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www.us-tech.com
October, 2016 Efficient Connectors Enable
Shrinking Medical Devices Continued from page 56
suppress these problems. Avoiding such late-stage modifications is an important consideration. Taking a new medical device of any kind through all the steps for regulatory approval is a time-consuming pro - cess. Therefore, R&D engineers must take all practical steps along the way to keep the product development cycle and time to market to a mini- mum.
Neu Dynamics Corp is an ISO 9001:2008 certified Tool, Mold and Die man- ufacturer
specializing in tooling and equipment used in building
Semiconductors, Electronics, components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications. We further offer small to medium volume contract molding services for
microelectronic packages such as BGA, QFN, MLP, optical components etc. We also have capability to provide insert molding services for items such as connectors.
CONTRACT MOLDING OVERMOLDING TOOLING
Phone 215-355-2460 CUSTOM MACHINING
MOLD DESIGN AND FABRICATION
WWW.NEUDYNAMICS.COM SALES@NEUDYNAMICS.COM
Fax 215-355-7365
Maximizing Space Another approach to maximize
space on the board and minimize weight is to employ mezzanine stack- able connectors on PCBs for routing power and signals. These miniature connectors using surface-mount tech- nology offer high contact density and are available in multiple stacking heights for board-to-board and board-to-cable applications. In the latter, insulation displacement (IDC) connectors for ribbon cables provide a high degree of freedom to system designers. Some scalable mezzanine connectors are particularly rugged. For example, HARTING’s har-
NDC International offers specialized equipment built for today's high-tech semiconductor assembly processes.
HANMI SEMICONDUCTOR
MPP MANUAL WIRE BONDERS
K&S CAPILLARIES K&S DICING BLADES
MASTER MACHINERY CUSTOM AUTOMATION RGT WAFER FRAMES
RGT MANUAL WAFER MOUNTER
WWW.NDC-INT.COM 9/1/16 10:50 AM Page 1
flex® family includes robust SMT flanges that can absorb considerable mechanical stress on the solder con- tacts, allowing repeated insertion
and removal. Combining this robust- ness with the ability to interconnect two circuit boards within any config- uration and a wide range of pin count (6 to 100 poles) provides the kind of flexibility needed by today’s design- ers of complex high density medical systems. These types of solutions
Harting’s har-flex family inter- connects two circuit boards in any configuration.
often provide manufacturing benefits by being both reflow solder and pick and place compatible. Contact: HARTING North
America, 1370 Bowes Road, Elgin, IL 60123 % 847-717-9217 E-mail:
christina.chatfield@
harting.com Web:
www.harting.com r
ON Semicon Adds Options for Low-Light Imaging
Transformers and Inductors Surface Mount (and Plug-In) Models
Over 5000 Std. Ultra Miniature
low profile from
Audio / 400Hz / Pulse Multiplex / Data Bus DC-DC Converter Transformers / Power& EMI Inductors
PICO units manufactured and tested to MIL-PRF-27 requirements. QPL units are available.
Delivery stock to one week for sample quantities.
VISIT OUR EXCITING NEW WEBSITE
www.picoelectronics.com
Featuring our easy-to-use product Search Wizard! MILITARY•COTS•INDUSTRIAL / TRANSFORMERS & INDUCTORS DC-DC CONVERTERS
www.picoelectronics.com 143 Sparks Ave., Pelham, New York 10803
See PICO’s full line catalog at PICOELECTRONICS, Inc.
Call Toll Free 800-431-1064 • FAX 914-738-8225 E Mail:
info@picoelectronics.com
.18" think...
ht.
Phoenix, AZ — ON Semiconductor is strengthening its position in low- light imaging solutions for industrial markets with the introduction of new products based on interline transfer electron multiplying charge-couple device (ITEMCCD) technology. The new 8 MP KAE08151 image
sensor is the second device to use the company’s ITEMCCD technology, delivering the same sub-electron noise floor and imaging versatility as the existing 1080p resolution KAE02150 image sensor. With a 22 mm (0.87 in.) diagonal (4/3 opti- cal format) that matches the imag- ing path of professional micro- scopes, the KAE08151 directly tar- gets high-resolution microscopy and scientific imaging applications operating in lighting environ- ments that can range from sub-lux to bright-light imaging. In addi- tion, a new packaging option is available for both devices in this family which incorporates a ther- moelectric cooler (TEC) directly into the package design. This inte- grated cooler simplifies develop- ment of a cooled camera that opti- mizes the performance available from these devices. ITEMCCD devices combine two
established imaging technologies with a specially designed output structure that enables a new class of low-noise, high-dynamic range imag- ing. While interline transfer CCDs combine superior image quality and uniformity with a highly efficient electronic shutter, this technology is not always ideal for very low-light imaging because of the overall noise floor of their outputs. Conversely, EMCCD image sensors excel at low- noise imaging, but historically have
been available only as low-resolution devices with limited dynamic range. Combining these technologies allows the low-noise architecture of EMCCD to be extended to multi-megapixel resolution image sensors for the first time, and an innovative output design allows both standard CCD (low-gain) and EMCCD (high-gain) outputs to be used for a single image
KAE08151 image sensor for both low- and high-gain imaging.
capture — extending scene detection from sunlight to starlight in a single image. The KAE08151 is sampling to -
day in Monochrome and Bayer Color configurations in a CPGA-155 pack- age, with samples incorporating an integrated TEC available in the first quarter of 2017. The KAE02150, al - ready in production, is now sampling in a CPGA-143 package that incorpo- rates an integrated TEC. All package options are RoHS-compliant. Contact: ON Semiconductor,
5005 East McDowell Road, Phoenix, AZ 85008 % 602-244-6600 Web:
www.onsemi.com
See at electronica, Hall A5 Booth 225
...think PICOsmall!
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