EQUIPMENT & ACCESSORIES CATALOG EDITION IV LARGE CHAMBER SPUTTER COATERS zzzQ300T T Plus (continued)


New user interface has been thoroughly updated:


Q300T T Plus has a 200 mm wafer capability


Safety The Q300T T Plus meets key industry CE standards • All electronic components are protected by covers • Implosion guard prevents user injury in event of chamber failure


• Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened


• Overheating protection shuts down power supply Vacuum control


High vacuum turbo pumping allows sputtering of a wide range of oxidizing and non-oxidizing metals for thin film and electron microscopy applications. Automatic vacuum control which can be pre-programmed to suit the process and material, therefore removing the need for manual intervention or control.


Cool magnetron sputtering


Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation. However, this is not suitable for electron microscopy applications because it can heat the sample and result in damage when the plasma interacts with the sample. The Q300T T Plus uses low temperature enhanced-plasma magnetrons optimized for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your sample is protected and uniformly coated.


The Q300T T Plus uses easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidizing and noble metals. The Q300T T Plus is fitted as standard with a chromium (Cr) sputter target. Other targets options include; Au, Au/Pd, Pt/Pd, Pd, Pt, Cu, Ir, W, ITO and Al, etc.


Pulsed cleaning for aluminum sputtering


Aluminum (Al) rapidly forms an oxide layer which can be difficult to remove. The Q300T T Plus has a special recipe for Aluminum that reduces the oxide removal time and prevents excessive pre-sputtering of the target.


Film thickness monitor


The Q300T T Plus can be fitted with an optional film thickness monitor (FTM), which measures the coating thickness on a quartz crystal monitor within the chamber, in order to control the coating thickness of material deposited on to the sample.


Film thickness monitor option


z Dual-core ARM processor for a fast, responsive display z Capacitive touch screen is more sensitive for ease of use


z User interface software has been extensively revised, using a modern smartphone-style interface


z Comprehensive context-sensitive help


z USB interface allows easy software updates and backing up/copying of recipe files to USB stick


z Process log files can be exported via USB port in .csv format for analysis in Excel or similar. Log files include date, time and process parameters.


z 16GB of flash memory can store more than 1000 recipes


z Quick and easy creation of process sequences with a simple copy, drag and drop operation


Allows multiple users to input and store coating recipes. New feature to sort recipes per user according to recent use.


System prompts user to confirm target material and it then automatically selects appropriate parameters for that material


Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating profiles are already stored but also allows the user to create their own.


Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.


continued >>>> 37


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76