July, 2014
www.us-tech.com
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Kyzen Brings Advanced Packaging Cleaning Chemistries
Nashville, TN — Kyzen is showcas- ing its AQUANOX® A4638 Advanced Packaging Cleaning Chemistry and MICRONOX® MX2302 Wafer Level Cleaning Solution. AQUANOX A4638 removes flux
residue from flip chip and low clear- ance components. It rapidly removes water-soluble polar flux residues and exhibits a low surface tension. Incor - porating the company’s inhibition technology, A4638 offers exceptional material compatibility and is a non- hazardous, biodegradable aqueous solution containing no CFCs or HAPs. MICRONOX® MX2302 is an
engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean and tacky flux from wafer bumps found in flip chip, chip scale and µBGA packages. Effective in ultrasonic, centrifu-
gal and semi-aqueous spray under im mersion cleaning systems, MX2302
Ruggedized Inductive Sensor from Balluff
Florence, KY — Balluff is expanding its miniature inductive sensor line with the addition of the BES R04 block sensor. This robust metal- housed inductive sensor is especially suitable for extreme applications where everyday hostilities can chal- lenge standard sensors. The sensor also offers a ceramic sensing face, making it an excellent choice for
is compatible with all soldering mate- rials and metal layers. AQUANOX A4638 and MICRONOX MX2302 are available in one, five and 55 gallon ()3.78, 18.9 and 208 liter) containers. In addition, the company offers a full line of precision cleaning chemistries
that meet any cleaning challenge. Contact: Kyzen, 430 Harding
Industrial Dr., Nashville, TN 37211 % 800-845-5524 or 615-831-0888
fax: 615-831-0889 E-mail:
info@kyzen.com Web:
www.kyzen.com
Clean BGA bumps is just one positive outcome.
See at Semicon West Booth #5752.
Inductive sensor is ruggedized for harsh environments.
applications with weld spatter, metal debris, and vibration. Further its small size and low profile make it an excellent choice whenever space is at a premium. The short housing length enables integrated installation even in compact assemblies, while the flat housing form makes the required installation depth extremely small — 5mm or less. The lightweight sensor makes it especially suitable for appli- cations with high acceleration, and its fully integrated electronics means that no external amplifier is needed. The sensor’s high switching fre-
quency allows for high cycle speeds, and its rugged construction means that it is excellent for applications in
harsh environments. Contact: Balluff Inc., 8125
Holton Drive, Florence, KY 41042 % 800-543-8390 or 859-727-2200
E-mail:
balluff@balluff.com Web:
www.balluff.com
See at Semicon West Booth #529.
See at SEMICON West, Booth 605
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