July, 2014
www.us-tech.com
Page 63
half-dimensional (2.5D) and three- dimensional (3D) packaging and in the handling of extremely thin wafers and dies. The material-supply indus- try has responded in providing newer generations of die attach films and wafer protection material to meet the needs of these increasingly demand- ing challenges. The advantages of using die-attach films at the wafer level instead of using die-attach mate- rials on individual die have been known for some time, and it can be
Recent Advances in Die Attach Film G
rowing demand for hand-held electronic devices has led to greater use of two-and-one-
Frederick Lo, Maurice Leblon, Richard Amigh, and Kevin Chung. AI Technology, Inc., Princeton Junction, NJ based) that are only 10-to-25µm
laminated on a wafer before dicing. Such a process poses many material technology challenges, however, which have been met through the use of use of dicing-die-attach-film (DDAF) adhesives, from the US or Japan. The challenges include the following:
l Requirements for thin and stable film adhesives (typically epoxy
thick. l
other side-effects. l
ble with the adhesive layer of the dicing tape to prevent cross-contam- ination leading to residues and
Capability for high die-bonding stability for wire-bonding operations
bonding with high efficiency. l
Capability to perform chip-stack DDAF adhesives that are compati-
to +250°C for high production rates. l
the performance requirements of at least JEDEC IPC level 3 or better for good moisture resistance after packaging. In terms of bonding sta- bility and moisture sensitivity of the DDAF materials and the molding, encapsulation, or other electro- mechanical protection mechanisms,
Use of DDAF materials that meet Continued on page 68
Examining die for packaging.
useful to explore the criteria for high- er efficiency, more reliability, and higher performance die-attach film at the wafer level. This will include examining the effects of interconnec- tions from chips to packages on choic- es of die-attach solutions. Packaging using wire-bonding, flip-chip solder- ing, or direct mechanical contact attach from flip-chip to bond pads effectively dictates the choice of differ- ent wafer level die-attach solutions. In high-volume commercial
applications, the use of 10-to-20µm die-attach film adhesive has proven to be reliable for stack-chip configu- rations from two to three layers. The 10-to-20µm film adhesive not only
Recent advances in die-attach materials together with optimized processing techniques will enable more advanced technology for packaging semiconductor devices within smaller footprints and volumes.
yields thinner devices well suited for computer tablets, cellular tele- phones, and digital cameras, but also uniform and controlled flow for very reproducible interconnections. Standard wire-bonding chip
packaging employs backside die- attach that can use more traditional epoxy die-attached film adhesives than available from die-attach film adhesive manufacturers in the United States, such as AI Technology. A typical manufacturing pro -
cess employing wafer-level packag- ing is integrated in terms of using dicing tape and die-attach file direct
See at SEMICON West, Booth 5747
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