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July, 2017


Nordson Showcases Test and Inspection Systems


Vista, CA — Nordson DAGE and Nordson YESTECH are showcasing a suite of award-winning systems targeted at both the semiconductor and PCB markets, including the Quadra™ 7 X-ray inspection system, M1m AOI system and 4800 advanced wafer testing bondtester. Nordson DAGE’s flagship sys-


tem — the Quadra 7 with 0.1 µm sub- micron feature recognition — comes equipped with two 4K UHD displays and eight million pixels to fully show the 50 µm pixel pitch and 6.7 MP image size of its Aspire FP™ detec- tor. 4K UHD offers up to four times the detail over standard HD display screens and supports 68,000X total magnification.


The Nordson YESTECH M1m


AOI system offers high-speed micro- electronic device inspection with exceptional defect coverage. With resolutions down to submicron levels and telecentric optics, the M1m pro- vides complete inspection, all in a footprint less than a square meter. The Nordson DAGE 4800


advanced automated wafer testing bondtester is at the forefront of wafer testing technology and supports the testing of wafers from 200 to 450 mm (7.9 to 17.7 in.). The technology is designed for


accuracy and repeatability to provide total confidence in product quality. A range of powerful camera and optical systems to optimize load tool align-


Test for gross and fine leaks in as little as 6 minutes.*


Quadra 7 X-ray inspection system. The company is also displaying


its XM8000 wafer X-ray metrology platform that uses the capabilities of its existing X-ray systems to provide an automated, high-throughput X- ray metrology and defect review sys- tem for both optically hidden and vis- ible features of TSVs, 2.5D and 3D IC packages, MEMS, and wafer bumps.


critical dimensions. Contact: Nordson DAGE, 2370


Oakridge Way, Suite B, Vista, CA 92081 % 510-683-3930 E-mail: sales@nordsondage.com Web: www.nordson.com


See at SEMICON West, Booth 5644


KYZEN Releases Cu Pillar Flip Chip Cleaner


Only NorCom optical leak technology detects both gross and fine leaks in hermetically sealed packages, this fast. Instead of using multiple technologies


and processes, you can leak test virtually any type of package with one high-speed system. The NorCom 2020™


series inspects hermetically sealed components to


MIL-STD 883 requirements either in seam seal trays, or when already mounted to circuits boards and assemblies. It automatically rejects failed devices, and reports the leak rate for each part, eliminating “divide and conquer”leak testing.


NorCom 2020™


Try it free. Send us your package samples today, for a leak test evaluation and report at no charge. *Note: Test time is dependent on package volume


www.norcomsystemsinc.com


610-592-0167 1055West Germantown Pike Norristown, PA 19403 USA


See at SEMICON West, Booth 5325


Nashville, TN — KYZEN® has intro- duced its MICRONOX® MX2707 cleaner, which is specifically designed for copper pillar flip chip cleaning applications. The cleaner is formulated to meet the demands of leadless devices, including BGAs, flip chips, QFNs, LGAs, and passives. It has been optimized to remove organ- ic acid residues of all kinds at low operating concentrations. MX2707 is a multi-metal safe


cleaning chemistry for advanced packaging. Used at low concentra- tions, MX2707 is safe on exposed metal and effectively cleans under highly dense dice. KYZEN provides world-class cleaning chemistries and cleaning technology from front- to back-end applications. The company has been develop-


ing environmentally responsible pre- cision cleaning technologies for elec- tronics, advanced packaging and metal finishing applications for near- ly 30 years. KYZEN strives to con-


nect leading science with care to cre- ate effective cleaning solutions for its customers’ unique manufacturing requirements.


ment, auto-programming and post- test analysis suit the 4800 system for automated wafer testing.


The XM8000 provides non-destruc- tive, in-line wafer measurement of voiding and fill levels, overlay and


MICRONOX MX2707 cleaner targets leadless devices.


Contact: KYZEN, 430 Harding


Industrial Drive, Nashville, TN 37211 %615-831-0888 E-mail: tom_forsythe@kyzen.com Web: www.kyzen.com


See at SEMICON West, Booth 6072


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