July, 2017
www.us-tech.com
TopLine Offers Upgraded CCGA Column Planarizing Tool
Milledgeville, GA —TopLine has introduced an up- graded column planarizing tool for the precise trimming of ceramic column grid array (CCGA) solder columns to ensure planarity across the CCGA with 0.001 in. (0.025 mm) accuracy. Pla- narity enables robust, reliable and uniform con- nections when the CCGA component is mounted on a PCB. The company’s CCGA IC packages are made
with high-temperature solder col umns for SMT soldering onto the PCB. CCGA packages offer more compliance than BGA solder balls, absorb- ing stress caused by CTE mismatch. They can also increase solder joint reliability under harsh operating conditions. The TopLine column planariz-
ing tool securely locks the CCGA in place while columns are safely pla- narized. The procedure is simple; the operator places the CCGA inside of the fixture and an internal shim al- lows columns to slightly protrude through a brass plate on the bottom. The operator holds the brass
Seika
plate face-down on a specially-designed rotating abrasive lapping wheel. Within seconds, all columns are planarized. The final step employs a diamond polishing wheel to shine and polish the tips of the columns before the CCGA is gently re- moved using an optional extraction tool. Trimming or lapping is required for CCGA
packages with Pb90/Sn10 and Pb80/Sn20 copper- wrapped solder columns. Utilizing the column pla- narizing tool is an excellent way to bring the
CCGA into coplanarity. Contact: TopLine Corp., 95 Highway 22 W,
CCGA column planarizing tool.
Milledgeville, GA 31061 % 800-776-9888 E-mail:
sales@topline.tv Web:
www.topline.tv
Page 37
Releases Latest Dip Wetting Tester
Hayward, CA — Seika Machinery has released its MALCOM SWB-2 dip wetting tester. The system is de- signed to effectively test the wetting balance of component leads and to eliminate irregularities during test- ing through a fully-automated wet- ting test procedure. The dip wetting tester automates
the entire process, from flux applica- tion with flux temperature control to the end of measurement. The auto- mated system reduces unstable meas- urement results and user error.
MALCOM SWB-2 dip wetting tester.
With the SWB-2, users can eas-
ily change solder and flux as needed, while efficiently analyzing data with the exclusive PC software. As an added option, a cover allows for wet- ting evaluation in a nitrogen envi- ronment. The SWB-2 complies with the
wetting test method according to JIS Z3198 (Lead-Free Solder Test Meth -
od) standards. Contact: Seika Machinery, Inc.,
26218 Industrial Boulevard, Hay- ward, CA 94545 % 510-293-0580 E-mail:
info@seikausa.com Web:
www.seikausa.com
See at SEMICON West, Booth 7709
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92