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www.us-tech.com IMPORTANT TESTS?
Renting test equipment you need shouldn’t feel uncomfortable!
Feel around at
www.atecorp.com/USTech Rent from ATEC
Friendly & Knowledgeable Support
July, 2014
AI Technology Intros Conformal Thermal Pad
Princeton Junction, NJ — AI Tech - nology, Inc. (AIT) has introduced COOL-PAD™ CPR7154, a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above +45°C. The new inter- face material is optimized to accommodate large areas with different heights and gaps of less than 3-mil along its inter- facing area. The material is filled
with a modified oxide mix- ture and is electrically insu- lating at normal voltage. It is designed to have high compressibility as applied in comparison to traditional thermal pads.
on both sides for optimum thermal transfer performance. It has high thermal conductivity and low Tg characteristics that impose minimum thermal stress on bonded parts during thermal cycling or shock testing. The pad is designed
Thermal pad conforms to space between
components. Once the device temperature
reaches +45°C, COOL-PAD CPR7154 will “melt-flow” to fill even the small- est of trapped air along the interface between the device and heat-sink or heat-spreader. The pad is semi-tacky
Contact: AI Technology, Inc.,
for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications with modules from Philips, Cree, Bridge - lux, etc. The same phase- change pad works quite well for CPU and GPU in Xbox360, Play Station, and other game consoles.
70 Washington Rd., Princeton Junction, NJ 08550 % 609-799-9388 E-mail:
ait@aitechnology.com Web:
www.aitechnology.com
See at Semicon West Booth #1201.
Full Speed Debugging BGA133 with Ironwood Adapter
® s 1 t a b 8 9 1
Call Now 888-404-6472 ADVANCED TEST EQUIPMENT RENTALS
ENTA Test Probes · Test Fixtures
Eagan, MN — Ironwood Electronics’ PB-BGA133A-Z-01 Socket Probe Ad - ap ter, which allows high-speed test- ing of BGA devices while accessing the signals using testers through header pins. Features of the PB- BGA133A-Z-01 include shortest pos- sible trace length for maximum speed, low inductance, low capaci- tance, blind and buried via PCB design technology. This socket probe adapter is designed to interface with 0.5mm pitch Fine pitch Ball Grid Array (FBGA) packages. The Socket Probe Adapter con-
sists of two parts; the surface-mount base is soldered to the target system board in place of a BGA133, 0.5mm pitch, 14 x 14 array, 11 X 10mm body
using standard BGA soldering meth- ods. The probe board with elastomer socket plugs into the SMT base and uses a PCB to deliver all data, address, control, and clock signals to header pins on 2.54mm centers. In use, the IC is dropped into
the elastomer socket, and downward force applied using the compression screw in the socket lid. The socketed 133-pin BGA chip top module will plug into the female BGA socket sol-
dered to the development board. Contact: Ironwood Electronics,
1335 Eagandale Court, Eagan, MN 55121 % 800-404-0204 or 952-229- 8200 fax: 952-229-8201 E-mail:
info@ironwoodelectronics.com Web:
www.ironwoodelectronics.com
FOR TESTING SMALL AND MEDIUM-SIZED PC-BOARDS
MA 260
COMPACT AND SPACE SAVING HAND-LEVER TEST FIXTURE
PRECISE CONTACTING
More information about our Innovation Campaign:
www.ingun.com/innovationcampaign
INGUN USA, Inc. | 252 Latitude LN STE 102 | Lake Wylie SC 29710 | USA | Phone: +1 (803) 831 1200 |
mailbox@ingun.us |
www.ingun.us See at SEMICON West, Booth 5764
E l i she d
17025! NOW
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