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www.us-
tech.com
May, 2016
Cicor Launches Clean Line at Microassembly Site
Cambridge, MA — The Cicor Group, a provider of outsourcing services and complex PCB production, has opened a new clean line at the company's microelectronics and substrates divi- sion site in Radeberg, Germany. The facility offers PCBs, thin- film, thick-film, and micro - assem bly and packing serv- ices. The state-of-the-art production line comple- ments the company's AMS service portfolio and rounds off its process chain. After investing in the
highly-efficient, automated production line, the compa- ny now caters to the most stringent of customer re - quirements in the area of microassembly. The production facility
assembly, the facility reportedly has an accuracy in assembly of ±7µm (with 3 sigma) for dies and flip chips, as well as providing dispensing and underfill capabilities. The clean pro- duction line's high-speed dispenser
allows the company to offer a comprehensive range of microassembly services, from techni- cal advice in development and engi- neering, to prototyping, assembly, packaging, screening, and testing. Also, the company is able to
solder surface-mounted devices and flip chips in parallel. The facility offers precision, low cycle times and high yields in cleanroom conditions (ISO 7). In addition to SMD 01005
Cicor's new cleanroom production facility in Radeberg, Germany.
can be equipped with two valves at a time and can include jet, spindle and
time-pressure dispensers. Contact: Cicor Americas, Inc., 185 Alewife Brook Parkway, Suite
410, Cambridge, MA 02138 % 617-576-2005 E-mail:
info-americas@cicor.com Web:
www.cicor.com
See at SMT Hybrid Packaging, Booth 6-322
Indium Introduces See at SMT Hybrid Packaging, Booth 7A319
Clinton, NY — Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste, which has been formulated to provide non-wet open performance on large, high I/O electronic packages, such as micro- processors. In addition to its resistance to non-wet opens, the paste also deliv-
Rugged connectors and backplanes you can rely on.
Indium10.8HF Solder Paste
ers a superior oxidation barrier, which allows for reduced head-in-pil- low (HiP) defects and improved grap- ing performance. It also performs well during stencil printing, especial- ly for small components (01005) and fast printing speeds, such as >125mm/s. The solder paste is part of the
company's family of high-perform- ance, lead-free, low-voiding, no-clean solder pastes that help manufactur- ers "Avoid the Void™". Indium is a materials manufac-
turer and supplier to the global elec- tronics, semiconductor, thin-film, thermal management, and solar
Connectivity
Rugged ectivity
ugged DIN
RelReliable Mezz
Mezzanine Conn
Connectivity
Indium solder paste for the
fine stencil printing of small components.
Make your vision a lasting reality. When you are in need of a reliable and efficient connector less than 100% quality is not acceptable (gold plating capabilities available). HARTING’s connectors and backplanes are made for meeting high expectations. Challenge HARTING’s local design team to develop a solution for your backplane and connectivity needs.
HARTING-usa.com See at EDS, Trinidad A and Booth 400
markets. Its products include solders and fluxes, brazes, thermal interface materials, sputtering targets, indi- um, gallium, germanium, and tin metals, as well as organic com-
pounds. Contact: Indium Corp., 34
Robinson Road, Clinton, NY 13323 % 315-381-7524
E-mail:
abrown@indium.com Web:
www.indium.com
See at SMT Hybrid Packaging, Booth 7-331
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