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hi-TeCh evenTS www.us- tech.com


NEPCON China 2016 — The Dawn of a New Technological Era


Shanghai, China — NEPCON China is a key industry event, which covers SMT, electronics manufacturing automation and PCB. This year, the Chinese government’s national re - form process will extend to electronics manufacturing as the more popular catchphrases “smart manufacturing”, “energy efficiency”, “green technolo- gy”, “cross-disciplinary transition”, and “information security” take hold. The launch of the China Manu - facturing 2025 initiative is driving Industry 4.0 growth in the country, as the Internet integrates with industry to promote smart production. China is facing more demand


than ever for electronic products. According to post-event statistics from 2015, NEPCON China 2015 attracted nearly 22,000 high-end buyers from different industries throughout China. The numbers of event participants has continued to grow. This year, to accommodate vis-


itors, the exhibition area has been expanded from 25,000 to 30,000 square meters, which is roughly 90,000 to 108,000 square feet, and will extend into an additional hall. With the recent launch of the


Chinese version of the Industry 4.0 strategy through China Manufac - turing 2025, a new round of industry upgrades is soon expected. Going for- ward, electronics manufacturers will have to address a range of issues. Given the economic slowdown, those in the industry must focus on collab- oration and shared resources. The exhibition offers many fea-


ture discussions and high-end forums suited to a variety of needs, including industrial automation, materials, smart hardware, LED, ESD, PCB, etc. With rising process and labor


costs, many Chinese manufacturers are facing serious bottlenecks. The trend is toward automation and more


Rapid.Tech to Debut 3D Printing Trade Forum


Erfurt, Germany — Until recently, additive manufacturing (AM) pro - cesses and 3D printing have focused mainly on the creation of geometri- cally complex, mechanical compo- nents made of plastic, metal or ceramic. Rapid.Tech’s new “Elec - tronic Engineering” trade forum will showcase and discuss the 3D print- ing of electronic components and conductor tracks on any substrate. AM and 3D printing make it


possible to manufacture complicated shapes that cannot be produced with conventional technology, and to inte-


grate different mechanical and ther- modynamic functions into compo- nents during the development phase. With such capabilities, they are being increasingly examined as key technologies for Industry 4.0 and digitalization. AM has already been estab-


lished as a manufacturing technolo- gy for mechanical series production components in fields such as aviation and medical technology. The inaugu- ral “Electronic Engineering” trade forum at this year’s Rapid.Tech in


Continued on next page 2016 EDITORIAl CAlENDAR ISSUE Jan/Feb March April/May EDITORIAL


Test & Measurement Electronics West/MDM PP


Production & Packaging APEX PP


SMT & Production SMT/Hybrid/PKG PP Nepcon China PP EDS PP


June July August


Components & Distribution ATX East /MDM PP Test & Assembly


Semicon West/Intersolar PP


Production & Packaging Nepcon South China PP


September PCB & Test SMTAI PP


October October


Nov/Dec Nov/Dec


Components & Distribution Electronica PP


Test & Measurement Electronics West/MDM PP


PP= Product Preview


Test & Measurement Electronics West/MDM PP


Components & Distribution Electronica PP


Nepcon South China Autotestcon


SMTAI IMAPS


The Assembly Show Electronica FABTECH


MDM Minneapolis ATX Philadelphia IMAPS


ATX/ Electronics West/ MDM


The Assembly Show Electronica FABTECH


ATX/ Electronics West/ MDM


Aug. 23-25 Sept. 13-15


Oct. 11-13


Oct. 25-27 Nov. 8-11 Nov. 14-16


Feb. 14-16 Feb. 14-16


Sept. 27-28 Sept. 28-29 Oct. 5-6 Oct. 11-13


Oct. 25-27 Nov. 8-11 Nov. 14-16


Shenzhen, China Anaheim, CA


Pasadena, CA


Rosemont, IL Munich, Germany Las Vegas, NV


Rosemont, IL Minneapolis, MN Philadelphia, PA Pasadena, CA


Anaheim, CA Anaheim, CA


Rosemont, IL Munich, Germany Las Vegas, NV


SHOW DesignCon ATX/ Electronics West/MDM


APEX APEC ESC


Electronics New England


Nepcon China SMT/Hybrid/PKG MFG 4 EDS


Wire Processing Tech ATX East /MDM


SEMICON West/Intersolar DATE


Jan. 19-21 Feb. 9-11


March 15-17 March 22-24 April 13-14


April 26-28 April 26-28 May 3-5 May 10-12 May 11-12


June 14-16 July 12-14 LOCATION


Santa Clara, CA Anaheim, CA


Las Vegas, NV Long Beach, CA Boston, MA


Shanghai, China Nuremberg, Germany Hartford, CT Las Vegas, NV Milwaukee, WI


New York, NY San Francisco, CA


efficient processing. With sensors, machine vision, controllers, drive con trol, and many other products seeing growing use in electronics manufacturing, and the drive toward efficiency and cost management, China is expected to see a wave of equipment replacement in the next two to three years. To answer the call of China


Manufacturing 2025, the country’s industry must strive for smarter


upstream manufacturing. Currently, Chinese OEMs and EMS companies are operating in a limited business scope, without cross-regional man- agement, and lacking complementa- ry industry and regional support. To address this need, the exhibition will include an EMS procurement center, which will gather together brand names and startups alike. Electron - ics processing and solutions compa-


Continued on next page


Trade Show Calendar MORE SHOWS: www.topline.tv/tradeshows.cfm


April 23-24, 2016, Microwave & RF. *Paris Expo Porte de Ver-sailles, Paris, France.


Contact: BIRP Groupe Solutions, 15 rue de l’Abbé Grégoire, 75006 Paris, France % +33-0-1-44-39-85-16 E-mail: s.cohen@infoexpo.fr Web: www.microwave-rf.com


April 25-29, 2016, Hanover Fair. *Hanover Fairground, Hanover, Germany. Contact: Deutsche Messe AG, Messegelande, 30521 Hanover, Germany % +49-511-89-0 fax: +49-511-89-32626 Web: www.hannovermesse.de


April 26-28, 2016, Nepcon China. * Shanghai World EXPO Exhibition and Convention Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd.,


42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail: tim.wang@reedexpo.com.cn Web: www.nepconchina.com


April 26-28, 2016, SMT Hybrid Packaging 2016. *Nuremberg Exhibition Centre, Nuremberg, Germany. Contact: Mesago Messe Frankfurt GmbH, Rotebuehlstrasse 83-85, D-70178 Stuttgart, Germany % +49-711-61946-0 fax: +49-711-61946-91


E-mail: smt@mesago.com Web: www.smthybridpackaging.com -or- Kallman Associates, Inc., % 201-652-70700 fax: 201-652-3898 E-mail: jerry@kallmanexpo.com


April 27-28, 2016, ACI Technologies: Applications and Electronics Manufacturing Expo. *ACI Manufacturing Factory, Philadelphia, PA. Contact: ACI Technologies, 1 International Plaza, Suite 600, Philadelphia, PA 19113 % 610-362-1200 E-mail: registrar@aciusa.org Web: www.aciusa.org


May 10-13, 2016, EDS. *The Mirage Las Vegas, Las Vegas, NV. Contact: EDS, 1111 Alderman Drive, Suite 400, Alpharetta, GA 30005 % 312-648-1140 fax: 312-648-4282 E-mail: eds@edsconnects.com Web: www.edsconnects.com


May 3, 2016, IMAPS New England. * Holiday Inn Conference Center, Boxborough, MA. Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000 fax: 919-287-2339 E-mail: modonoghue@imaps.org Web: www.imaps.org


May 4-5, 2016, MD&M Texas. * Fort Worth Convention Center, Fort Worth, TX. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: www.ubmcanon.com


May 11-12, 2016, Electrical Wire Processing Technology Expo. * Wisconsin Center,


Milwaukee, WI. Contact: Expo Production, Inc., 510 Hartbrook Drive, Hartland, WI 53029 %262-367-5500 E-mail: cheryl@epishows.com Web: www.epishows.com


May 26-28, 2016, SMT Hybrid Packaging. * NurnburgMesse, Nurenburg, Germany. Contact: Mesago Messe Frankfurt GmbH, Rotebuehlstrasse 83-85, 70178 Stuttgart, Germany % +49-711-61946-0 fax: +49-711-61946-92 Web: www.mesago.de


June 14-16, 2016, Rapid.Tech. *Messe Erfurt, Erfurt, Germany. Contact: Messe Erfurt GmbH, Gothaer Strasse 34, 99094 Erfurt, Germany % +49-361-400-0 fax: +49-361-400-1111 E-mail: rapidtech@messe-erfurt.de Web: www.rapidtech.de


July 12-14, 2016, SEMICON West. * Moscone Center, San Francisco, CA. Contact: SEMI, 3081 Zanker Road, San Jose, CA 95134 % 408-943-6900 fax: 408-428-9600 Web: www.semi.org


September 12-15, 2016, IEEE Autotestcon. *Disneyland Hotel, Anaheim, CA. Contact: Conference Catalysts, LLC, 4623 NW 53rd Avenue, Gainesville, FL 32653 % 352-872-5544 E-mail: cdyer@conferencecatalysts.com Web: www.ieee-autotest.com


September 25-29, 2016, SMTA International Conference and Exhibition. * Donald E. Stephens Convention Center, Rosemont, IL. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web: www.smta.org


October 25-27, 2016, The Assembly Show. * Donald E. Stephens Convention Center,


Rosemont, IL. Contact: BNP Media, 2401 W. Big Beaver Road, Suite 700, Troy, MI 48084 % 248-362-3700 E-mail: amy@theassemblyshow.com Web: www.theassemblyshow.com


November 8-11, 2016 electronica.*Messe München, Munich, Germany. Contact: Messe München GmbH, Messegelande, 81823 Munich, Germany % +49-89-949-20720 fax: +49-89- 949-20729 E-mail: info@messe-muenchen.de Web: www.messe-muenchen.de


May, 2016


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