July, 2014
www.us-tech.com
Yincae Intros Temp Flex Encapsulants
Albany, NY — YINCAE Advanced Materials, LLC has introduced a series of new encapsulant products that enable greater production tem- perature flexibility for microchips with different alloy applications. Because connections between
semiconductor devices and substrates react differently to changes in temper- ature, they are prone to crack when-
ponents which have been underfilled are also difficult to rework. Altogether, this translates to
additional cost in terms of the produc- tion process, rework and scrap. The YINCAE SMT256/SMT266
SMT 256 encapsulant.
ever they are heated and cooled, such as during the thermal cycling process. Underfill materials have traditionally been used to mitigate the issue and dissipate the stress, but their use requires subjecting the devices to additional heat (between 70 and 90°C to flow properly) adding another step to the production process. Com -
Product Series is a family of microchip assembly and ball attach- ment adhesive products that replace underfill and the underfill process with an encapulant product that can be dipped, printed, jetted or brushed at temperatures ranging from 140 to 260°C. The SMT256/SMT266 Pro - duct Series can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating a solder joint bond that is 5- to-10 times stronger than a conven- tional solder joint. The products are also designed for use in lead-free,
Sn/Pb and Sn/Bi processes. Contact: YINCAE Advanced
Materials, LLC, 19 Walker Way, Albany, NY 12205 % 518-452-2880 E-mail:
gyelle@yincae.com Web:
www.yincae.com
Engineered Material Systems Intros New Photoresist
Delaware, OH — Engineered Material Systems, Inc. (EMS), a glob- al supplier of negative photoresist materials for MEMs and IC cooling applications, is introducing the DF- 4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS). This material for- mulation has been optimized for hot roll lamination and processing on MEMS and IC wafers. DF-4017 film was developed to
produce extremely hydrophobic (>90° contact angle) film surfaces. The film is tougher (less brittle) than most neg- ative photoresists on the market, with a glass transition temperature of 145°C (by DMA Tan Delta) and a mod- erate modulus of 4.5 GPa at 25°C. DF-4017 film is compatible with
and can be used in contact with the EMS line of spin coating photoresist.
DF-4017 dry-film photoresist is the latest addition to EMS’ full line of film and liquid negative photo resists
Page 91
CUI IntrosUSB Power Adapter for Europe
Tualatin, OR — CUI Inc has intro- duced an ultra-compact USB switch- ing power adapter for continental Europe, the EPSA050100UE-I38-EJ. The 5W wall plug adapter is among the smallest to integrate USB and has a footprint of just 59 x 42mm. The small form factor makes it well suited for consumer applications, including tab lets, media players, e-readers, GPS, and other mobile devices. The new part is fully compliant
with European ErP phase II regula- tions and has Level V energy-efficien- cy compliance for green design requirements. In addition, the adapter is very energy miserly, with a no-load power draw of less than 0.1 W. Rated with an output of 5VDC
at 1A, the high density adapter oper- ates at AC input voltages ranging from 90~264VAC. Safety marks
include GS, LPS (limited power source), and CE. The 5W power adapter meets
EN55022 Class B limits for conduct- ed and radiated EMI and provides protections for over-voltage, over cur- rent, and short circuit conditions.
5W USB power adapter for Europe.
Contact: CUI, Inc., 20050 SW
112th Ave., Tualatin, OR 97062 % 800-275-4899 or 503-612-2300
E-mail:
sales@cui.com Web:
www.cui.com
DownStream Releases Newest DFM Software
Marlborough, MA — DownStream Technol ogies, LLC has released the latest version of its design for manu- facturing solution, DFMStream®. DFMStream 11.0 introduces
Cross-section showing how new photoresist works.
formulated for making microfluidic channels and permanent features on MEMS devices and integrated cir- cuits.
Contact: Engineered Material Systems, Inc., 132 Johnson Dr.,
Delaware, OH 43015 % 740-362-4444 Web:
www.emsadhesives.com.
Asset and Synopsys
Richardson, TX — Asset® InterTech, a supplier of tools for embedded instru- mentation, has collaborated with Syn - opsys, Inc., a global provider of soft- ware, IP and services used to acceler- ate innovation in chips and electronic systems, on a proof-of-concept case study demonstrating the viability of an IJTAG tools ecosystem. Tools are needed to insert and
Collaborate on JTAG Tools
Synopsys’ DFTMAX™ and Tetra - MAX®, and ASSET’s ScanWorks® can support the in-situ defect diagnosis in a product life cycle, beginning with chip test and verification, through board-level manufacturing test and diagnostics, and even field service applications.” Titled “IEEE P1687 IJTAG Tools
synthesize IEEE P1687 IJTAG em - bedded instruments into chips and then access those instruments to operate them for circuit board test purposes. “Now that the IEEE P1687
IJTAG embedded instrumentation standard has passed ballot, it’s time for the various semiconductor test and board test tool vendors who make up the IJTAG ecosystem to start showing chip, board, and system design engi- neers how to deploy this exciting new technology,” said John Potter, senior principal technologist for Asset and one of three authors of the case study. “Our case study demonstrates how
Ecosystem — A Case Study”, the new eBook is offered as a free downloaded from the Asset web site at:
www.asset-
intertech.com/Products/IJTAG-Test/ IJTAG-Test-Software/Embedded- IJTAG-P1687-BIST-Synopsys-DFT- MAX-ScanWorks Other informative eBooks, white
papers and videos on issues relating to chip, board and system debug, valida- tion and test can be downloaded from
the Asset website. Contact: Asset InterTech, 2201
N. Central Expy., Ste. 105,
Richardson, TX 75080 % 888-694-6250 or 972-437-2800 fax: 972-437-2826 Web:
www.asset-intertech.com
The Nation’s Hi-Tech Electronics Publication
Subscribe today:
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over 70 additional DFM analysis checks to support both the PCB fab- rication and assembly processes. The analysis expansion was designed to satisfy requirements for advanced vias, back drilling, fine pitch SMD components, tighter tolerances for solder and paste masks and other advanced technologies. Designs with advanced via types can be analyzed for minimum clearances to specific via types. For example, pads and traces can be analyzed for adjacency
to laser vias independent of blind or buried vias and other such advanced design constructs. DFMStream allows the user to
add design intelligence to Gerber and NC files by assigning Gerber/drill ele- ments unique properties such as laser via, blind and buried via, back drill and so on. Once identified, advanced DFM analysis can be performed spe-
cific to the type of construct. Contact: DownStream
Technologies, LLC, 225 Cedar Hill Street, Ste. 333, Marlborough, MA 01752 % 800-535-3226 or 508-970- 0670 fax: 508-481-0362 E-mail:
info@downstreamtech.com Web:
www.downstreamtech.com
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