May, 2016
Rapid.Tech 3D Printing Trade Forum
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Erfurt, Germany, from June 14-16, will go a step further with high-cal- iber speakers. Taking place on the third day of the event, it will illus- trate developments in the 3D print- ing of electronic components and con- ductor tracks for AM-manufactured parts. In the first presentation, Robin
A. Kruger of LPKF Laser & Electronics AG will give an overview of the most notable technologies for the production of MIDs (mechatronic integrated devices). He will also dis- cuss laser direct structuring (LDS) and introduce various LDS-MIDs that have already been produced, and show examples from the consumer electron- ics, automotive, and research sectors. Mr. Kruger will present approaches to combining LDS processes with AM technologies, such as fused deposition modeling (FDM) and selective laser sintering (SLS). Dr. Martin Hedges of Neotech
AMT GmbH will speak on the cur- rent state of technology for integrat- ing electronic functions in 3D printed substrates, which will enable elec- tronic systems to be manufactured entirely by 3D printing. His presen- tation will include a solution for the 3D printing of complex electronic cir- cuits, antennae, and heat sensors. Michael Bisges of Plasma
Innovations GmbH will introduce digital direct metallization as a new approach for circuit boards. This process uses digital design data to enable electrical circuits and conduc- tor tracks to be applied directly, and in-line, to the surface of virtually any material. In addition, Aarief Syed-Khaja,
chair of the department of manufac- turing automation and production systems technology at the University of Erlangen-Nuremberg, will report on an innovative approach to manu- facturing ceramic circuit carriers for high-temperature electronics using selective laser melting (SLM). The 13th Rapid.Tech interna-
tional trade show and conference for additive manufacturing is also host- ing the trade forums “Additive Contract Manufacturing”, “3D Metal Printing” and “Automotive Indus - try,” permitting intensive profession- al exchange on specific AM topics. Web:
www.rapidtech.de
NEPCON China 2016
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nies will show their strength and original solutions there and promote their services. According to consulting firm
Prismark, the global PCB industry will reach $72 billion in 2016, with China accounting for about 36 per- cent of the total. Many Chinese prod- ucts are limited in variety and do not contain the same advanced technolo- gy as in other countries. NEPCON China will see the launch of a new PCB zone, to round up the industry’s leading suppliers, to share cutting- edge technologies and concepts. Web:
www.nepconchina.com
www.us-
tech.com
Nuremberg, Germany — Visitors to the SMT Hybrid Packaging trade fair, the International Exhibition and Conference for System Integra - tion in Microelectronics, can look for- ward to a diverse program and many new highlights this year. The new hall layout introduced
last year has been well-received. Because of that success, this year’s show will be laid out the same way. Also, the priority areas following the value chain have been structured to provide a sense of order for atten- dees. In hall 6, the topics of system development and production prepa- ration as well as materials and com- ponents will be presented. Hall 7 will contain processes and Manufac -
turing. The new Hall 7A will show- case products and services pertain- ing to reliability and test, and soft- ware and production control. Another highlight of the show
this year is the production line, “Future Packaging”. It is organized by the Fraunhofer (IZM) and will operated under the slogan, “Living the Digital Age: Work and Home in a Networked World.” Visitors will be able to see each individual produc- tion step during the exhibition. The joint stand “Optics Meets
Electronics”, led by Fraunhofer (IZM), will offer products and solutions from the optoelectronics sector, and will be located in hall 7A. Exhibitors will present the latest developments in the
Page 117 SMT Hybrid Packaging 2016 Highlights
fields of automotive communications, optical sensors and sensor systems, optical communications, optical analy- sis and detection, and optical process management. The “High-Tech PCB Area”
introduced successfully at last year’s exhibition will be brought together with the “EMS Intersection,” which has been established for years. Grouping the areas together provides visitors with a one-stop solution for PCB parts and assembly. The SMT Hybrid Packaging
Exhibition covers the whole process chain from initial idea to develop- ment and design, as well as manufac- turing and assembly. Web:
www.smthybridpackaging.com
BUSINESS AS USUAL
DEFINITELY NOT
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