This page contains a Flash digital edition of a book.
news digest ♦ compound semiconductor ♦ industry news


A long-established premier provider of wafer bonding, alignment and handling equipment to MEMS-focused customers in industry as well as academia - 27 of the world’s top 30 MEMS manufacturers use its equipment - EVG has leveraged its success in this arena to migrate into key emerging technologies, including 3D ICs and light-emitting diodes (LEDs).


Since EVG first entered the 3D IC market in 1999, it has quickly grown its market share, securing numerous competitive orders. In the last year alone, multiple customers in North America, Asia Pacific and Europe purchased EVG systems for both R&D and production applications.


The company has also taken a leading role in driving 3D market evolution, co-founding the EMC3D Consortium in 2006 to commercialize a cost-effective, manufacturable through-silicon via (TSV) interconnection process for 3D chip stacking. The consortium has continued to gain momentum, adding new members and is aggressively targeting to drive cost of ownership of TSVs below US$150.


Most recently, at the IEEE International Interconnect Technology Conference, SEMATECH and EV Group presented initial results following the installation of a fully-automated GEMINI wafer bonder announced at SEMICON West 2009. A fully automated 300-mm EVG GEMINI production wafer bonding system was installed at SEMATECH’s 3D Research and Development Center at the College of Nanoscale Science and Engineering on the University at Albany (N.Y.) campus. The system integrates four types of wafer bonding - thermo compression, fusion, temporary and chip-to-wafer - in one tool, enabling ultimate R&D flexibility.


With the launch of its EVG560HBL fully automated wafer bonding system, EVG’s newest key target market is high-brightness LEDs (HB-LEDs). According to a forecast by market researcher Strategies Unlimited, the HB-LED market is expected to grow more than 50% this year, reaching $8.2 billion in revenues. The new EVG system delivers the higher capacity needed to accommodate the technology’s rapid growth, while capitalizing on EVG’s 30 years of wafer bonding experience to meet device makers’ demand for manufacturing techniques that mirror those used in the semiconductor industry.


106 www.compoundsemiconductor.net August/September 2010


As EVG approaches its 30th anniversary, the company continues to expand its global presence while targeting important customers whose work ranges from high-volume production all the way down to small-volume/R&D environments. To ensure its ability to meet these wide-ranging customers’ needs, the company recently rolled out its EVG610 mask and bond aligner, a lower- cost system with greater process versatility that will enable universities and research institutions to attain cost and system flexibility without sacrificing quality of results.


Concentrix Solar Expands Market Presence in the U.S.


The III-V CPV system provider for utility-scale solar power plants is preparing for growth in the U.S. with a new office, additional staff and CEC listing.


Strengthening its presence in the U.S. market for solar power plants, German firm Concentrix Solar, a worldwide supplier of concentrator photovoltaic (CPV) systems has announced its latest plans for expansion.


Concentrix Solar manufactures GaInP/GaInAs/ Ge based triple-junction solar cells where three different types of solar cells are stacked on top of one another. Each cell type is sensitized to convert a certain spectral region of the solar radiation: short wave, medium wave and the infrared range. The efficiency of these cells is as much as 38%.


A division of the Soitec Group, Concentrix Solar has launched a U.S.-based subsidiary, hired additional industry professionals and won listing from the California Energy Commission. The firm’s utility- scale power plant technology is ready for large scale deployment with all the key capabilities in place for increasing the company’s business in the U.S.


“With the development and growing importance of solar farms in the U.S., the time is right for us to form our U.S. venture,” said Hansjörg Lerchenmüller, CEO of Concentrix Solar. “Due to our CPV technology’s extreme efficiency, modularity and flexibility, we are prepared to meet the needs and challenges of the U.S. market.”


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136  |  Page 137  |  Page 138  |  Page 139  |  Page 140  |  Page 141  |  Page 142  |  Page 143  |  Page 144  |  Page 145  |  Page 146  |  Page 147  |  Page 148  |  Page 149  |  Page 150  |  Page 151  |  Page 152  |  Page 153  |  Page 154  |  Page 155  |  Page 156  |  Page 157  |  Page 158  |  Page 159  |  Page 160  |  Page 161  |  Page 162  |  Page 163  |  Page 164  |  Page 165  |  Page 166  |  Page 167  |  Page 168  |  Page 169  |  Page 170  |  Page 171  |  Page 172  |  Page 173  |  Page 174  |  Page 175  |  Page 176  |  Page 177  |  Page 178  |  Page 179  |  Page 180  |  Page 181  |  Page 182  |  Page 183  |  Page 184  |  Page 185  |  Page 186  |  Page 187  |  Page 188  |  Page 189  |  Page 190  |  Page 191  |  Page 192  |  Page 193  |  Page 194  |  Page 195  |  Page 196  |  Page 197  |  Page 198  |  Page 199  |  Page 200  |  Page 201  |  Page 202  |  Page 203  |  Page 204  |  Page 205  |  Page 206  |  Page 207  |  Page 208  |  Page 209  |  Page 210  |  Page 211  |  Page 212  |  Page 213
Produced with Yudu - www.yudu.com