INDUSTRY PHOTONIC INTEGRATION
Figure 3. Aurrion’s unique heterogeneous integration process enables coherent 100G telecom transmitters and 16 channel 400 Gbit/s datacom transmitters to be fabricated simultaneously on the same silicon wafer using existing foundry infrastructure
devices and silicon-based passive devices on a single chip. This means that in addition to an InP-based laser, we can build circuits featuring InP-based modulator and detector devices, which deliver superior electro-optic performance compared with traditional silicon photonic p-i-n modulators and germanium detectors.
Arguably, by far the biggest benefi t of our heterogeneous integration platform is that it enables a manufacturing capability that can process a variety of PICs simultaneously. This can usher in a new era, assigning the one-product/ one-process cost-structure to the history books. Lower-volume photonic components operating at unique wavelengths, such as telecom or military focused PICs, can then be produced on the same lines used to make higher-volume components, such as datacom interconnects or fi ber-access network transceivers. This will break the strong tie between volume and cost, leading to new application areas and wider usage of photonic components.
Promising prototypes
Our photonic technology is directly applicable to several near-term datacom and telecom transmitter needs, including an uncooled 16-channel fi xed wavelength datacom laser array that we have produced (see Figure 4). This array not only provides a path for a less expensive version of current 100G standards,
such as the IEEE 100GBASE-LR4, which only requires 4 laser wavelengths – it also addresses the recently announced 400 Gbit/s Ethernet standard that could be defi ned for 16 laser wavelengths. By further integrating this existing laser array with modulators, photodetectors, wavelength multiplexors and demultiplexors – library components which already exist in the silicon photonic toolbox – it is possible to realize a chip-scale, multi-channel WDM silicon photonic transmitter that can fi nally address existing and future standards.
Similarly, our telecom wavelength laser, which produces in excess of 20 mW and can be tuned over more than 45 nm, can be readily integrated on a single chip with coherent modulators and polarization diversity optics to meet OIF 100G standards for metro telecom applications.
In both the examples just described, the unique attributes of our heterogeneous integration platform enable a complex, highly functional single-chip product that can be manufactured at a relatively low cost. Such a chip can scale with the requirements of current and future generations of datacom and telecom interconnect technologies, providing the bandwidth, density and cost needed over the coming decades.
© 2013 Angel Business Communications. Permission required.
Figure 4. 16-channel fi xed-wavelength laser array fabricated on silicon and suitable for datacom transmitters
July 2013
www.compoundsemiconductor.net 39
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