This page contains a Flash digital edition of a book.
July, 2017


www.us-tech.com


Page 75


Applied Energy Systems Upgrades Heater Blanket for Its Liquified Gas Delivery Systems


Malvern, PA — Applied Energy Systems (AES) has introduced an


updated design for its heater blanket for use with SEMI-GAS® and VERSA-GAS™ liquified gas delivery systems. New features have been added to the standard blanket design to improve its safety and perform- ance in vaporizing liquefied gases to achieve high, sustainable flow rates. Attaining such flow rates is critical for various industries, particularly those involving high-volume semi- conductor production applications, industrial manufacturing and R&D. The UL-labeled heater blanket


is compatible with source products from both of AES’ gas delivery equip-


ment brands, including VERSA- GAS™ vSource™ and vBulk™ gas cabinets, gas panels and rack mount systems, as well as the SEMI-GAS® lines of Centurion™ gas cabinets, Decaturion™ wall mount systems, Megaturion™ bulk gas systems, and Xturion™ custom solutions. The blankets are designed to


accommodate standard gas cylinders and include: a silver, silicone-coated fiberglass exterior and 0.25 in. (6.4 mm) thick needled fiberglass insula- tion; wattage density of 1.16 W/in.2 up to 760W at 240 VAC; a 24 in. (61 cm) heated zone at the base of the


cylinder; a cinch drawstring and insulation zone at the top of the heater blanket; eight straps and eight quick disconnect buckles; six manual, resettable thermostats; and two K-type thermocouples for tem-


perature monitoring and control. Contact: Applied Energy


Systems, Inc., 180 Quaker Lane, Malvern, PA 19355 % 610-647-8744 fax: 610-640-4548 E-mail: info@appliedenergysystems.com Web: www.appliedenergysystems.com


See at SEMICON West, Booth 6186


Heater blanket for use with liquid gas delivery systems.


YINCAE: New Ball Attach Adhesive for Lead-Free Bumping


Albany, NY — YINCAE is showcasing two new materials, its BP 256 ball attach adhesive and the SMT 256EP replacement for conventional solder paste. BP 256 has been designed to


TECHNICA, U.S.A. Fulfilling Manufacturing Needs Throughout the Electronics Industry


BP256 ball bumping adhesive.


enhance solder joint reliability and eliminate cleaning for lead-free ball bumping processes on CSP, BGA, flip chip, and PoP devices, and is compati- ble with SMT assembly. The company’s SMT 256EP was


developed to replace conventional sol- der paste, flux and underfill. The material enhances solder joint strength by 5 to 10 times, and has demonstrated high pull strength at both room and high temperatures. At 280°C (536°F), the material has a pull strength of up to 180g (g-force). SMT 256EP therefore eliminates the RTV or red glue that is typically used to hold components during double reflow, reducing manufacturing costs. The company offers a variety of


exclusive adhesives, thermal interface materials and chip/board/packaging- level materials. YINCAE is also responsible for pioneering a lead-free solder joint encapsulation adhesive solution for wafer-level, flip chip, PoP,


LGA, BGA, and other applications. Contact: YINCAE Advanced


Materials, LLC, 19 Walker Way, Albany, NY 12205 % 518-452-2880 E-mail: info@yincae.com Web: www.yincae.com


See at SEMICON West, Booth 5248


Available exclusively through Technica, U.S.A. 1-800-909-8697 • www.technica.com


Finest achine arts Compact Design Easy aintenance


German Engineering Modular Design Flexible and Scalable


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92