October, 2016
www.us-tech.com
Panasonic Launches High-Speed Odd-Form Placement System
Rolling Meadows, IL — Panasonic Factory Solu- tions Company of America has introduced its NPM-VF, a high-speed, odd-form placement ma- chine designed to help manufacturers offset the in- creasing cost of global labor for complex manual assembly. The system, built on the company’s NPM plat-
form, introduces several new features that reduce labor and cost, while boosting productivity and the quality of through-hole and odd-form component insertions. The dual-gantry, multi-head, odd-form ma-
chine achieves 4,500 cph throughput within the nar- row footprint of a compact SMT mounter. The stan- dard vacuum nozzle handles a variety of packages and three additional process heads are available for components up to 130 x 35 x 60 mm (5.1 x 1.4 x 2.7 in.), and requiring 100N force.
Manufacturers can select a body
chuck for gripping large odd-form de- vices without a pick surface (e.g. power transformers), a lead chuck for gripping through-hole devices (e.g. electrolytic capacitors), and a swing nozzle for inserting through-hole de- vices oriented in packaging other than insertion orientation. Additionally, the flexible NPM- VF accepts myriad feeder types from
Engineered Materials Introduces Conductive Adhesive
Delaware, OH — Engineered Materi- als Systems has introduced a new conductive adhesive for die attach applications with small-to-medium
1 NPM-VF odd-form placement system.
bowl feeders to stackable stick, through-hole, vac- uum-formed/JEDEC trays, and tape feeders up to 104 mm (4.1 in.). Odd-form automation requires more than
placement, and the NPM-VF integrates an active, under-board clinch, which traverses the population area. The company’s through-hole technology and incorporated active clinch system secures various through-hole lead diameters at multiple rotations. When it’s not required, the clinch doubles as local-
ized board support for snap-in/press-fit components. Contact: Panasonic Factory Solutions Compa-
ny of America, 1701 Golf Road, Suite 3-1200, Rolling Meadows, IL 60008 % 847-637-9600 E-mail:
PFSAmarketing@us.panasonic.com Web:
www.panasoniccfa.com
Page 25
1 Conductive die attach adhesive.
sized die. The EMS-561-338 is stress- absorbing to withstand the rigors of thermal cycling and cures in less than a minute at 150°C (302°F). The material demonstrates excellent con- ductive stability and can be applied by stencil printing or by needle dis- pensing. The company also works with customers to develop, define and create engineered material solu- tions for specific needs. The 561-338 conductive die at-
tach adhesive is the latest addition to the company’s full line of conductive adhesives for circuit assembly appli- cations. Engineered Materials Sys- tems focuses on creating electronic materials for the semiconductor, cir- cuit assembly, photovoltaic, printer head, camera module, disk drive, and
photonics assembly markets. Contact: Engineered Materials
Systems, Inc., 100 Innovation Court,
Delaware, OH 43015 % 740-362-4444 fax: 740-362-4433 Web:
www.emsadhesives.com
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