LEDs ♦ news digest
defects in MOCVD processes, including hexagonal pits and bumps leading to electrical failure, and epi cracks which can adversely impact field reliability are also highlighted.
LED substrate and epitaxy layers pose significant inspection challenges due to high levels of background signal and nuisance defects. The Candela 8620’s imaging and detection system is optimized to enhance the signal from relevant defects-of-interest while suppressing background noise. Aided by its multi-channel detection optics, the system additionally allows high purity classification of such defects, thereby allowing comprehensive statistical process control of critical MOCVD processes.
With its proprietary optical design and detection technology, the Candela 8620 detects and classifies sub-micron defects that are not consistently identified by current inspection methods, thereby enabling a production line monitor for these yield- limiting defects.
According to industry sources, as HBLED manufacturers transition production to larger wafer sizes and introduce new patterned sapphire substrate (PSS) processes, the economic impact of resulting process-induced defects is estimated at millions of dollars in lost product revenue per year, and MOCVD epi process issues may result in as much as 40 % of overall defect-induced yield loss.
“The enhanced performance of KLA-Tencor’s Candela 8620 is an important part of our yield and cost reduction efforts,” commented Iain Black, VP of manufacturing engineering and innovation at Philips Lumileds, an early adopter of the Candela 8620 system. “The system has been an important element in accelerating our process ramp as we transition to 150 mm substrates and is allowing us to select sapphire vendors with the highest quality.”
Defects from substrate and epi processes impact device performance, yield and field reliability. The Candela 8620 can detect substrate defects such as micro-scratches and micro-cracks which can create epi process defects and directly impact LED yield and reliability.
It can also detect defect sources from lithography and etch processes for patterned sapphire such as missing bumps and resist voids, resulting in epi defects or reduced lumen output. Macro- and micro-
“KLA-Tencor is leveraging more than three decades of expertise in semiconductor process control to benefit customers in emerging markets like HBLED,” said Jeff Donnelly, group VP of Growth and Emerging Markets at KLA-Tencor. “Recently, several HBLED manufacturers have installed the Candela 8620 system, and the system’s proven ability to identify hard-to-detect defects allows customers to realize higher substrate quality and maximize return on MOCVD investment.”
Yole & SEMI to Summarize HB-LED Progress in Webinars
The webinar series, to be held on 3 dates during February and March 2011 is called “HB-LED Manufacturing Growth & Transition-Challenges, Solutions & Opportunities”
SEMI & Yole Développement have teamed up to present a 3-part webinar series on HB-LED manufacturing. It will take place on February 9, March 2, and March 23 at 10:00am Pacific (1:00pm Eastern Time).
The collaboration anticipates this series to be the most comprehensive overview of LED manufacturing ever presented. The series, “HB-LED Manufacturing Growth & Transition: Challenges, Solutions and Opportunities”, will cover materials, front end manufacturing and assembly/packaging/ test operations in three sessions.
January / February 2011
www.compoundsemiconductor.net 57
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136 |
Page 137 |
Page 138 |
Page 139 |
Page 140 |
Page 141 |
Page 142 |
Page 143 |
Page 144 |
Page 145 |
Page 146 |
Page 147 |
Page 148 |
Page 149 |
Page 150 |
Page 151 |
Page 152 |
Page 153 |
Page 154 |
Page 155 |
Page 156 |
Page 157 |
Page 158 |
Page 159 |
Page 160 |
Page 161 |
Page 162 |
Page 163 |
Page 164 |
Page 165 |
Page 166 |
Page 167 |
Page 168 |
Page 169 |
Page 170 |
Page 171 |
Page 172 |
Page 173 |
Page 174 |
Page 175 |
Page 176