Page 70 MICROLINE 2000
Laser Depaneling Systems
Stress Free, Burr Free, Particle Free
Low Investment and Operating Cost
t Cost
Cuts Flex, Rigid or Rigid-Flex PCB’s
d or
www.us-tech.com
July, 2017
ZYGO Expands Molded Base Films Analysis
Middlefield, CT — ZYGO has expand- ed the capabilities of its Nexview™ 3D optical profiler for measuring the thickness and topography of films. Using ZYGO’s patented Model Based Films Analysis (MBA), full area profil- ing of top surface, thickness, and underlying surfaces in the presence of a transparent thin film is now possi- ble. MBA enables precise, quantitative surface metrology of films ranging in thickness from 50 to 2,000 nm, with- out contact or surface preparation. MBA is an integrated option
made available with ZYGO’s MX™ acquisition and analysis software platform. With its simple interface, users define the structure of the film stack to be measured, and the Nexview system’s software automat- ically generates a model measure- ment signal. Measurements are then compared with this model signal to determine the topography and thick- ness of the film. The fully-automated illumina-
MicroLine 2000 series available in stand-alone or in-line configuration
tion and imaging system and robust algorithmic methods generally re - quire only a simple calibration with an optical flat. And, because it is
based on coherence scanning interfer- ometry (CSI), measurement results include full 3D maps of topography
Nexview 3D optical profiler.
and thickness data that can be used to evaluate flatness, roughness and uni- formity. MBA is fully compatible with ZYGO’s complete range of imaging
objectives. Contact: ZYGO Corp., 21 Laurel
Brook Road, Middlefield, CT 06455 % 860-347-8506
E-mail:
inquire@zygo.com Web:
www.zygo.com
See at SEMICON West, Booth 5548
Zymet Develops WLCSP Reworkable Edgebond Adhesive
Call us to learn more about laser depaneling 1-800-345-5753 |
www.lpkfusa.com/depaneling
REFLOW See us at
SOLDERING SYSTEMS
SEMICON West Booth 7401
East Hanover, NJ — Zymet’s UA- 2605-B reworkable edgebond adhe- sive has been shown to enhance the board-level reliability of WLCSPs. The work was performed and
published in the Pro ceedings of the SMTA Interna tional 2016 conference, entitled “Reworkable Edgebond Ap- plied Wafer-Level Chip-Scale Package (WLCSP) Thermal Cycling Perfor - mance Enhance ment at Elevated Tem perature” in a collaborative effort between Portland State Univer sity, Cisco and Zymet. Additional work was published presented at the 66th Electronic Compo nents and Technol - ogy Confer ence in Las Vegas, entitled “Effect of Local Grain Distrib ution and Enhancement on Edgebond Applied Wafer-Level Chip-Scale Package (WLCSP) Thermal Cycle Perfor - mance.” In the study, 8 x 8 mm (0.31 in.)
WLCSPs, assembled on organic sub- strates, were subjected to 0 to 100°C (32 to 212°F) thermal cycling. With the reworkable edgebond adhesive, no failures were encountered at 2,000 cycles. WLCSPs have a coefficient of
FALCON ULTRA PROFILE 1200 Small Footprint • Efficient Power Use
Consistent High Yields • Precise Temperature Gradient
thermal expansion similar to that of silicon, 2.6 ppm/°C, and the CTE of the board is about 17 ppm/°C. The mismatch in CTE results in a consid- erable amount of stress when the two are assembled, as shown by the extensive strain-induced grain recrystallization of solder that accompanied early failures. Use of the reworkable edgebond adhesive substantially reduced the damage accumulation, resulting in increased thermal cycle performance. The benefits of using Zymet’s
SIKAMA INTERNATIONAL, INC.
www.sikama.com
See at SEMICON West, Booth 7401
reworkable edgebond adhesive, over one of its reworkable underfills, are significant. No board preheat and dwell time are needed for capillary flow. The risks of underfill voids and
flux-underfill incompatibilities are eliminated. And, when performing rework, there is no need to remove
WLP bonded with reworkable edgebond adhesive.
underfill residues from the entire footprint of the package, virtually
eliminating the risk of pad damage. Contact: Zymet, Inc., 7 Great
Meadow Lane, East Hanover, NJ 07936 % 973-428-5245 fax: 973-428-5244 E-mail:
info@zymet.com Web:
www.zymet.com
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