news digest ♦ compound semiconductor ♦ product news
Hosseini, whose coverage will include names such as Applied Materials, ASML Holdings, Teradyne and First Solar, will be based out of SFG’s San Francisco office.
“Mehdi is a welcome addition to SFG’s growing Technology research team - which consists of Jeff Fidacaro (Consumer Technology and Hardware), Marianne Wolk (Internet), Jamie Friedman (IT Services/Outsourcing), C. Ming Zhao (Chinese Internet and New Media) and Chris Caso (Semiconductor Devices),” said Mike Towey, SFG’s Director of Research.
“The addition of Mehdi brings us to 24 senior fundamental analyst teams in six major industry sectors (Financial, Consumer, Healthcare, Energy, Industrials, and TMT). Mehdi’s coverage of the CleanTech and Semiconductor Capital Equipment sectors is the perfect complement to our Technology team and will further leverage our technology trading efforts, led by Pat Quinn,” added Towey.
“Mehdi’s ability to effectively leverage his personal industry expertise to differentiate and deepen his analysis is one of the reasons our clients hold him in the highest regard,” stated Cory Carlesimo, SFG’s Head of Equities. “Mehdi joins a deep and talented technology team that we have grown commensurate with our clients’ interest in the sector.”
For the last six years, Hosseini has worked at FBR Capital Markets, where he was a top ranked analyst covering the CleanTech and Semiconductor Capital Equipment sectors. Before joining FBR, he spent four years at SoundView Technology Group, where he was a senior analyst covering the Semiconductor Capital Equipment sector. Hosseini’s prior experience included five years at National Semiconductor as a senior design engineer. Hosseini earned his MBA from Carnegie Mellon University and his Masters and Bachelor of Science degrees in Electrical Engineering from the University of Florida.
Hosseini’s appointment follows a number of significant U.S. equity research senior analyst hires in the last six months, including Chris Caso for the Semiconductor Devices sector.
RFMD Next-Generation PAs In High Demand
The next-generation WCDMA/HSPA components and power amplifiers will be shipped in volume to smart phones and 3G device manufacturers, particularly in the Far East.
RF Micro Devices, a global provider of high- performance radio frequency components and compound semiconductor technologies, has commenced high-volume production shipments of its RF720x WCDMA/HSPA+ power amplifiers (PAs). The modules will meet the demands of smart phone and 3G device manufacturers in Korea and China.
The RF720x product family is currently supporting multiple new data-centric devices, and volume shipments are forecast to increase materially in calendar 2010.
RFMD’s RF720x PAs maximize efficiency across all major 3G frequency bands (1-6, 8-11, 33, 34) to extend battery life in both voice and data operation. The RF720x PAs also are also claimed to feature the industry’s highest mid-power to high-power switch point, enabling further improvement in efficiency and higher data throughput in mid-power data modes up to 19 dBm - several decibels better than current competitive offerings.
The higher mid-power switch point is especially critical to manufacturers of next-generation 3G/4G smart phones, as they seek greater reductions in output power in data-only operation. Also, by optimizing all switch points (low-power, mid-power and high-power) for data-centric smart phones, the
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www.compoundsemiconductor.net August/September 2010
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