news digest ♦ LEDs


lights, which require low technology and reliability; and in these fields, customers are scattered and the unit price is low.


The report says since 2013, the development of the LED industry has been mainly reflected in the packaging field. In the future, the LED cost reduction depends on packaging instead of epitaxy. Packaging costs over 50 percent of the LED chip spending. Prior to 2014, LED cost cutting concentrated in the epitaxy field, so that epitaxy vendors witnessed a sharp decline in profits, even many of them left the industry due to losses. After 2014, packaging factories will suffer the cost-cutting pressure, so some of them with poor technical capabilities may see descending profits.


37 companies are profiled in the report which is available from Chinamarketresearchreports.com/


Seoul Semiconductor introduces LED module for retrofit lighting


Combines LED, driver, optics and thermal management


LED maker Seoul Semiconductor has released a new module for omnidirectional lamps, comprising the Acrich MJT 2525 series LED along with an Acrich3 driver chip and a reflector optic.


“The new Acrich A19 module is optimised for the performance and cost requirements of the retrofit lamp market,” said Jay Kim Seoul Semiconductor’s executive vice president of lighting sales. “This new module combines the light source, driver, optics and primary thermal management in a single, compact system, simplifying designs and lowering costs for lighting manufacturers”.


The Acrich MJT 2525 series LED with dimensions of 2.5 x 2.5mm and a wide beam angle has a lumen density of 15 lm/mm2


. It incorporates Seoul


Semiconductor’s proprietary Acrich Multi-Junction chip technology to create the high voltage LED package. The Acrich3 IC is the latest generation driver chip that can work directly from AC mains. It enables lower cost driver solutions and is designed to work with existing TRIAC or phase-controlled dimmers without sacrificing on power quality or


86 www.compoundsemiconductor.net Issue VI 2014 efficiency.


All LEDs and the driver chip are on one board, 38mm diameter, making the light engine easy to use in an A19 form factor.An optional heat bridge could also be used to improve thermal dissipation of the light engine, says the company.


Changelight chooses Veeco


MOCVD for GaN LEDs Purchase marks Changelight’s move into GaN- based lighting market


Veeco Instruments has announced that Xiamen Changelight has chosen it as the primary equipment provider for making GaN based blue/green high brightness LEDs for display and general lighting applications.


During the second quarter of 2014, Changelight ordered multiple TurboDisc MaxBright M GaN MOCVD Systems. In addition, Changelight purchased a TurboDisc K475 MOCVD system to expand its production of red, orange and yellow LEDs.


“In the past we have used competitive MOCVD equipment for the majority of our production of red, orange and yellow LEDs,” said Wang Xiangwu, general manager of Changelight. “As we make this important move into the GaN-based lighting market, we decided to switch to Veeco’s MaxBright M MOCVD system, which we believe will offer the best throughput and cost of ownership to help enable our success and growth in the general illumination market.”


The MaxBright M offers a modular, compact design with a number of layout configuration options to fit various fab spacing requirements, including sub-floor storage, enabling more wafer starts per square foot, which translates into a lower cost of ownership.


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