news digest ♦ LEDs
improvements for LED production at decreased cost per lumen.”
KLARITY LED: Defect Analysis and Data Management System for LED Yield Enhancement
of smaller die sizes that inhibit manual inspection, and for larger die sizes that require rapid corrective action to limit costly materials risk. It allows defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e. front- and back-end) of LED wafers.
The KLARITY LED software has automated in-line scan analysis for the entire fabwide manufacturing process. Designed to help LED device makers accelerate yield learning cycles and prompt immediate corrective action, KLARITY LED has automated analysis (intelligent SPC excursion and baseline monitor). This should support faster time- to-corrective action with automated knowledge- based reports, extensive drill-down capability and practical decision flow analysis.
The system can provide root cause analysis for defect sources and offers flexible graphical analysis of common and adder defects. It also identifies spatial signatures, tracks dynamic signature count and leverages stack wafer signatures to identify the root cause for faster detection and corrective action.
Providing wafer map point and click access, as well as an image gallery, the KLARITY LED allows device makers to validate classification and defect transition commonality identification and rapidly generate automated reports. The software can also identify repeat defects across an individual wafer, as well as from wafer to wafer.
ICOS WI-2220: Scalable Defect Inspection and Improved Cost of Ownership in LED Process Control
The ICOS WI-2220 detects critical defects whilst minimizing noise introduced by process variations and aids in die misclassification detection at a high inspection speed. The new system also offers low-image distortion, advanced optic filtering, rule-based binning (RBB) for real-time auto defect classification, and advanced metrology capabilities at high inspection throughput as a result of new proprietary inspection and data processing technology. This should enable increased yields in the manufacturing process through yield base line improvement, excursion control as well as improved dispositioning in outgoing quality control inspections.
The ICOS WI-2220 is upgradable to the ICOS WI- 2250 for flexible configurations.
KLA Launches Candela 8620 Inspection System for HBLEDs
The tool is designed to enable improved substrate and MOCVD process control yield for high brightness LEDs.
KLA-Tencor Corporation, a supplier of process control and yield management solutions for the semiconductor and related industries, has introduced its new Candela 8620 substrate and epitaxy (epi) wafer inspection system.
Designed for high brightness light emitting diode (HBLED) manufacturers, the Candela 8620 provides automated defect inspection for LED materials such as gallium nitride, sapphire, and silicon carbide. This should enable enhanced quality control of both opaque and transparent substrates, faster time-to-root cause, and improved Metal Organic Chemical Vapor Deposition (MOCVD) reactor uptime and yield.
The ICOS WI-2220, provides automated inspection 56
www.compoundsemiconductor.net January / February 2011
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