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www.us-tech.com DEK: Intelligent Print Techniques
Oirschot, the Netherlands — DEK is fielding a comprehensive range of printing technologies including un- derstencil cleaning chemistries, high performance fabrics and award-win- ning VectorGuard High Tension sten- cils to a brand-new print platform in- novation. The company’s Gemini plat- form, a printing solution designed to accommodate dual lane placement processes, reportedly is capable of ex- ceptionally high throughput of 300 boards per hour, a large print area of 508 x 508mm and independent plat- form control that allows one printer lane to run while the other is engaged in product changeover. With a process alignment capability of ±15µm at 2.0Cpk, Gemini is the future of high- speed, high-throughput modular pro- cessing. The back-to-back (B2B) print-
Based on the proven Horizon iX
series, Gemini provides a familiar graphical user interface (GUI) that re- quires no re-learning for current DEK customers. The short learning curve allows for immediate leverage of Gem- ini’s powerful capability, producing as many as 300 boards per hour. The new printer delivers this throughput rate without sacrificing anything, as the system is capable of managing a 508 x 508mm print area in an indus- try standard frame, yet the footprint is far more compact than that of other B2B printers on the market. Flexibility and convenience are
Gemini back-to-back platforms.
ing system delivers modular process- ing on-demand, enabling high-vol- ume electronics manufacturers to
dramatically increase output levels while ensuring exceptional accuracy, quality and yield.
at the heart of the Gemini platform, as each printer in the system has all key maintenance elements located at the front of the machine for quick and easy access. In addition, the printers offer independent function- ality, allowing one printer to contin- ue running while managing product changeover on the other. These fea- tures — in addition to exceptional processing performance — make the new printer an excellent market so-
lution for B2B printing. Contact: DEK, 1785 Winnetka
Circle, Rolling Meadows, IL 60008 % 847-368-1155 Web:
www.dek.com
RPS Adds High Volume
Lead Tinning Spokane Valley, WA — RPS Automa- tion LLC., a manufacturer of automat- ed precision soldering equipment for electronics assembly and manufactur- ing, has introduced the Dynamic Ro- tary Head for Odyssey Lead Tinning Systems. This feature enables high volume lead tinning of QFPs and other multi-sided SMT and THC electronic components that require tin removal, fluxing and re-tinning.
July, 2014
Lead tinning rotary head running an 8-up QFP process.
RPS Lead Tinning Systems are
automated robotic platforms that re- condition and re-tin high value elec- tronic components. The flagship RPS Odyssey Lead Tinning System can now be configured with the optional rotary head for high volume applica- tions. The rotary configuration can handle up to 8 components at a time with 360° of component rotation and theta axis motion (side-to-side) to en- able high precision process range for consistent and accurate lead tinning. The new Rotary Head feature
has been in development for over 12 months in partnership with several
customers and RPS engineering. Contact: RPS Automation LLC, 3808 N. Sullivan Rd., Bldg. 14J,
See at SEMICON West, Booth 6367
Spokane Valley, WA 99216-1610 % 509-891-1680 fax: 509-891-1681 Web:
www.rpsautomation.com
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