124 Wednesday AM ~Platform!
9:45 AM 517 Reconstruction of Atomic Resolution STEM Images Using the Diffraction-Imaging Method with an Aberration-Corrected STEM; E Okunishi,HSawada,Y Kondo; JEOL Ltd, Japan
10:00 AM Coffee Break
10:30 AM 518 ~Invited! Combining Scanning Transmis- sion Electron Microscopy and Electron Diffraction to Under- stand the Atomic Structures of Oxide Superlattices; A Shah; Arizona State University; B Nelson-Cheeseman, A Bhatta- charya; Argonne National Laboratory; J-M Zuo; University of Illinois at Urbana-Champaign; JCH Spence; Arizona State University
11:00 AM 519 The Influence of Film Thickness on the Microstructure of Nanocrystalline Nickel Films: A Precession Electron Diffraction Microscopy Study; S Rajasekhara, K Ganesh; The University of Texas, Austin; K Hattar, J Knapp; Sandia National Laboratory; P Ferreira; The University of Texas, Austin
11:15 AM 520 Automated Diffraction Tomography: A New Era for Electron Crystallography; A Stewart, E Mugnaioli, T Gorelik, I Andrusenko, U Kolb; Johannes Gutenberg- Universität Mainz, Germany
W E D N E S D A Y
11:30 AM 521 ~Invited! Oxide Surface Crystallography in Electron Microscopy; J Ciston, D Su; Center for Functional Nanomaterials, Brookhaven National Laboratory; Y Lin, L Marks; Northwestern University; Y Zhu; Brookhaven Na- tional Laboratory
A-15 Vendor Symposium: Tools for Science
Session Chairs: Thomas Nuhfer, Protochips Stephen Mick, Protochips PlatformSession
Wednesday 8:15AM Room: 109
8:15 AM 522 Performance and Application of an Aberra- tion Corrected Analytical Electron Microscope with a Cold Field Emission Gun; Y Kohno, E Okunishi, I Ishikawa, T Tomita, T Kaneyama, Y Kondo; JEOL Ltd, Japan
8:30 AM 523 STEM-based Technologies for Nano and Bio- logical Sciences; X Zhang; Hitachi High Technologies
8:45 AM 524 In SituMaterial Removal OverMany Orders of Magnitude; D Phifer,M Straw; FEI Company
9:00 AM 525 Advances in EELS Instrumentation: A New Design High-Vacuum Parallel EELS System; R Twesten, C Trevor,MBarfels, Y Sato, NMenon, P Thomas, A Gubbens; Gatan Inc
9:15 AM 526 Recent Developments in Silicon Drift Detec- tor Technology: Atomic to mm Scale; M Falke, S Scheller, A Kaeppel, R Terborg, R Kroemer, D Fissler,MRohde; Bruker Nano GmbH, Germany
9:30 AM 527 3 Dimensional Microscopy, Large Volume Serial Block Face Imaging in the SEM; J Mancuso; Gatan Inc
9:45 AM 528 Reducing Reagent Consumption and Improv- ing Efficiency of Specimen Fixation and Embedding, Grid Staining and Archiving Using mPrepTM Capsule Processing;S Goodman;Microscopy Innovations LLC;MKostrna;Madi- son Area Technical College
10:00 AM Coffee Break
10:30 AM 529 A to Z of Technology—Software for Better Results with Faster Sensors; S Burgess, J Goulden, A Hyde, D Redfern; Oxford Instruments, UK; N Rowlands; Oxford Instruments INC
10:45 AM 530 Retrofittable Nano-manipulation Systems for Scanning Electron Microscope; P Woo, M Nakamura, D Hoyle, I Cotton; Hitachi High-Technologies Canada Inc; Y Zhang, Y Zhang, B Chen, Y Sun; Mechanical Engineering, University of Toronto, Canada
11:00 AM 531 Is “There an App for That?” Take a Look at the New Portable Scanning ElectronMicroscopes; D Guarrera; JEOL USA, Inc; A Abe, T Miyahara; JEOL Technics Ltd, Japan; Y Ohta; JEOL Ltd, Japan
11:15 AM 532 The How and Why of Smart Features;R Anderhalt, T Nylese; EDAX Inc
11:30 AM 533 Development of 30-kV Cc/Cs Correction Tandem System; H Sawada, F Hosokawa, T Sasaki, S Yuasa, M Kawazoe, M Terao, T Kaneyama, Y Kondo; JEOL Ltd, Japan; K Kimoto; National Institute for Materials Science, Japan; K Suenaga; National Institute of Advanced Industrial Science and Technology, Japan
11:45 AM 534 Results on 20 kV Spectroscopy with Mono- chromation and In-Column Filter; S Pokrant, A Orchowski, G Benner; Carl Zeiss NTS, Germany; U Kaiser; Universität Ulm, Germany;MCheynet; Science et Ingénierie desMatéri- aux et Procédes, St Martin d’Heres, France
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