news digest ♦ Telecoms
telecommunications and enterprise data solutions,” says Tim Jenks, Chairman and CEO of NeoPhotonics.
“Together with our expanded sales force serving the region, this is the next step in our local business development activities including a greater research presence and the potential for production of advanced PIC-based solutions.”
As announced last year, NeoPhotonics completed a private placement investment with the Russian sovereign fund investor RUSNANO.
M/A-COM unveils HV CMOS driver for PIN diodes
M/A-COM Technology Solutions has introduced a high voltage CMOS driver for PIN diodes for use in military and commercial radio applications
MA/COM Tech’s MADR-010574 is designed to work with nhe firm’s high power and high voltage PIN diodes.
This driver supports series-shunt and all-series diode designs by biasing four diodes simultaneously. The back bias voltage is configurable from 20 V to 250 V, while the forward biasing current is configurable up to 200 mA. High voltage level shifters are integrated so that it can be easily controlled by 3 V or 5 V CMOS logic.
While consuming low quiescent current, the MADR- 010574 has a typical delay of less than 8 µs. If needed, the switching speed can be further improved by consuming more quiescent power. The driver is packaged in a lead free 7 mm 16-Lead QFN package and is available in tape and reel packaging for high volume applications.
“The MADR-010574 will set an industry standard in terms of versatility, functionality and size” says Scott Vasquez, Product Manager. “This device outperforms the competition and saves inches of board space on space challenged applications such as military and commercial radios. In addition, the applications for this driver are numerous and can be used in any environment that requires high voltage and current bias for PIN diodes.”
Production quantities and samples of MADR-010574 are available from stock.
Infinera wins BICS pan- European network contract
The firm’s indium phosphide (InP) DTN-X 500G platform will enable BICS to deploy networks in days and services in minutes and lower operational costs Infinera’s DTN-X platform has been selected to upgrade BICS’ Pan-European network.
The Infinera DTN-X delivers 500 Gigabit per second (Gb/s) long haul super-channels, enabling BICS to deliver flexible and cost effective 100 Gigabit Ethernet (GbE) services.
BICS offers international wholesale solutions to any communication service provider through a network of 100 points of presence in 55 cities and 33 countries across the globe.
The Infinera DTN-X InP based platform was selected to upgrade BICS’ Pan-European network, stretching across 9,000 kilometres of fibre in Europe and linking through a cable landing station in Marseille into the EIG & SEA- ME-WE 4 submarine cable systems.
BICS selected the Infinera DTN-X for the scalability, efficiency and simplicity the solution delivers.
“ The Infinera DTN-X allows BICS to provide flexible solutions and ensures a faster service implementation, translating into a shorter time to market for our customers,” says Johan Wouters, SVP Capacity Business Management at BICS.
“This new platform will enable the aggregation of multiple high speed services on a single OTN interface. The advanced control plane offers the possibility of self- provisioning for high capacity services making BICS the perfect network outsourcing partner,” adds Wouters.
Infineraclaims to be the first company to deliver 500Gb/s long-haul super-channels based on Photonic Integrated Circuits (PICs) and the FlexCoherent Processor, scaling transport capacity without scaling operational complexity.
The Infinera DTN-X increases network efficiency with five Terabits of non-blocking OTN switching per bay, scalable to 240 Tb/s in a multi-bay configuration and resulting in much more efficient utilisation when compared to conventional WDM architectures.
The Infinera solution includes an intelligent control plane that simplifies service deployment, enabling BICS to deploy networks in days and services in minutes thereby lowering operational costs while providing faster service delivery than the competition.
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www.compoundsemiconductor.net June 2013
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