July, 2014
www.us-tech.com Advances in Die Attach Film Continued from previous page
TSV Stack Chip Packaging Through-silicon-viahole (TSV)
stack-chip packaging provides the ultimate chip interconnection per- formance for stack-chip packages. The requirement for stress relief is even more critical to filling in the viaholes of a TSV structure and between the stacked chips. For fill- ing in TSV viaholes, fill-in adhesives must have certain features:
lLow viscosity to wick into the via- holes easily with the applied capil-
lary force. l
below 30 ppm/°C. l
good electrical contact and charac- teristics — for commercial and mili- tary applications, this should be
Low CTE, preferably a great deal High Tg and modulus to maintain
Shown and described: semiconductor packaging from wafer DDAF to component on board.
well above +150°C. l
than 10 seconds at +175 to +250°C. Non-epoxy-based , high-temper-
Fill-in adhesive should cure in less
ature fill-in paste adhesives are available that can fill in 20µm via- holes for such applications. Wafer-level die-attach films with
very thin bond lines pose many chal- lenges. But recent advances in die- attach materials together with opti- mized processing techniques can over- come these challenges and will enable more advanced technology for packag- ing semiconductor devices within smaller footprints and volumes. Similarly, flip-chip underfill adhesive can provide effective fill-in of through- silicon viaholes and provide stress relief between stacked chips. Contact: AI Technology, Inc., 70
Washington Road, Princeton Junction, NJ 08550-1012 % 800-735-5040 or 609-799-9388 fax: 609-799-9308 Web:
www.aitechnology.com r
6-Phase PWM Controller
TAKAYA Think Quality - Think Takaya
from Intersil Milpitas, CA — Intersil Corporation (NASDAQ: ISIL) has unveiled the ISL6388, a 6-phase pulse-width modulation (PWM) controller with non-volatile memory (NVM) that is compliant with Intel’s VR12/12.5 specification. Designed for server and high-end desktop applications, the digitally programmable multi- phase controller has multiple time programmable NVM that allows for the creation of custom configura- tions during the design process, eliminating the need for a soldering iron to make adjustments. The new multiphase controller is supported by the company’s latest release of the PowerNavigator® graphical user interface, which allows designers to easily use the company’s digital power products without writing a line of code. The ISL6388’s patented enhanced adaptive pulse positioning (EAPP) architecture reportedly pro- vides outstanding transient re - sponse using a linear control loop, avoiding beat frequency issues, and improving transient response over competitive solutions. The new ISL6388 combines a
fast control loop combined with full digital communication and telemetry options to enable ultimate flexibility and customization. The unit was de - signed to enable users to load distinct configurations into each of the eight NVM banks to optimize their power design and increase the speed of development while providing support for multiple designs in production. Capabilities of the controller are
further en hanced by the company’s Power Navigator GUI, which is an easy-to-use, drag-and-drop, free down loadable interface that provides the flexibility designers need to quickly set up and control any power supply architecture. Power Naviga - tor’s “hardware-free” mode lets users select components prior to hardware development, without digital design risk. The Power Nav igator 5.1 GUI provides access to all commands and setup configurations, and can load predefined configurations. Contact: Intersil, 1001 Murphy
Ranch Road, Milpitas, CA 95035 % 888-468-3774 or 408-432-8888 fax: 408-434-5351 Web:
www.intersil.com
TAKAYA introduced the world to Flying Probe Test and became the
worldwide standard by consistently providing the best performance, reliability, and local support to meet the demanding and varying requirements of electronics manufacturers.
APT-1400F NowTAKAYA sets a NEW
standard in high performance with the introduction of its Advanced Multi-Function Flying Probe System, the NEW APT-1400F.
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Page 69
APT-9411CE
APT-94XX Family Industry Standard for Electronics Manufactures
APT-9411SL
APT-9600CE
Think Quality - Think Takaya TEXMAC, Inc.
3001 Stafford Drive. Charlotte, NC. 28208 Ph: 704-394-0314
www.texmac.com
NEW!
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