors with a variety of parameters without a program change. It comes equipped with a simple graphical user interface that ensures a quick learning process.


komaxwire.com


Scottsdale, AZ — Mundt has intro- duced its DB-241218, a seven-axis, ultra-short pulse laser workstation for use in a variety of industrial applications that require cost-effi- cient and precise micro- machining. The pulsed lasers, approximately 100 femtosec- onds to 10 picoseconds, per- form such tasks as cutting, drilling, marking, and other surface modifications. Ultra-short pulse laser


energy ablates without heat- ing, creating no heat-affected zone. This improved process can enable new and more com- plex product designs, improve product reliability, and lower operating costs. The company is aiming its


laser manufacturing tools at the medical device, aerospace, high-end automotive, and consumer electron- ics industries, as well as other fields that require extreme precision. The new workstation combines a carte- sian system and a galvanometer to offer more scope and capabilities, addressing many general industrial requirements.


The complex ultra-short pulse


laser utilizes infinite field of view (IFoV) and enables seamless machin- ing over large areas. The machine is able to move from large to small


DB-241218 ultra-short pulse laser workstation.


parts without tiling. This dual-appli- cation machine has seven axes of motion, making it suitable for pro-


ducing parts with complex shapes. Contact: Mundt & Associates,


Inc., 14682 N 74th Street,


Scottsdale, AZ 85260 % 480-922-9365 fax: 480-922-9341 E-mail: mundtinc@mundtinc.com Web: www.mundtinc.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92