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May, 2016 Eplan Releases Version 2.5 of Harness proD
Schaumberg, IL — Eplan Software has released version 2.5 of its Harness proD wire harness engineering soft- ware. The program has been updated with a range of enhancements for nailboard design, cable routing and project management. A highlight of the latest version
is the coupling of the 3D wire harness engineering system to the Eplan plat- form’s central parts management. Users have only one central parts management system that they are then able to access over the entire course of a project. This significantly reduces the effort of maintaining mas- ter databases, and it enables continu- ous workflows from schematics
through production documentation. Master data workflows have been fur- ther optimized through the derivation
of 2D symbols — required for nail- board drawing — from existing 3D data. This is particularly useful because 3D component data is already required. Existing data then gets reused and manual creation of compo- nent symbols is unnecessary. The program aims to provide a
Eplan’s proD wire harness design program.
user-friendly 3D system for wire har- ness design. For example, by posi- tioning a component, such as a con- nector, within the 3D space enables the selection of reference point, edges and areas. A preview function helps users to achieve correct positioning on the first attempt, avoiding the need for subsequent adjustment. Those familiar with AutoCAD sym-
bols can look forward to a much improved import function. Also, imported DWG and DXF drawings can be edited in version 2.5 and all their relevant content extracted. In addition, the new version
allows for the fixing of a 3D object’s position, the option to start a new bun- dle in existing bundles, and automati- cally routs cables. Wire coloring can be displayed in the connector symbol on the nailboard. As well, the program has separated its “data layer” from its “display layer” to allow for flexibility in nailboard design —drawings can be viewed differently without having to change the data. The program now also supports the batch processing of
updates. Contact: Eplan Software &
Advanced Automated Bondtesting
The Nordson DAGE 4800 bondtester with camera assist automation
The Nordson DAGE 4800 brings the latest developments in
automated wafer testing technology to users testing wafers from 200mm to 450mm in diameter
Key Features:
Wafer handler integration for fully automatic testing
SECS-GEM compatible
Flexible map creation tool enables quick test set-up
Services LLC, 425 N. Martingale Road, Suite 470, Schaumburg, IL 60173 % 630-408-3863 fax: 847-240-4667 E-mail:
siebert.c@eplanusa.com Web:
www.eplanusa.com
See at Wire Tech Expo, Booth 1126
Panasonic: Forward Thinking Beyond SMT
Rolling Meadows, IL — Panasonic Factory Solutions Company of Amer - ica exhibited under the slogan "Total Solutions Beyond SMT" at IPC APEX 2016 in Las Vegas. In sync with the show's "Forward Thinking" theme, the company performed a few notable feats, which include being the first to print and place 0250125 microchips at the show, and hosting the first live demo of its total solutions integration within PanaCIM®. The company also introduced three new software solu- tions for WIP, workforce monitoring, and simple AOI. The "Beyond SMT" strategy
ParagonTM is an intelligent software package at the
heart of the 4000Plus, Optima and 4800 series bondtesters. The latest generation includes camera assist automation for fully automatic testing:
Integrated cameras aid set-up of automation patterns
Fiducial recognition aligns samples with linear and angular correction
Automated testing adds repeatability and reproducibility to your results by removing operator input
ParagonTM - Automated Bondtesting Software
exemplified IoT-readiness by incorpo- rating and integrating storage sys- tems, stencil and PCB cleaning, con- veyance, screen printing, SPI, AOI, and reflow. In addition to the total solution for "Any Mix Any Volume" demonstrations, the company un veiled its new NPM-VF. The mach ine, based on the NPM concept, has been designed to provide superior flexibility and application versatility to automo- tive and other industrial users — in particular, industry segments faced with extreme odd-form or application changes. The new platform incorpo- rates many features of the NPM series, such as tape feeders and nozzles. The company's booth also incorporates pro- gram generation, NPI, LED binning, labor-saving automation, applications support, pin-through-hole, odd-form, manual assembly, material manage-
ment, and cleaning. Contact: Panasonic Factory
Solutions Company of America, 1701 Golf Road, Suite 3-1200,
www.nordsondage.com I
globalsales@nordsondage.com
Rolling Meadows, IL 60008 % 847-637-9600 E-mail:
pfsa.tac@us.panasonic.com Web:
www.panasonicfa.com
See at NEPCON China,
Booth 1F45 and SMT Hybrid Packaging, Booth 7-329
See at NEPCON China, Booth 1J30 and SMT Hybrid Packaging, Booth 7A-329
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