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Page 84


hi-TeCh evenTS www.us- tech.com


Munich, Germany — Semiconductors are indispensable. These tiny chips are the most important technology of the modern world — the key compo- nents of all electrical systems. From November 12 to 15, pro-


productronica 2019: Semiconductors at the Core of Electronics Production


time. According to Gartner, they gen-


ductronica, together with SEMICON Europa, will organize the largest microelectronic exhibition in Europe at the Messe München fair grounds with innovative solutions and prod- ucts from the complete supply chain. Since 1978, semiconductors


have been growing worldwide at an average rate of 8.9 percent per year. In 2018, industry experts from IC Insights counted more than a trillion ICs, sensors and optical and discrete components (O-S-D) for the first


erated $476.7 billion in sales revenue — an increase of 13.4 percent over 2017. Almost 35 percent of this was in the microchips area. According to World Semiconductor Trade Statistics (WSTS), this year’s figure is expected to collapse by more than thirty per- cent, pulling the semiconductor mar- ket into the red by 12 percent. Europe, in contrast to America,


Japan and the Asia-Pacific region, was comparatively less affected by this shift, with a decline of 3.1 per- cent. However, a global increase of 5.4 percent is expected as early as 2020.


Regardless of this, the rapid


IWLPC Program Announced and Registration Opened


Minneapolis, MN — The Surface Mount Technology Association (SMTA) and Chip Scale Review have announced the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 22 to 24, 2019, at the DoubleTree by Hilton Hotel in San Jose, California. The technical sessions on


Tuesday and Wednesday are organ- ized into three tracks: wafer-level packaging, 3D packaging, and advanced manufacturing and test. The wafer-level packaging (WLP) track offers sessions on materials, reliability, metrology, processing, and new technology, such as fan-out WLP. The 3D packaging track includes ses- sions on design, test, characterization,


wafer bonding, chip stacking, and pro- cessing for fan-out. The advanced manufacturing and test track will offer sessions on process materials, equipment, inspec tion, and more. Packaging technology experts


John Lau, Ph.D., Unimicron Technol - ogy, John Hunt, ASE (US) Inc., Gilad Sharon, Ph.D., ANSYS, and Jeff Gotro, Ph.D., InnoCentrix, LLC, are scheduled to lead half-day workshops on Thursday, October 24, 2019. Registration for IWLPC is now avail- able online. Discounted rates are available for conference registrations made on or before September 27, 2019. Contact: SMTA, 6600 City West


Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952- 926-1819 Web: www.iwlpc.com r


2020 EDITORIAL AND TRADEShOW CALENDAR


ISSUE Jan/Feb March April/May EDITORIAL


Assembly & Automation APEX PP


ATX/MD&M West PP Test & Inspection


Manufacturing Services NEPCON China PP SMTconnect/PCIM PP EDS PP


June July August


Components & Distribution ATX/MD&M East PP


Production & Packaging SEMICON/ES Design West


SMT & Production Nepcon South China PP


September Assembly & Automation SMTAI PP


DesignCon APEX


ATX/MD&M West APEC


BIOMEDevice Nepcon China SMTconnect/PCIM EDS


Wire Processing Tech ATX/MD&M East


SHOW DATE


1/28-30 2/4-6


2/11-13 3/17-19


4/22-23 4/22-24 5/5-7


5/12-15 5/13-14 6/9-11


SEMICON/ES Design West 7/21-23 Nepcon South China


The Battery Show PCB West IMTS SMTAI IMAPS


October


PCB & Components electronica PP


Nov/Dec Test & Inspection PP= Product Preview


MD&M Minneapolis SMT Guadalajara The Assembly Show electronica


BIOMEDevice ATX/MD&M West


8/25-27


9/8-10 9/8-10 9/15-17 9/30-10/1 10/5-7


10/21-22 10/21-22 10/27-29 11/10-12 12/2-3


2/9-11/2021 LOCATION


Santa Clara, CA San Diego, CA Anaheim, CA


New Orleans, LA Boston, MA


Shanghai, China Nuremburg, Germany Las Vegas, NV Milwaukee, WI New York, NY


San Francisco, CA Shenzhen, China Novi, MI


Santa Clara, CA Chicago, IL Rosemont, IL San Diego, CA


Minneapolis, MN Guadalajara, Mexico Rosemont, IL Munich, Germany


San Jose, CA Anaheim, CA


changes in technology in highly com- plex and machine-intensive IC pro- duction will see an increase in demand for new equipment. For example, analysts from “The Insight Partners” estimate sales revenue from manufacturers of plant and machinery for semiconductor produc- tion last year at $62.1 billion. With an average annual growth rate (CAGR) of 5.2 percent, total income of $101.6 billion can be expected by 2027. Most of this will be generated by wafer production, followed by test equipment. However, the semiconductor


industry is not only stretched to its limits from a physical aspect, but also in financial terms. Factories for manufacturing 7 nm chips cost many billions of dollars, also due to the changeover from lithography pro - cesses to extremely shortwave ultra- violet light (EUV). This technology is also regarded


August, 2019


as a prime example of European col- laboration. ZEISS Semiconductor Manufacturing Technology (SMT) and the world’s biggest supplier of lithography systems, ASML in the Netherlands, have been making sig- nificant contributions to this for many years. However, the European semiconductor industry is under enormous pressure. In the 1990s, its share of worldwide semiconductor production was more than 15 per- cent, but last year, this had fallen to less than ten percent. Cross-country funded projects,


such as “Electronic Components and Systems for European Leadership (ECSEL),” have been established to stop this decline and drive the devel- opment and production of semicon- ductors and other electronic compo- nents in Europe. Within this scope, Fraunhofer IPMS and the research hub for nano-


Continued on next page


Trade Show Calendar MORE SHOWS: www.topline.tv/tradeshows.cfm


August 11-15, 2019, SPIE Optics + Photonics. * San Diego Convention Center, San Diego, CA 92101. Contact: SPIE, P.O. Box 10, Bellingham, WA 98227 % 360-676-3290 E-mail: customerservice@spie.org Web: www.spie.org


August 28-30, 2019, NEPCON Asia. * Shenzhen Convention & Exhibition Center, Shenzhen, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail: tim.wang@reedexpo.com.cn Web: www.nepconsouthchina.com


Sept 10, 2019, PCB West.*Santa Clara Convention Center, Santa Clara, CA. Contact: UP Media Group, Inc., P.O. Box 470, Canton, GA 30169 % 678-234-9859 Web: www.pcbwest.com


Sept 10-12, 2019, The Battery Show. * Suburban Collection Showplace, Novi, MI. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: https://thebatteryshow.com


Sept 15-20, 2019, EOS/ESD Symposium. * Riverside Convention Center, Riverside, CA. Contact: EOS/ESD Association, Inc., 7900 Turin Road, Building 3, Rome, NY 13440 % 315-339-6937 Web: www.esda.org


Sept 24-25, 2019, SMTA International. * Donald Stephens Convention Center, Rosemont, IL. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 Web: www.smta.org


Sept 24-26, 2019, WESTEC. * Long Beach Convention Center, Long Beach, CA. Contact: WESTEC, 1,000 Town Center, Suite 1910, Southfield, MI 48075 % 800-733-4763 E-mail: exposales@sme.org Web: http://westeconline.com


Sept 25-26, 2019, New England Design-2-Part Show. * Royal Plaza Trade Center, Marlborough, MA. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712 % 800-225-4535 Web: www.d2p.com


Oct 1-3, 2019, iMAPS. * Hynes Convention Center, Boston, MA. Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000 Web: www.imaps.org/imaps2019


Oct 9-10, 2019, Southern California Design-2-Part Show. * Pasadena Convention Center, Pasadena, CA. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712 % 800-225-4535 Web: www.d2p.com


Oct 22-24, 2019, IWLPC. * DoubleTree by Hilton San Jose, San Jose, CA. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 Web: www.iwlpc.com


Oct 23-24, 2019, MD&M Minneapolis. * Minneapolis Convention Center, Minneapolis, MN. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: https://mdmminn.mddionline.com


Nov 12-15, 2019, productronica. * Messe München, Munich, Germany. Contact: Messe München GmbH, Messegelande, 81823 Munich, Germany % +49-89-949-11438 fax: +49-89-949-11439 E-mail: info@productronica.com Web: www.productronica.com


Nov 12-15, 2019, SEMICON Europa. * Messe München, Munich, Germany. Contact: SEMI Europe, Helmholtzstrasse 2-9, House D, 3rd Floor, S10587 Berlin, Germany % +49-30-3030-8077-0 E-mail: semiconeuropa@semi.org Web: www.semiconeuropa.org


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