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August, 2019
Integrated Passive Components Simplify Signal Conditioning in Small Packages
By Jeff Elliott
the need to increase the reliability of single condi- tioning in RF circuits, such as filtering, impedance matching, differential to single-ended conversion, and coupling. IPCs are essentially electronic subsystems
I
that combine multiple discrete passive compo- nents into a single surface mounted device. Manufactured using low-temperature co-fired ceramic (LTCC) technology that allows the pas- sive components to be layered “three-dimension- ally,” IPCs deliver the same functionality as 10 to 40 individual components, while dramatically reducing the board space required. With this approach, the entire frontend
between the RF chipset and the antenna can be manufactured in a single, ultra-low profile package that is less than 20 percent the total size of the same circuit made up of of discrete components. “If you were to look at the circuit from
above, you would only see three chips: the RF wireless chip, the IPC and the antenna,” explains Manuel Carmona of Johanson Technology, a leader in high-frequency ceramic components including chip antennas, High Q capac- itors and EMI chip filters. “The design is very clean and really small. You can make the overall PCB size much smaller using IPCs, while maintaining high wireless performance.” Industries already adopting IPC technology include automotive, medical, mobile electronics and “smart” wearables. For customers less concerned with board
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IPCs can simplify signal conditioning in
packages that are up to 20 percent smaller than discrete components.
“A lot of the variability of ‘solo’ surface-
mounted components is due to the individual vari- ance of each component. When you multiple that by 10 to 20 components, you just need one weak link in the RF chain for the entire frontend to fail,” says Carmona.
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ntegrated passive components (IPCs) are attracting increasing interest, due to the miniaturization of wireless devices, as well as
space or overall size, IPCs deliver another signifi- cant benefit — greater reliability. By creating a lit- eral circuit within a small LTCC package, variabil- ity and potential points-of-failure are all but elim- inated when compared to mounting many discrete components. A single integrated package of match- ing components also all but ensures compliance with FCC or ETSI requirements.
Carmona also says that IPCs are available for
almost any type of passive circuit, including low- and high-pass filters, diplexers, triplexers, imped- ance matched baluns, balun-filters, band pass fil- ters, couplers, and other custom signal condition- ing circuits.
LTCC Technology The process to manufacture IPCs is simi-
lar to the technology already used to create multilayer SMD component parts, such as capacitors and inductors. However, low-temper- ature co-fired ceramic (LTCC) manufacturing allows circuits to be embedded in as many as 40 separate layers in a three-dimensional package that is still very low profile. Using this manufacturing process,
Johanson Technology has developed a line of small, highly reliable IPCs for RF systems manu- factured with a proprietary LTCC (low tempera- ture co-fired ceramic) process. These components operate over several bands from 300 MHz to 10 GHz covering cellular, DECT, WLAN, Bluetooth, 802.11 (a, b and g) and GPS applications. Each integrated package is thoroughly 100 percent RF-tested to ensure all the components
are working properly and are integrated together. “Because of the LTCC manufacturing process
is extremely precise and repeatable, we can stay within the manufacturing limits of alignment, variations, and so forth, so you get really consis- tent, robust, RF circuitry,” says Carmona. As a result, Johanson Technology is able to guarantee the IPC is a passive subsystem that is
Continued on next page
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