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July, 2017

Rogers Intros Substrate Materials and Plating Processes

Rogers, CT — Rogers Corporation’s Power Electronics Solutions (PES) group has introduced its curamik® ADVANTAGE, a family of features and process enhancements for its high-power curamik ceramic circuit substrate materials. The company’s curamik ADVAN -

TAGE materials enable circuit design- ers to optimize the performance of

an advanced silver sintering process that offers an alternative to conven- tional solder device attachment. High-voltage curamik ceramic-

based circuit materials include curamik Power, curamik Power Plus, curamik Performance, and curamik Thermal, offering a broad range of thermal conductivities from 24 to 170 W/m-K. The materials are formulated to effectively disperse heat in power electronics circuits with heat-generat- ing, high-power active devices, such as IGBTs and MOSFETs. The curamik ADVANTAGE family of features and services enhances both the usability and performance of the materials, improving reliability in the process. Plating options include nickel

Curamik ceramic circuit substrate.

their high-power circuits through a wide assortment of services and processes. These include: several plat- ing options for improved copper sur- face finish, two different treatments for minimizing PCB surface rough- ness, selective etching, precise laser drilling of small-diameter through- holes, the addition of solder mask to prevent bridging, and optimization of

(Ni), nickel-gold (NiAu), and silver (Ag) plating. Silver plating can also be provided over selective areas, to allow some copper to remain bare. The plat- ing processes are performed in-house by means of wet chemical etching, and help to improve the efficiency and effectiveness of circuit wire-bonding and soldering processes. Additional curamik ADVAN-

TAGE processes include chemical and mechanical treatments to

improve surface roughness (Rz better than 7); treatment with solder mask to prevent unwanted flow of solder

and formation of undesirable solder bridges; treatment of many of the materials to provide partial-dis- charge-free performance; elimination of voids in ceramic materials to enhance operating lifetimes; and laser drilling of through-holes with a minimum 1 mm (0.04 in.) diameter. Perhaps the most significant

process available as part of the curamik ADVANTAGE family of processes is the optimization for advanced silver sintering that serves as an alternative to conventional sol- dering for interconnections and device attachments. The silver sin- tering process forms strong bonds by

applying heat to a paste containing miniature silver particles. Rogers PES also offers an online

resource that is available 24/7. The PES design support hub contains complete technical information on ROLINK® busbars and curamik ceramic substrates, a library of tech- nical papers on product design and problem solving, plus helpful videos on products and power distribution topics. Registration for access is

quick and available at no charge. Contact: Rogers Corp., 1

Technology Drive, Rogers, CT 06263 % 860-774-9605 fax: 860-779-5509 Web:

MacDermid Enthone Releases ENIG Process

Waterbury, CT — MacDermid En - thone Electronics Solutions has released its Affinity 2.0 high-reliabili- ty, low-variation electroless nickel immersion gold (ENIG) plating process. Affinity 2.0 has been devel- oped to meet stringent reliability requirements, while providing signifi- cant cost benefits. A combination of the company’s

Find Electronic Failures with Vibration Testing

Benchtop Vibration Table

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     

best technologies, and using strict six- sigma process methodology, Affinity 2.0 is a next-generation ENIG process. Affinity 2.0 provides excellent solder- ability, uniformity, and reduced waste, including gold consumption, while adhering to all IPC finish requirements, which makes it a good choice for PCB fabricators manufac- turing for automotive and telecommu- nications OEMs. Affinity 2.0 also

delivers high process consistency. The ENIG process is designed

to offer best-in-class ENIG reliabili- ty, notably through its nickel corro- sion performance and superior gold metal distribution. MacDermid researches, formu-

lates and delivers speciality chem - istries for electronics manufacturing. The company’s products and techni- cal support offer solutions for compli- cated, micro-scale circuitry and high- reliability applications. Markets sup- plied include wireless, automotive

and military electronics. Contact: MacDermid, Inc., 227

Freight Street, Waterbury, CT 06702 % 203-575-5661 E-mail: Web: lectronics

CDE: Rugged Aluminum Electrolytic Capacitor

Liberty, SC — Cornell Dubilier Electronics (CDE) has launched a new line of axial-lead aluminum electrolyt- ic capacitors for applications that demand very high performance under all operating conditions. The HHT is an axial-lead electrolytic with a glass- to-metal seal to prevent the drying out of the capacitor electrolyte. Shelf life is an extraordinary 10 years and opera- tional rated life is 2,000 hours at rated voltage and 175°C (347°F). According to the company, at

150°C (302°F) and full-rated voltage, HHT capacitors outperform competi- tive technologies in a 5,000 hour test with ripple currents of up to 10 Arms. This level of performance makes the HHT an excellent match for high- stress applications in military, aero- space, down-hole, and off-road trans- portation applications. Nine values are offered, from 470 to 4,700 µF, with ratings from 16 to 40 VDC. The CDE HHT series’ glass-to-

Contact us for more info.

Cincinnati Sub-Zero Cincinnati, OH (p) 513-772-8810

metal seal is the reason for its 175°C (347°F) performance, usually the domain of considerably more expen- sive wet tantalum technology. Without the seal, high temperatures will cause conventional electrolytics to lose electrolyte over time. This causes a drop in capacitance and an increase in ESR. With capacitance stability at

high temperature, low leakage cur- rent and very competitive ESR and ripple current specifications, these devices provide new options for mis- sion-critical applications. Like other

Axial-lead rugged aluminum electrolytic capacitor.

CDE capacitors, the HHT series is subject to the industry’s most rigor- ous dynamic testing. The 20g (g- force) vibration testing follows proce- dures outlined in MIL-STD-202, method 204. The HHT case diameter is a low-

profile 20 mm (0.8 in.) for all values, with length varying from 37 to 53 mm (1.5 to 2.1 in.) depending on the value. The axial lead wires are a substantial 18 AWG. They are also RoHS-compli-

ant and free of conflict materials. Contact: Cornell Dubilier

Electronics, Inc., 140 Technology

Place, Liberty, SC 29657 % 864-843-2626 fax: 864-843-2402 E-mail: Web:



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