May, 2016
www.us-
tech.com
Page 73 Rehm Improves VisionXP+ Reflow Soldering System
Blaubeuren-Seissen, Germany — Rehm Thermal Systems has im - proved on its successful VisionXP+ reflow soldering system, and now offers it with greater energy saving capacity, an optional vacuum unit, and with a second pyrolysis stage included. The VisionXP+ now has the abil-
ity to provide greater heat transfer efficiency, as well as lower emissions. This allows for environmentally- friendly production and lower operat- ing costs. Optimized insulation and gas regulation lower heat loss and reduce nitrogen consumption during the processes. The system allows cus- tomers to save up to 20 percent of their energy use during manufacturing, and
cut CO2 emissions by an average of 10 metric tons per year. The new vacuum unit makes it
possible to achieve void-free convec- tion soldering in a single process. The VisionXP+ Vac reliably removes gas inclusions and voids during the sol- dering operation itself —while the sol- der is still in its melted state. A vacu- um of up to 2 mbars enables void rates of less than 2 percent. Pressure and speed can be controlled separately. The system allows for more efficient production and greater stability. Costly post-processing using an exter- nal vacuum system is no longer neces- sary, since the workpieces are passed directly from the peak zones to the vacuum process. A second pyrolysis stage, inte- grated beneath the inflow and outflow
Test Research to Introduce New Lineup of Inspection
areas enables effective residue man- agement. Residual material can be
removed easily from the system. The first pyrolysis stage cleans the process
gas from the preheating zones, while the second stage cleans the gas from the peak zones. This means that the purification level is significantly high- er, while the process chamber remains clean and dry. With a single change of granules per year, maintenance is
reduced to a minimum. Contact: Rehm Thermal
Systems, LLC, 3080 Northfield
Place, Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 E-mail:
p.handler@rehm-group.com Web:
www.rehm-group.com
See at NEPCON China, Booth 1E50 and
VisionXP+ with Vacuum.
SMT Hybrid Packaging, Booth 7-451
Systems San Jose, CA — Test Research, Inc. (TRI) is introducing a new generation of SPI, AOI, AXI and ICT inspection solutions at NEPCON China. Most notably, the company is exhibiting a top-of-the-line 3D AOI system with advanced 3D solder fillet inspection, designed for the most demanding industry applications. Also from TRI are the stop-and-
go 3D SPI TR7007Q and the all-new TR5001 SII in-line multi-core paral- lel ICT. The complete inspection line- up includes the CT-capable 3D AXI system, TR7600XLL SII CT, the hybrid AOI TR7700 SII Plus, and the TR5001 SII Tiny ICT solution for standalone deployment with parallel testing. The company's test and inspec-
tion solutions work together with Industry 4.0 data-based YMS 4.0 management infrastructure to bring maximum value in the production line. The systems are designed to interoperate with other manufactur- ing equipment to minimize down- time, optimize production quality,
and reduce operator workload. Contact: Test Research, Inc.,
1923 Hartog Drive, San Jose, CA % 408-567-9898 fax: 408-567-9288
E-mail:
triusa@tri.com.tw Web:
www.tri.com.tw
See at NEPCON China, Booth 1H38 and
SMT Hybrid Packaging, Booth 7-231
See at NEPCON China, Booth 1H30 and SMT Hybrid Packaging, Booth 7-328
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120