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July, 2017


www.us-tech.com


TopLine Offers Upgraded CCGA Column Planarizing Tool


Milledgeville, GA —TopLine has introduced an up- graded column planarizing tool for the precise trimming of ceramic column grid array (CCGA) solder columns to ensure planarity across the CCGA with 0.001 in. (0.025 mm) accuracy. Pla- narity enables robust, reliable and uniform con- nections when the CCGA component is mounted on a PCB. The company’s CCGA IC packages are made


with high-temperature solder col umns for SMT soldering onto the PCB. CCGA packages offer more compliance than BGA solder balls, absorb- ing stress caused by CTE mismatch. They can also increase solder joint reliability under harsh operating conditions. The TopLine column planariz-


ing tool securely locks the CCGA in place while columns are safely pla- narized. The procedure is simple; the operator places the CCGA inside of the fixture and an internal shim al- lows columns to slightly protrude through a brass plate on the bottom. The operator holds the brass


Seika


plate face-down on a specially-designed rotating abrasive lapping wheel. Within seconds, all columns are planarized. The final step employs a diamond polishing wheel to shine and polish the tips of the columns before the CCGA is gently re- moved using an optional extraction tool. Trimming or lapping is required for CCGA


packages with Pb90/Sn10 and Pb80/Sn20 copper- wrapped solder columns. Utilizing the column pla- narizing tool is an excellent way to bring the


CCGA into coplanarity. Contact: TopLine Corp., 95 Highway 22 W,


CCGA column planarizing tool.


Milledgeville, GA 31061 % 800-776-9888 E-mail: sales@topline.tv Web: www.topline.tv


Page 37


Releases Latest Dip Wetting Tester


Hayward, CA — Seika Machinery has released its MALCOM SWB-2 dip wetting tester. The system is de- signed to effectively test the wetting balance of component leads and to eliminate irregularities during test- ing through a fully-automated wet- ting test procedure. The dip wetting tester automates


the entire process, from flux applica- tion with flux temperature control to the end of measurement. The auto- mated system reduces unstable meas- urement results and user error.


MALCOM SWB-2 dip wetting tester.


With the SWB-2, users can eas-


ily change solder and flux as needed, while efficiently analyzing data with the exclusive PC software. As an added option, a cover allows for wet- ting evaluation in a nitrogen envi- ronment. The SWB-2 complies with the


wetting test method according to JIS Z3198 (Lead-Free Solder Test Meth -


od) standards. Contact: Seika Machinery, Inc.,


26218 Industrial Boulevard, Hay- ward, CA 94545 % 510-293-0580 E-mail: info@seikausa.com Web: www.seikausa.com


See at SEMICON West, Booth 7709


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