RF Electronics ♦ news digest
performance and design cycles and a reduction in BOM count that improves manufacturing efficiency.
The combination of the MMPA and Band 2 and Band 5 TRITIUM modules offers a flexible and simplified RF solution that can reduce mobile device engineering and development time.
TriQuint will highlight these platform solutions at the telecommunications industry’s largest annual gathering, GSMA Mobile World Congress, in Barcelona, Spain 14 - 17 February, 2011.
The firm’s CuFlip technology enables a compact 5.0 x 7.5mm footprint in the TQM7M9023. The MMPA integrates Quad-band GSM/EDGE functionality with WCDMA Bands 1 & 8 into a single package. Building on TriQuint’s leadership in the EDGE market, the MMPA can provide improved system performance and lower overall cost by replacing three discrete power amplifier modules and associated matching components.
The TQM7M9023 is a fully integrated MMPA and includes a GSM/EDGE power amplifier, WCDMA power amplifiers, high performance coupler, regulatory circuitry and matching components. It does not require an external DC/DC converter or complicated band switches, thus providing customers the best RF performance at maximum output and backed-off power levels for both data and voice applications, respectively.
The TQM7M9023 is now sampling and is expected to ramp into production by mid 2011.
The Band 2 TQM61605x and Band 5 TQM66605x TRITIUM PA Duplexers were designed to support the MMPA. TriQuint integrates high-performance BAW and SAW duplexer capabilities with low current consumption power amplifiers to customize traditional components for optimal performance.
The latest TRITIUM PA-Duplexers are approximately 50% smaller in size compared to the TRITIUM family that shipped over 200 million units in 2010. The modules allow multi-mode CDMA and WCDMA operation, enabling customers to leverage a single product across multiple platforms.
Each module contains a Flip Chip BiHEMT power amplifier die, achieving current consumption for maximum talk-time and thermal efficiency critical
for smartphone applications. The new TRITIUM PA-Duplexers will be sampling in the second half of 2011.
TriQuint Latest Broadband Solution Used in ST-Ericsson Platforms
TriQuint’s new WCDMA module enables new level of efficiency for longer mobile device battery life.
TriQuint Semiconductor, an RF front-end product manufacturer and foundry services provider, has unveiled a new member to its TRIUMF Module Family, the TQM7M9070.
Its advanced integration technology offers 3G designers building global smartphones and other mobile devices a streamlined RF footprint, through support for multiple modulations and multiple bands in one module. This broadband power amplifier module aligns with ST-Ericsson’s MM5730 and U5500 platforms.
In addition to reducing the component count, the featured power amplifier provides WCDMA/ HSUPA modulation over multiple bands by enabling outstanding Power Added Efficiency (PAE) without requiring a DC to DC converter. Power amplifier PAE is a critical contributor to longer battery life and greatly enhances the user experience of mobile devices.
In close collaboration with ST-Ericsson, all system- critical parameters will be verified as a platform reference design. “Customers can be assured the solution has been tested and works together to deliver a new level of power added efficiency,” said Tim Dunn, VP and General Manager of Mobile Devices at TriQuint.
“Given the real estate limitations in today’s devices, our new broadband power amplifier module offers a competitive advantage to our customers since it reduces the transmit area by more than 20%, and optimizes the electrical RF performance for each unique device,” he continued.
TriQuint’s broadband power amplifier supports WCDMA high bands 1, 2 & 4, and WCDMA low
January / February 2011
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