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May, 2016


Ersa Launches Printer, Selective Solder and Rework Systems


Wertheim, Germany — Ersa GmbH, a supplier of soldering equipment, has launched a range of updated machines for high-flexibility, high- throughput solder processes. These include the Versaflow 3/45 and 4/55 selective soldering sys- tems, Hotflow 3/20 Voidless module, Versaprint S1-3D stencil printer, HR 550 hybrid rework sys- tem, and the iTool HP 250 soldering iron. The Versaflow 3/45 is an in-line selective sol-


dering machine with dual-track transport. One of the company's most popular machines, the system now comes with Versascan and Versaeye. The Versascan module is able to recognize barcodes on printed boards or carriers that are assembled


incorrectly to exclude them from processing. The Versaeye inspects solder joints and has been designed for wave and selective soldering systems, is compatible with workpiece carriers, and allows for modular inspection: bottom, top, or bottom and top. The system is also available with up to nine cameras per module. The new Versaflow 4/55 is a selective solder-


Versaflow 3/45 selective soldering system.


ing system for large and complex board assem- blies. Due to its modular design, preheat and sol- der modules can be incorporated. Each module runs autonomously through its configured pro- grams, which eliminates set-up time and operator intervention.


With the Hotflow 3/20 Voidless,


the company presents a process-effi- cient solution to the problem of voids. The high-throughput, in-line module has short process times and low oper- ating costs. The module can be acti- vated and deactivated at any time and can reduce the occurrence of voids in the soldering process by up to 98 percent. The Versaprint S1-3D stencil


printer combines printing and 3D SPI in one compact system. Expan - ding on the previous 2D models, the stencil printers with post-print inspection have established them- selves firmly in today's market. The new model incorporates even more process control and still keeps the same minimal floorspace require- ments as its predecessor. The HR550 hybrid rework sys-


tem is designed to provide high-per- formance rework for professionals. With a 1,500W hybrid heating head, the large-area IR bottom has heating in three zones and includes an inte- grated vacuum pipette for component removal and placement. Computer- aided component placement and adjustment, as well as an integrated force sensor make the system power- ful and accurate. The company also offers its


iTool HP 250, a 250W soldering iron. This high-power model has been designed to operate with Ersa's multi-channel soldering and desol- dering stations, iCon Vario 2 and 4, and all 10 tools are interchangeable


between stations. Contact: Kurtz Ersa North


America, Inc., 1779 Pilgrim Road,


Plymouth, WI 53073 % 920-893-1779 fax: 920-893-1562 E-mail: ernie.grice@kurtzersa.com Web: www.ersa.com


See at NEPCON China Booth 1F35 and


SMT Hybrid Packaging, Booth 7-117


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