134 Wednesday PM ~Poster!
3:30 PM 687 Nanometer Size TungstenMarkers Formation by a Helium Ion Microscope Equipped with Gas Injection System for Alignment of TEM Tomographic Tilt Series;M Hayashida, T Iijima, S Ogawa, T Fujimoto; National Insti- tute of Advanced Industrial Science and Technology, Japan Poster # 240
3:30 PM 688 A High-Speed Electron-Counting Direct De- tection Camera for TEM; P Mooney; Gatan, Inc; D Cont- arato, P Denes; Lawrence Berkeley National Laboratory; A Gubbens, B Lee; Gatan, Inc; D Agard; University of Califor- nia, San Francisco;M Lent; Gatan, Inc
Poster # 241
3:30 PM 689 Examining Dislocation Structures in Mo Pre- Strained Fibers via Electron Tomography;VMcCreary, G Liu; University of Illinois, Urbana-Champaign; J Kwon; The Ohio State University; K Johanns, P Sudharshan Phani; University of Tennessee, Knoxville; I Robertson; University of Illinois, Urbana-Champaign; M Mills; The Ohio State University; G Pharr, E George; Oak Ridge National Labora- tory
Poster # 242
3:30 PM 690 Transmission ElectronMicroscopy and Three- Dimensional Tomography of Peptide-Coated Single-Walled Carbon Nanotubes; P Bajaj, J Nguyen; University of Texas, Dallas; C Gilpin; University of Texas Southwestern Medical Center; G Dieckmann, C-C Chiu, S Nielsen, I Musselman; University of Texas, Dallas
Poster # 243
W E D N E S D A Y
3:30PM 691 Molecular Dynamics Simulations of Nanoclus- ters for Improved STEM Image Simulations; R Aveyard, J Yuan;University of York,United Kingdom; Z Li, R Johnston; University of Birmingham, United Kingdom
Poster # 244
3:30 PM 692 Scanning Transmission Electron Microscopy (STEM) Tomography of Layer-by-Layer PAH/PSS-Au Nano- composite Structures; N Bassim; U S Naval Research Labora- tory; A Herzing; National Institute of Standards and Technology; W Dressick, K Wahl, D Petrovykh, K Fears, R Stroud, T Clark; U S Naval Research Laboratory
Poster # 245
3:30 PM 693 The Use of Combined Three-Dimensional Electron Back Scatter Diffraction/Energy Dispersive X-Ray Analysis to Assess the Characteristics of the Gamma/Gamma- Prime Microstructure in Alloy 720LiTM; D Child, G West, R Thomson; Loughborough University, United Kingdom Poster # 246
3:30 PM 694 Three-Dimensional Characterization of Den- tal Bonded Interface Degradation Using Serial Ion-Ablation Scanning ElectronMicroscopy; S Duarte;University of South- ern California; N Avishai, A Avishai, A Heuer; CaseWestern Reserve University; J-H Phark; University of Southern California
Poster # 247
A-15 Vendor Symposium: Tools for Science Poster Session
Wednesday 3:30 PM Room: Exhibit Hall
3:30PM 695 Image Restoration by DOGMulti-Scale Analy- sis; K Honda, K Kawauchi, T Nokuo; JEOL Ltd, Japan; N Kikuchi, N Erdman; JEOL USA
Poster # 248
3:30 PM 696 Trials to Improve Image Quality in Electron Tomography; T Hashimoto, T Kubo, T Yotsuji, T Oyagi, M Kawasaki, E Nakazawwa, A Wakui, T Tanaka, H Kobayashi; Hitachi High-Technologies Co, Japan
Poster # 249
3:30 PM 697 Automated Qualitative Element Analysis of EDS Spectra with Considering Pile-Up Distortions in High Count-Rate Modes; F Eggert, T Elam, R Anderhalt, J Nico- losi; EDAX ~Ametek!
Poster # 250
3:30 PM 698 High Quality Cross Sections of Low Melting Point Samples Prepared with Cryo Ion Slicer—Broad Ar Ion Beam Milling Apparatus with a Newly Developed Specimen Cooling Unit; Y Nakajima, M Shibata, H Matsushima, T Suzuki; JEOL Ltd, Japan; N Erdman; JEOL USA
Poster # 251
3:30 PM 699 3D Confocal Raman Imaging of Transparent and Opaque Samples; U Schmidt; WITec GmbH, Germany; J Yang,WLiu; WITec Instruments; A Jauss, T Dieing; WITec GmbH, Germany
Poster # 252
3:30 PM 700 A New Electron Microscope with an Easy Operation System for Nano Analysis; S Kawai,MMatsushita, K Tanaka, T Iwama, N Endo, T Kuba, Y Ohkura, Y Kondo; JEOL Ltd, Japan
Poster # 253
3:30 PM 701 Silicon Drift Detectors for Chemical Analysis on the nm-Scale and Below; M Falke, A Kaeppel, R Terborg; Bruker Nano GmbH, Germany
Poster # 254
3:30 PM 702 Progress on the Development of DEPFET Based SDD and MPD Detectors; J Treis; PNDetector GmbH, Germany; K Heinzinger, K Hermenau; PNSensor GmbH, Germany; SHerrmann, T Lauf;Max Planck InstitutHalblei- terlabor, Germany; P Lechner, G Lutz, P Majewski; PNSen- sor GmbH, Germany; M Porro, R Richter, G Schaller, F Schopper;Max Planck Institut Halbleiterlabor, Germany; H Soltau; PNSensor GmbH, Germany; L Strüder, G de Vita; Max Planck Institut Halbleiterlabor, Germany;
Poster # 255
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