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that will be grown will be used in high-speed (up to 40 Gbit/s) active optical components, namely, Vertical Cavity Surface Emitting Lasers (VCSELs) and photodetectors. These devices will be used in fiber optic communications of the next generation, namely, optical interconnects of supercomputers, data centers, HDMI and DisplayPort optic cables, and future USB cables. The launch of the plant is scheduled for the spring of 2011.
Veeco to be Primary MOCVD Provider to Tsinghua Tongfang LED Factory
The Chinese firm placed a large multi-tool order for the TurboDisc K465i in August and the reactors will be housed in a new LED production facility in NanTong.
Beijing-based Tsinghua Tongfang Company has selected Veeco Instruments as its primary supplier of Metal Organic Chemical Vapor Deposition (MOCVD) systems.
The tools will be used in the firm’s new light-emitting diode (LED) factory. Veeco booked the initial systems from a large multi-tool purchase order earlier this month.
Wang Lianghai, VP of Tsinghua Tonfang commented, “After thorough evaluation of available MOCVD systems at our Beijing LED R&D site, we selected Veeco as our primary supplier for our new production facility in NanTong which is scheduled to be completed by the end of this year. The TurboDisc K465i MOCVD systems were the clear winner in terms of cost of ownership and productivity. We have an aggressive plan to ramp production of LEDs primarily to address backlighting demand for TVs, and Veeco’s technology, tool performance and customer support best matched our needs.”
Bill Miller, Executive VP and General Manager of Veeco’s MOCVD Operations, commented, “Tsinghua Tongfang has put together an exciting new enterprise, moving from the lighting engineering business directly into the manufacture of LEDs. They have solid financial backing and an experienced technology team, and we are pleased to support their production ramp.”
Tsinghua Tongfang is part of Tsinghua Holdings and is a state-owned enterprise headquartered in
Beijing, China. The Company was established in 1997 and listed on the Shanghai Stock Exchange that same year, and is engaged in information technology, energy and environment industries.
InGaP CQDs Make Compact Fully Integrated PICs
SPIE eesearchers have used InGaP colloidal quantum dots and unconventional fabrication techniques to produce cheaper, smaller PICs integrated onto a single chip.
Researchers at SPIE have found a novel way of producing Photonic Integrated Circuits (PICs), which are expected to play a crucial role in next- generation computing and communication systems.
The photons in PICs carry out signal processing and over the last decade, significant progress has been made towards realizing all-optical circuits on a chip. The major hindrances though, remain integrating active and passive photonic components, integrating photonic devices with silicon electronics, and the large footprint of PICs.
The first two issues have been addressed using techniques such as regrowth, wafer fusion, and asymmetric twin-guide technology. To address the large footprint, researchers have moved to a silicon- on-insulator process whose large refractive-index contrast enables realization of compact waveguides and waveguide bends. More recently, plasmonic waveguides have also been explored to circumvent the diffraction limit.
Yet another challenge in achieving low-energy, all- optical processors is the weak optical nonlinearity of semiconductors. Quantum dots have been touted as an attractive alternative in this context because of their large optical nonlinearities. Most quantum- dot-based photonic systems realized to date have used dots grown using Molecular Beam Epitaxy (MBE).
More recently, colloidal quantum dots synthesized using simple chemistry have received much attention because of their low cost of production, wide range of accessible wavelengths, compatibility with silicon technology, and high quantum yield, especially for applications in bioimaging, LEDs, and
August/September 2010
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