May, 2016
www.us-
tech.com
Page 81 Henkel Intros Liqui-Form® One-Part Gel
Irvine, CA — Henkel Adhesive Technologies has added to its line of Bergquist Liqui-Form® thermal interface materials (TIMs) with the Liqui-Form 3500. A one-part, thermally conductive, liquid- formable gel, the material combines high thermal conductivity with process flexibility and repeata- bility.
Designed to provide a balance between dis-
pensability, low component stress and to enable rework, the material has a conductivity of 3.5W/m- K in a formulation that accommodates today's manufacturing environments. The viscosity of the material is stable and is maintained during stor- age, processing and within the application. In many cases, Liqui-Form gels are a suitable
replacement for traditional thermal interface pads. With assemblies that have numerous small parts, manually placing multiple pads is cumber- some, labor-intensive, and can introduce unneces- sary mechanical stress during final assembly. In applications with high-value boards that require end-of-line rework, the material is quickly removed with a wipe and a final clean. Its low adhesion stress minimizes the risk of damage when disassembling the part, which allows manufacturers to preserve the
Harting: U.S. Will Drive Industry 4.0 Digitalization
Elgin, IL — Harting Technology Group, a provider of intelligent and high-performance connection tech- nology, says that it sees the U.S. as the driving country in digitalization for the Industry 4.0 movement. According to Dr. Frank Brode, Harting's senior vice president of new technologies, processes, busi- ness models and entire sectors will either be forced to change or become obsolete. The company recognizes an
enormous potential for Industry 4.0 in the U.S. due to the focus on re- industrialization of the economy. This trend is the most important driving force behind its business. Driven by IT and software, the U.S. economy offers huge opportunities for Harting as suppliers of solutions for machines, plant construction, and integrated industry experts. The company is positioning itself to bring together both the cyber and physical worlds. The company recently became a
member of the Industrial Internet Consortium (IIC), which was found- ed in Needham, Massachusetts by AT&T, Cisco, GE, IBM, and Intel, in 2014. The IIC is focused on develop- ing internet technologies for the industrial market. The company has also partnered with MIT, as part of its continued effort to invest in new technology. Harting has recently hired a
director of technology development who will be responsible for directing all North American research activi- ties, new technologies and projects. The company will also open a pro- duction plant later this year in Silao, Mexico, that will focus on overmold-
ed cables and cable harnesses. Contact: Harting North
America, 1370 Bowes Road, Elgin, IL 60123 % 847-717-9217 E-mail:
christina.chatfield@
harting.com Web:
www.harting.com
See at EDS, Trinidad A See at NEPCON China, Booth 1H15 and SMT Hybrid Packaging, Booth 7A-313
integrity of the PCB. The material is pre-cured and has a higher
viscosity than conventional thermal greases, which keeps it from migrating or "pumping out" over time. In addition, the material has low volu- metric expansion and stability in continuous use at temperatures as high as 200°C (392°F). Due to its low ionics, the material reduces the threat of any potential electrical issues. Liqui-Form products simplify the procure-
ment process as well as inventory management. The ability to source a single material as opposed to numerous thermal interface pads streamlines the BOM, saves time and lowers cost. Because these one-part formulations are fully cured, there
is no mixing, refrigeration, or post-curing required. Contact: Henkel Electronic Materials LLC,
14000 Jamboree Road, Irvine, CA 92606 % 714-368-8000
E-mail:
doug.dixon@henkel.com Web:
www.henkel-adhesives.com
Henkel Liqui-Form thermal interface material.
See at SMT Hybrid Packaging, Booth 7-349
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