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  


  


Key Specifications:


•Reduced inspection programming times using Gerber data


•Geographical checks for component locations and profiles


•Reverse net generation allows addition of component connectivity info


•Organized component libraries output to Hioki 1240


Production


Hermes Standard to Advance Industry 4.0 Communications


By Susanne Oswald, Head of Global Marketing and Communications, ASM Assembly Systems


in SMT Assembly.” The TCP/IP- and XML-based protocol makes it possible for the first time


A


to transport circuit boards with full traceability (i.e., no loss of data) through all stations of an SMT line. For electronics manufacturers, the new open stan- dard promises to deliver more transparency while saving time and money when building and integrating SMT lines. As a result, the Hermes Standard may become a major building block of the smart SMT factory. The initiative proposed by ASM Assembly Systems and ASYS to develop


a new communication interface aimed at replacing the obsolete SMEMA stan- dard was overwhelmingly welcomed by most leading international SMT equipment manufacturers last year. The specification was published at the end of June 2016 so that third-


party vendors could commence development activities as well. The goal is to introduce some first products that communicate with other line components using the Hermes Standard at this year’s productronica trade show in Munich this coming November. The standard uses uses TCP/IP to allow all stations on an SMT line, in-


cluding printers, conveyors, placement machines, AOI systems, and reflow ovens, to talk with each other. It also employs expandable XML data struc- tures to transmit information, such as board IDs, conveyor speeds and circuit carrier dimensions. A major benefit: Each board need be identified only once by a Hermes Standard-compatible machine at the start of the line.


An Open Standard “The smart factory requires integration across the entire production


 


Key Specifications: •Capable of fine-pitch inspection at 0.2 mm


•Four-terminal resistance measurement between IC leads and pad to detect insufficient solder


•Soft landing feature to prevent board damage


•Supplementary AOI functions including component presence polarity and displacement


•Test resistors, capacitors, diodes, zener diodes, coils, transistors, digital transistors and photocouplers


•Optional CAD conversions •User-friendly Windows operation -friendly Windows operation


floor. Different equipment vendors from the industry have to come together in order to provide the customer with intelligent, yet simple solutions. This is what the Hermes Standard aims to do. We want to establish an effective, sim- ple standard for M2M communication across the entire SMT line,” says Flori- an Ritter, manager of business and product portfolio development at ASYS. “This meeting with 17 equipment providers for SMT production showed how great the need for such a standard truly is. At ASYS, we are proud to be di- rectly involved during the development phase. We are excited about this idea and will continue to drive it actively. Thanks to the Hermes Standard, we are getting closer to our idea of the smart factory, all the while focusing on cus- tomer-oriented solutions.” With its publication as an open standard, the Hermes standard will be


available to all SMT equipment vendors at no cost. And since the protocol was designed to be expandable, over the medium-term, users will be able to pass additional information down the line. Participants include ASM, ASYS, Cy- berOptics, Ersa, KIC, Koh Young, MIRTEC, Mycronic, Nutek, Omron, Parmi, Rehm, Saki, SMT, Viscom, and YJ Link. “We are overwhelmed by the positive response to the Hermes initiative.


The fact that major SMT equipment vendors cooperated in creating a modern, future-oriented and open standard for communication and data exchange be- tween all components of an SMT line demonstrates that we have accepted the challenges of Industry 4.0 and are doing our part to develop integrated and smart SMT factories,” comments Thomas Bliem, ASM’s director of product management — placement systems. “And we are doing it quickly; the Hermes Standard is expected to be finalized by the end of this year. This is excellent news for electronics manufacturers all over the world. Since the acquisition of printing specialist DEK and its integration into


ASM Pacific Technology (ASMPT) in 2014, ASM Assembly Systems has been operating as ASMPT’s SMT Solutions segment consisting of the printing solu- tions division, DEK, and the placement solutions division, SIPLACE. SMT Solutions develops and sells DEK printers for the SMT, semicon-


ductor and solar markets as well as SIPLACE SMT placement solutions. Both divisions use the ASMPT organization to let their customers enjoy significant competitive benefits. ASMPT’s SMT Solutions segment shares its expertise with electronics manufacturers and partners all over the world. Its goal is to improve its customers’ workflows and use new technologies to advance process integration in the industry. ASMPT, founded in 1975, offers high-quality equipment for all major


steps in the electronics manufacturing process — from carrier for chip inter- connection to chip assembly, packaging, and SMT. ASMPT’s Back-end Equipment Business offers a diverse product range


from bonding and molding to trim and form and the integration of these processes into complete in-line systems for the microelectronics, semiconduc- tor, photonics, and optoelectronics industries. The company’s materials business provides customers with a variety of


Visit us at www.seikausa.com to see more of our products!


ik


leadframes, such as etched and stamped, as well as advanced packaging ma- terials.


Contact: ASM Assembly Systems, LLC, 3975 Lakefield Court, Suite 106,


Suwanee, GA 30024 % 770-797-3000 fax: 770-797-3457 E-mail: easales.sea@asmpt.com Web: www.siplace.com r


t a meeting in Munich earlier this year, 17 leading electronics manufac- turing equipment suppliers agreed on the non-proprietary “Hermes Standard for Vendor-Independent Machine-to-Machine Communication


July, 2017


NEW


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