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July, 2017


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Minneapolis, MN — CyberOptics® Corporation is showcasing its WaferSense and ReticleSense auto multi-sensors (AMS/AMSR) at SEMICON West 2017. The company’s AMS/AMSR port- folio measures leveling, vibration and relative humidity in an all-in-one, wireless, real-time device. Using the reticle- or wafer-shaped sensors


with the company’s MultiView/MultiReview™ software, fab engineers can easily conduct diag- nostics and see the effects of adjustments in real time. AMS/AMSR speeds equipment align- ment and set up, lowers maintenance expenses and enhances process uniformity with objective and reproducible data. The company is also displaying its popu-


lar airborne particle sensors (APS2/APSRQ), which are used to wirelessly monitor and trou- bleshoot airborne particles from 0.14 to 30 µm in size. The sensors quickly identify when and where the particles origi- nate and measure the effectiveness of cleaning adjustments and repairs. The WaferSense measurement


Sikama and Air Products Develop Reflow System


Santa Barbara, CA — Sikama International and Air Products and Chemicals, Inc., have partnered in the development of an electron attach- ment flux-less reflow system for the wafer-level packaging market. Air Products has developed a


novel flux-free soldering technology that uses activated hydrogen to remove metal oxides from electro- plated solder bumps on semiconduc- tor wafers and to enable reflow of these bumps to obtain the proper shape and size for interconnection onto a package or substrate. Sikama International’s UP1200


EA version furnace is a five-heat- zone, linear tunnel process oven that is capable of handling up to 300 mm (11.8 in.) wafers and can process 60 wafers per hour. The furnace is designed to remove metal oxides from solder bumps on UBM wafers and sol- der caps from copper pillar wafers with the electron attachment technol- ogy, which activates hydrogen to pro- duce hydrogen anions and then reflow the solder to final shape in the absence of traditional organic flux or formic acid in vacuum processes. The furnace is capable of oper-


ating at temperatures up to 400°C (752°F). The wafers achieve a consis- tent heat profile based on non-con- tact heating in combination with forced thermal convection. The wafers are conveyed through the fur- nace by a roller transport system. The system may be operated under ambient pressure with an atmos-


phere gas mixture of 5 percent H2 and 95 percent N2 in the activation zones and nitrogen in the remaining


process zones. Contact: Sikama International,


Inc., 118 E Gutierrez Street, Santa Barbara, CA 93101 % 805-962-1000 fax: 805-962-6100 E-mail: sales@sikama.com Web: www.sikama.com


See at SEMICON West, Booth 7401


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PHONE: 661.295.1295 1 3:03 PM GO FLAT! Reticle- and wafer-shaped multi-sensors.


lineup includes an auto-leveling system (ALS), auto-gapping system (AGS), auto-vibration system


Page 65 CyberOptics Showcases Multi-Sensor Portfolio


(AVS), auto-teaching system (ATS), the airborne particle sensor (APS), the advanced airborne parti- cle sensor (APS2), and the new auto-multi- sensor (AMS). The products are available in various wafer-shaped form factors depending on the device, including 150, 200 and 300 mm (5.9, 7.9 and 11.8 in.) wafer sizes. The ReticleSense measurement lineup


comprises airborne particle sensors (APSR and APSRQ) and the next-generation APS2, the auto-leveling system (ALSR) and the auto- multi-sensor (AMSR), available in a reticle-


shaped form factor. Contact: CyberOptics Corp., 5900 Golden


Hills Drive, Minneapolis, MN 55416 % 763-542-5000 fax: 763-542-5100


E-mail: info@cyberoptics.com Web: www.cyberoptics.com


See at SEMICON West, Booth 6562 Messy Wires?


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