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photo-lithography with mask-aligner, wet and dry etching and thermal diffusion.
CONTRACTOR TASKS
The company says that it wants contractors to provide III-V compound semiconductors which include:
1. GaAs, InAs, AlAs 2. GaP, InP, AlP 3. GaAsN, InGaAsN
The service provider should also be prepared to provide the following:
1. X-ray diffraction analysis
2. Standard CMOS micro-fabrication capability 3. An additional nitrogen plasma source as well as III-V compound semiconductor sources
4. P-type and n-type dopant control (effusion cells or similar)
5. In-situ characterisation during epi-layer growth 6. Metallisation capability 7. Automatic growth rate and doping level control
GOVERNMENT FUNISHED MATERIAL
Special substrate wafers for III-V compound semiconductor epi-layer growth will be provided by NASA Langley. Device structure and epitaxy growth methods will be guided by the NASA Langley’s research team.
The intellectual properties of patented growth methods, characterisation methods, epilayer structures, and device structures & fabrication methods will belong to NASA Langley. And NASA says no intellectual properties will be exchanged.
PERIOD OF PERFORMANCE
The period of performance will be 6 months after receipt of order.
GigOptix 40 & 100Gbps interconnects are on Cloud 9
The supplier of III-V based chip-sets enables high speed optical interconnects in data centres for short and long reach high speed connectivity applications
GigOptix is reaffirming its strength in 40Gbps/100Gbps high-speed optical interconnects for emerging Cloud and Web 2.0 applications in next generation data centres.
“With the ever growing demand for our high-speed 124
www.compoundsemiconductor.net July 2013
GigOptix’s broad optical interconnect portfolio includes 1, 4 and 12 channel VCSEL driver and TIA arrays for speeds of 5, 10, 14, 16, 25, and 28Gbps.
From volumes in Light Counting’s April 2013 Market Forecast for Data Centre Optical Transceivers report, the revenue for drivers and TIAs needed for all the AOC high speed optical data centre links, which include both SR and LR applications, is estimated to grow 3 fold from about $40 million today.
This growth rate does not include the expected use of TIAs and drivers for the next generation of consumer electronics and gesture recognition devices, which would further boost demand for these technologies.
“The data centre high speed connectivity is one of the fastest growing segments of the optical data streaming infrastructure, as larger data centres are being built to support the exponential data transfer demand through the Cloud. To meet this expanding need for speed and bandwidth, the industry is rapidly converting from existing copper wire technology to fibre optics, where GigOptix obviously plays a major role in the supply chain. Based on this robust outlook, we remain confident that the demand for our datacom high speed components will continue to rapidly grow over the next few years,” adds Dinu.
devices for optical links using pluggables and active optical cables (AOC), and the recent consolidation of some other merchant component manufacturers into vertically integrated system manufacturers, GigOptix is clearly the largest independent supplier of chip-sets to enable high speed optical interconnects in the data centres for short reach (SR) and long reach (LR) high speed connectivity applications,” says Raluca Dinu, General Manager and Vice President of the Optics Product Line at GigOptix, Inc.”As of today, GigOptix has shipped millions of VCSEL driver and transimpedance amplifier (TIA) devices and has delivered double digit quarterly revenue growth over the last two years,”
He continues, “As data centres scale to offer more optical interconnect applications, services, and storage, GigOptix continues to enhance its enabling device product portfolio offering to become the de-facto leading supplier of choice to the AOC and pluggables manufacturers. With a family of ten products available today for 1 to 12 channels at data rates ranging from 5Gbps to 300Gbps, we continue to demonstrate our strong leadership position in providing advanced chipsets for high speed data connectivity links in next generation data centres”
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