August, 2019
www.us-tech.com Viscom Offers Deep 3D Capability
Duluth, GA — Viscom AG has added a new 3D bond inspection system to its product lineup. The company thus expands its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technol- ogy to include bond inspection capability. The S6056BO bond system with state-of-the- art camera technology (XM and XMplus) meets the increased requirements placed on wirebond inspection in the e-mobility sector, as well as those placed on other safety-relevant high-performance electronics.
Complementary to the company’s wide range of solutions, Viscom’s premium S3088 ultra gold 3D AOI system offers genuine solder joint measure- ment. It contains eight angled cameras to provide precise 3D measurement analysis, enabling optimal FPY results.
The S3088 conformal coating inspection (CCI) system is designed for simultaneous SMD inspection and conformal coating inspection, meeting a growing need in the consumer electronics sector. Defects, cracks, blisters, cavities, and paste smearing on the PCB are reli- ably detected using UV light. The layer thickness can be measured at multiple points using 3D spot measurement. The X7056-II X-ray system inspects electronic components specifi- cally for concealed solder joints or blow holes (voids) in solder joints, or materi- al defects at an ultra-fast handling speed of down to four seconds. 3D reconstruction with the X7056-II is
Rehm Offers Wide Range of Convection Soldering Technology
Roswell, GA — Rehm is now offering a range of convection soldering tech- nology, including the VisionXC sys- tem. This system is particularly suit- able for small and medium batch sizes, due to its compactness.
based on planar CT. For complex overlaps, which are virtually the rule with double-sided PCBs, leverag- ing its superb 3D inspection makes all significant features sharply visible in clear slice images to enable precise evaluations — even with shadowing caused by components or on multilayer boards. The X8011-II PCB 3D MXI system by Viscom provides universal, manual X-ray inspection.
Flexible, interchangeable modules enable specimen handling for prototype, random sampling and small series inspection. The Viscom Quality Uplink can be used for the offline X-ray system. By linking the inspection results from SPI, AOI, AXI and MXI, this function provides simplified classification and effec- tive process control.
Viscom offers 3D SPI, AOI, AXI/MXI, 3D bond inspection, and CCI systems.
Computer-based verification of defects already assists employees in preventing pseudo- errors, increasing overall process quality. AI and deep learning will play an increasingly important role in Viscom’s development future. Contact: Viscom Inc., 1775 Breckinridge Parkway, Suite 500, Duluth, GA 30096 % 678-966-9835 fax: 678-966-9828 E-mail:
info@viscomusa.com Web:
www.viscomusa.com
See at NEPCON Asia, Booth 1G45
Page 63
VisionXC convection soldering system.
Rehm is a technology and inno- vation leader in the state-of-the-art, cost-effective manufacturing of elec- tronic assembly groups and specializes in thermal system solutions for the electronics and photovoltaics industry. The company is a globally active manufacturer of reflow soldering sys- tems using convection, condensation or vacuum, drying and coating sys- tems, functional test systems, equip- ment for the metallization of solar cells and numerous customized sys- tems. Rehm has a presence in all key growth markets and is able to imple- ment innovative production solutions that set new standards. Contact: Rehm Thermal Systems, LLC, 3080 Northfield Place, Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 E-mail:
c.kramer@
rehm-group.com Web:
www.rehm-group.com
See at NEPCON Asia, Booth 1J55
See at NEPCON Asia, Booth 1J45
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