EQUIPMENT & ACCESSORIES CATALOG EDITION V SPUTTER COATERS, SEM/TEM CARBON COATERS
NEW: RotaQ Rotary-Pumped Coating System
Overview
The RotaQ is an automated and versatile rotary pumped coater offering unparalleled ease of use. Recommended for sample preparation for the examination of specimens using Electron Microscopy (EM).
Available in 3 configurations based on your application needs RotaQ E
Evaporation coater for carbon/metal evaporation. Carbon fiber source offered as standard.
RotaQ S
Sputter coater for noble metals. Au target offered as standard. Au/Pd, Ag, Pt, Pt/Pd, Pd available as options.
RotaQ ES
Combined coater offering both sputter coating and carbon and metal evaporation. Au target and carbon fiber source available as standard. Au/Pd, Ag, Pt, Pt/Pd, Pd available as options.
Features z Recommended for low-medium magnification
z Suitable for use with Tungsten/LaB6 SEM and Benchtop SEM z Rapid cycle time for maximum sample throughput z Tilt stage design giving uniform coating of complex 3D structures z Film Thickness Monitor (FTM) to control deposition of coating z Intuitive and responsive touchscreen color panel design z Multi-color LED visual status indicator offering process updates
z Pre-set recipes for standard protocols resulting in sample reproducibility
z Customizable recipes for tailored applications z Easy and quick set-up of profiles z Multiple stage options based on application needs
Applications
Tungsten/LaB6 SEM and Benchtop SEM — For Biological SEM Applications: Integrate the RotaQ S with the E3100 Critical Point Dryer. Low and medium magnifications
Noble metals Au, Au/Pd, Pd, Ag, Pt/Pd
Carbon coating for elemental analysis and carbon coating of TEM grids — Use the RotaQ E with Carbon Fiber Head.
Site Requirements Venting gas: Nitrogen supply for purging should be N4.8 (Zero Grade) 99.998% purity capable of supplying 0.5 bar (minimum 0.3 bar and maximum 1 bar) with nominal flow rate of 3 ± 0.2 liter/min. for 60 sec. The system is supplied with 3m plastic tubing 3mm I.D. x 6mm O.D. from quick release connectors to be fitted to a pressure regulator or plant supply.
Pumping gas: Argon supply for sputtering should be N4.8 (Zero Grade) 99.998% purity capable of supplying 0.5 bar (minimum 0.3 bar and maximum 1 bar) with nominal flow rate of 3 ± 0.2 litre/min for a 4-minute maximum sputter cycle time (some instruments may have specially extended sputter cycles). The system is supplied with 3m plastic tubing 3 mm I.D. x 6 mm O.D. from quick release connectors on the rear of the unit. It is the customer’s responsibility to connect from this hose to the pressure regulator set at approximately 10psi, from gas bottle or plant supply. Typically, a system will use 0.2 litres of Argon for a 4-minute sputter cycle.
24 Rota Cota Stage Short Tilt Stage
Slide Stage
Wafer Stage
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