October, 2016
www.us-tech.com
Page 27
Nordson MARCH: Improved Treatment Uniformity for Wafer Processing
Concord, CA — Nordson MARCH has introduced a plasma confinement ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck. Using the confinement ring, there is a free
conductive path between the upper and lower elec- trodes in the wafer region, but no conductive path in the adhesive tape and wafer frame area. The ring is made with an insulated, non- conductive material, while the alu- minum-to-aluminum plasma conduc- tion path is confined to the wafer area. There is a 2 mm (0.08 in.) gap between the ring and the adhesive tape and wafer frame. Because there is no plasma generation or plasma to the bottom of the wafer and adhesive tape, undercutting and delaminating are minimized and there is no sput- tering or adhesive tape deposition on the wafer surface. According to the company, the
big difference between the company’s concept and most front-end systems
IEH Offers Line of Hyperboloid Connectors
Brooklyn, NY — IEH has developed a line of hyperboloid connectors and contacts, which are designed for use in the most demanding environments in- cluding military and aerospace. Hy- perboloid is an advanced, proven con- tact design that can reportedly with- stand the harshest applications.
Select Coat® SL-940
Confinement ring for wafer plasma treatment.
Whether large or small, we’ve got you covered
is the spacing and confinement method. The com- pany has minimized the gap between the ring edge and lower electrode, resulting in a smaller spread area. The overall chamber volume is reduced to only the area above the wafer. The plasma confinement ring is available
with Nordson MARCH’s SPHERE™ series of plas- ma systems. Plasma applications include de-scum, ashing, photoresist and polymer stripping, dielec- tric etch, wafer bumping, organic contamination
removal, and wafer de-stress. Contact: Nordson MARCH, 2470-A Bates
Avenue, Concord, CA 94520 % 925-827-1240 fax: 925-827-1189 E-mail:
info@nordsonmarch.com Web:
www.nordson.com
We’ve got a conformal coating solution that fits.
Hyperboloid connectors. These low-insertion force con-
nectors exhibit extraordinary immu- nity to shock and vibration, duty cy- cles exceeding 100,000 matings, im- proved current-carrying capability and very low contact resistance. The company provides its contacts and connectors in many different types of
modules and interconnect systems. Contact: IEH Corp., 140 58th
Street, Suite 8E, Brooklyn, NY 11220 % 718-492-4448 fax: 718-492- 9898 E-mail:
ieh@iehcorp.com Web:
www.iehcorp.com
See at electronica, Hall B3 Booth 472
Whether you run a small operation or manage an industry giant, Nordson ASYMTEK has the solution that’s right for you. Our conformal coating systems are built with state-of- the-art platforms, applicators, and software. They are backed by an award-winning, global network of service professionals and applications experts.
Please visit our website or contact us today.
info@nordsonasymtek.com nordsonasymtek.com/coating
ConexisTM CX-3040
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